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1. 发明授权

US06750425B2 Three-dimensional laser beam machine 失效
标题翻译：三维激光束机
公开(公告)号：US06750425B2
公开(公告)日：2004-06-15
申请号：US10343452
申请日：2003-01-31
申请人： Tomonari Mukae , Masaki Tsukamoto , Hidekazu Sawai
发明人： Tomonari Mukae , Masaki Tsukamoto , Hidekazu Sawai
IPC分类号： B23K2602
CPC分类号： B23K26/0884 , B25J9/163 , B25J17/025 , B25J18/007 , G05B2219/45165
摘要： In a three-dimensional laser beam machine having a head structure in which a processing point is not moved when a rotation axis and an attitude axis are rotated, the machine has: means for storing information of current angles of the rotation axis and the attitude axis, and calculating a nozzle direction vector from the angles; means for, based on the nozzle direction vector, determining angles of a nozzle in a vertical direction and a horizontal direction consisting of a Z-axis of an orthogonal coordinate system; and means for displaying the determined nozzle angles.
摘要翻译：在具有在旋转轴和姿态轴旋转时处理点不移动的头结构的三维激光束机器中，机器具有：用于存储旋转轴和姿态轴的当前角度的信息的装置并且从角度计算喷嘴方向矢量; 用于基于喷嘴方向矢量确定喷嘴在垂直方向上的角度和由正交坐标系的Z轴组成的水平方向的装置; 以及用于显示确定的喷嘴角度的装置。

2. 发明授权

US06614002B2 Laser machining head 有权
公开(公告)号：US06614002B2
公开(公告)日：2003-09-02
申请号：US10000401
申请日：2001-12-04
申请人： Ludwig Weber
发明人： Ludwig Weber
IPC分类号： B23K2602
CPC分类号： B23K26/034 , B23K26/032 , B23K26/1462 , B23K26/707
摘要： A laser machining head for machining a workpiece by a laser beam having a housing which has an inlet opening and an outlet opening between which a passage is constructed for the laser beam through which is led a working beam pathway; focusing optics for focusing the laser beam into a working focus which is located outside the housing at a distance from the outlet opening; a sensor arrangement, and a beam deflecting device. In order to provide a laser beam machining head which, whilst having fixed and compact external dimensions, enables a simple adaptation of the sensors to the respective machining tasks, the sensor arrangement comprises a sensor module arranged in a side wall of the housing next to the laser beam through passage; and the radiation diverting device directs the radiation, coming from a zone of interaction determined by the working focus, onto sensors of the sensor arrangement so that at least one portion of the radiation can be detected for monitoring the machining of a workpiece.

3. 发明授权

US06433305B1 Method and apparatus for drilling holes with sub-wavelength pitch with laser 失效
公开(公告)号：US06433305B1
公开(公告)日：2002-08-13
申请号：US09747682
申请日：2000-12-26
申请人： Xinbing Liu , Ming Li
发明人： Xinbing Liu , Ming Li
IPC分类号： B23K2602
CPC分类号： B23K26/0624 , B23K26/382 , B23K26/40 , B23K2103/16 , B23K2103/50 , B82Y20/00 , G02B6/1225
摘要： A method of laser machining using an ultra-fast pulse laser is presented. According to the present invention a plurality of holes with a pitch less than the wavelength of the laser are drilled into a material sample. Reliable and reproducible hole drilling is accomplished through an exemplary drilling sequence which applies a number of pulses at a first pulse energy to the surface spaced to avoid laser hardening of the surface for adjacent holes of a first set of holes. Next, the number of pulses is increased or the energy of the laser beam is increased to drill holes that are interstitial to the first set of holes. The exemplary laser machining process may used to produce both one-dimensional and two-dimensional photonic crystals, among other applications.

4. 发明授权

US06333485B1 Method for minimizing sample damage during the ablation of material using a focused ultrashort pulsed beam 失效
标题翻译：使用聚焦超短脉冲光束在材料消融期间最小化样品损伤的方法
公开(公告)号：US06333485B1
公开(公告)日：2001-12-25
申请号：US09210226
申请日：1998-12-11
申请人： Richard Alan Haight , Peter P. Longo , Daniel Peter Morris , Alfred Wagner
发明人： Richard Alan Haight , Peter P. Longo , Daniel Peter Morris , Alfred Wagner
IPC分类号： B23K2602
CPC分类号： G03F1/72 , A61B18/26 , B23K26/0624 , B23K26/066 , B23K26/361 , B23K26/40 , B23K2103/30 , B23K2103/50 , Y10S438/94
摘要： In one aspect the invention provides a method for laser induced breakdown of a material with a pulsed laser beam where the material is characterized by a relationship of fluence breakdown threshold (Fth) versus laser beam pulse width (T) that exhibits an abrupt, rapid, and distinct change or at least a clearly detectable and distinct change in slope at a predetermined laser pulse width value. The method comprises generating a beam of laser pulses in which each pulse has a pulse width equal to or less than the predetermined laser pulse width value. The beam is focused above the surface of a material where laser induced breakdown is desired. The region of least confusion (minimum beam waist or average spot size) is above the surface of the material in which laser induced breakdown is desired since the intensity of the beam falls off in the forward direction, preferably the region of the beam at or within the surface is between the region of least confusion and sufficient to remove material and the minimum intensity necessary for laser induced breakdