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1. 发明申请

US20010009118A1 Method of producing alloy powders, alloy powders obtained by said method, and products applying said powders 失效
标题翻译：制备合金粉末的方法，通过所述方法获得的合金粉末和应用所述粉末的产品
公开(公告)号：US20010009118A1
公开(公告)日：2001-07-26
申请号：US09759350
申请日：2001-01-16
申请人： Sumitomo Electric Industries, Ltd. and Sumitomo Electric Fine Polymer, Inc.
发明人： Akihisa Hosoe , Shinji Inazawa , Masatoshi Majima , Katsuya Yamada , Hiroshi Okazaki , Souji Nishikawa , Toshio Shimotsuji
IPC分类号： B22F001/00 , B22F009/06
CPC分类号： B82Y25/00 , B22F9/24 , B22F2998/00 , H01F1/0063 , H01F1/14733 , H01F1/14758 , B22F1/0018
摘要： This invention aims at providing a method of obtaining fine alloy powders, which are extremely small in particle size, high in purity, and uniform in composition, providing fine alloy powders obtained by this method, and providing molding materials, slurries, and electromagnetic shielding materials, which use these fine alloy powders. This invention provides a fine alloy powder production method, which is characterized in that after performing the process of mixing at least a trivalent titanium compound and a complexing agent, which binds with the trivalent titanium ion, in an aqueous solution containing two or more types of metal ion, the two or more types of metal are made to deposit simultaneously. This invention also provides fine alloy powders, which are obtained by the above-described method, that are 1 to 100 nm in particle size, and preferably exhibit the characteristics of soft magnetic material, and molding materials, slurries, and electromagnetic shielding materials, produced by dispersing an abovementioned fine alloy powder in a resin.
摘要翻译：本发明的目的在于提供一种获得细小的合金粉末的方法，其粒径非常小，纯度高，组成均匀，提供通过该方法获得的细小合金粉末，并提供成型材料，浆料和电磁屏蔽材料，其使用这些细合金粉末。本发明提供一种微细合金粉末的制造方法，其特征在于，在将含有三价钛离子的至少三价钛化合物和络合剂进行混合后，在含有两种以上的金属离子，使两种或更多种金属同时沉积。本发明还提供了通过上述方法获得的细小的合金粉末，其粒径为1〜100nm，优选表现出软磁性材料的特性，以及成型材料，浆料和电磁屏蔽材料，通过将上述细合金粉末分散在树脂中。

2. 发明申请

US20040058138A1 Board for printed wiring 失效
标题翻译：印刷线路板
公开(公告)号：US20040058138A1
公开(公告)日：2004-03-25
申请号：US10669018
申请日：2003-09-24
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD
发明人： Shinji Inazawa , Hiroshi Takada , Akihisa Hosoe , Kouji Nitta
IPC分类号： B32B003/00
CPC分类号： H05K1/0233 , Y10T428/24917
摘要： A board for printed wiring comprises an electromagnetic wave absorbing laminate (EM) provided on a surface of a substrate (1) with the intervention of an adhesive layer (2) of a metal oxide, the electromagnetic wave absorbing laminate (EM) comprising: (a) a magnetic layer (3) comprising a plurality of magnetic particles (31) having an average particle diameter of 1 to 150 nm and isolated from each other by an electrically insulative material (32); and (b) an electrically insulative layer (4), being alternately stacked in a multi-layer structure, the board for printed wiring has a reduced thickness and an improved electromagnetic wave absorbing characteristic in a high frequency band of not lower than gigahertz, as compared with a conventional one which has an electromagnetic wave absorbing layer of a composite material including fine magnetic particles simply dispersed in a resin binder.
摘要翻译：用于印刷布线的板包括设置在基板（1）的表面上的电磁波吸收叠层（EM），介于金属氧化物的粘合剂层（2）之间，所述电磁波吸收叠层体（EM）包括： a）包含平均粒径为1〜150nm并通过电绝缘材料（32）彼此隔离的多个磁性颗粒（31）的磁性层（3）; 和（b）以多层结构交替堆叠的电绝缘层（4），印刷布线板具有不低于千兆赫兹的高频带中的厚度减小和电磁波吸收特性的改善，如与传统的具有简单分散在树脂粘合剂中的复合材料的电磁波吸收层相比，其具有细小的磁性颗粒。

3. 发明申请

US20030094076A1 Method of producing alloy powders, alloy powders obtained by said method and products applying said powders 审中-公开
标题翻译：制备合金粉末的方法，通过所述方法获得的合金粉末和应用所述粉末的产品
公开(公告)号：US20030094076A1
公开(公告)日：2003-05-22
申请号：US10340613
申请日：2003-01-13
申请人： Sumitomo Electric Industries, Ltd.
发明人： Akihisa Hosoe , Shinji Inazawa , Masatoshi Majima , Katsuya Yamada , Hiroshi Okazaki , Souji Nishikawa , Toshio Shimotsuji
IPC分类号： C22C001/05
CPC分类号： B82Y25/00 , B22F9/24 , B22F2998/00 , H01F1/0063 , H01F1/14733 , H01F1/14758 , B22F1/0018
摘要： This invention aims at providing a method of obtaining fine alloy powders, which are extremely small in particle size, high in purity, and uniform in composition, providing fine alloy powders obtained by this method, and providing molding materials, slurries, and electromagnetic shielding materials, which use these fine alloy powders. This invention provides a fine alloy powder production method, which is characterized in that after performing the process of mixing at least a trivalent titanium compound and a complexing agent, which binds with the trivalent titanium ion, in an aqueous solution containing two or more types of metal ion, the two or more types of metal are made to deposit simultaneously. This invention also provides fine alloy powders, which are obtained by the above-described method, that are 1 to 100 nm in particle size, and preferably exhibit the characteristics of soft magnetic material, and molding materials, slurries, and electromagnetic shielding materials, produced by dispersing an abovementioned fine alloy powder in a resin.
摘要翻译：本发明的目的在于提供一种获得细小的合金粉末的方法，其粒径非常小，纯度高，组成均匀，提供通过该方法获得的细小合金粉末，并提供成型材料，浆料和电磁屏蔽材料，其使用这些细合金粉末。本发明提供一种微细合金粉末的制造方法，其特征在于，在将含有三价钛离子的至少三价钛化合物和络合剂进行混合后，在含有两种以上的金属离子，使两种或更多种金属同时沉积。本发明还提供了通过上述方法获得的细小的合金粉末，其粒径为1〜100nm，优选表现出软磁性材料的特性，以及成型材料，浆料和电磁屏蔽材料，通过将上述细合金粉末分散在树脂中。

4. 发明申请

US20020018934A1 Modified graphite particles and battery using the same 失效
标题翻译：改性石墨颗粒和电池使用相同
公开(公告)号：US20020018934A1
公开(公告)日：2002-02-14
申请号：US09897118
申请日：2001-07-03
申请人： Sumitomo Electric Industries, Ltd.
发明人： Masatoshi Majima , Shinji Inazawa , Satoshi Ujiie , Eriko Yagasaki , Kazuharu Danjo , Shinichi Homma
IPC分类号： H01M004/58 , C01B031/04
CPC分类号： H01M4/587 , C01B32/20 , C01P2004/22 , C01P2004/54 , C01P2004/61 , C01P2006/12 , H01M4/133 , H01M2004/021
摘要： Modified graphite particles are described, which have an almost circular and tabular shape, an average particle size Ap of 12 to 18 nullm, a BET specific surface area Ss of 4 to 6 m2/g, and a BET specific surface area to average particle size ratio, Ss/Ap, of 0.35 or less, and which are obtained by treating tabular particles of lumpy or flaky graphite to break or slightly fold the periphery of said tabular particles to increase the degree of circularity. A battery having the modified graphite particles as an anode active material is also described.
摘要翻译：描述了具有几乎圆形和平板状的改性石墨颗粒，平均粒度Ap为12至18μm，BET比表面积Ss为4至6m 2 / g，BET比表面积与平均粒径比例Ss / Ap为0.35以下，通过处理片状或片状石墨的片状颗粒而得到，以破坏或略微折叠所述片状颗粒的周边以增加圆形度。还描述了具有改性石墨颗粒作为负极活性材料的电池。

5. 发明申请

US20040262163A1 Molten salt bath for electroforming and method of manufacturing metal product using the same 审中-公开
标题翻译：用于电铸的熔融盐浴及使用其制造金属制品的方法
公开(公告)号：US20040262163A1
公开(公告)日：2004-12-30
申请号：US10776264
申请日：2004-02-12
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Koji Nitta , Shinji Inazawa , Tsuyoshi Haga , Yasuhiko Ito , Toshiyuki Nohira , Tokujiro Nishikiori
IPC分类号： C25D001/00
CPC分类号： C25D3/66
摘要： A molten salt bath for electroforming containing lithium bromide, cesium bromide and a halide of an alkali metal and/or a halide of an alkaline-earth metal is provided. In addition, a method of manufacturing a metal product including the steps of: forming a resist pattern on a conductive substrate and exposing a portion of the conductive substrate; immersing the conductive substrate having the resist pattern formed into the molten salt bath for electroforming, the molten salt bath for electroforming containing a metal to be precipitated and/or a compound of a metal to be precipitated; and precipitating the metal at a portion where the conductive substrate is exposed, is provided. Further, a molten salt bath for electroforming obtained by mixing lithium bromide, cesium bromide, and a halide of an alkali metal and/or a halide of an alkaline-earth metal is provided.

6. 发明申请

US20040103813A1 Paste for electroless plating and method of producing metallic structured body, micrometallic component, and conductor circuit using the paste 审中-公开
标题翻译：用于无电解电镀的浆料和使用该糊料的金属结构体的制造方法，微金属组件和导体电路
公开(公告)号：US20040103813A1
公开(公告)日：2004-06-03
申请号：US10703533
申请日：2003-11-10
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Jun Yorita , Masatoshi Majima , Shinji Inazawa
IPC分类号： C09D005/00
CPC分类号： C23C18/1605 , C23C18/1646 , C23C18/1653 , C23C18/1657 , C23C18/1831 , C23C18/36 , C25D1/003 , H05K3/182 , H05K3/184 , H05K3/202 , H05K2203/0557 , H05K2203/0709
摘要： A paste for electroless plating 1null comprises (a) a minute catalytic powder 11 at least the surface of which is formed by a catalytic metal or a metal capable of substituting for the catalytic metal and (b) a vehicle 10 in which the catalytic powder 11 is dispersed. The paste is used to form a film. A method that plates the film by electroless plating produces a metallic structured body, a micrometallic component, and a conductor circuit, all having a uniform crystal structure unattainable by electroplating using a conductive paste.
摘要翻译：用于化学镀1'的糊料包括（a）至少其表面由催化金属或能够代替催化金属的金属形成的微小催化粉末11，和（b）载体10，其中催化粉末 11分散。该糊剂用于形成膜。通过无电解电镀来平板化薄膜的方法产生金属结构体，微金属组件和导体电路，所有这些都具有通过使用导电浆电镀不能得到的均匀晶体结构。

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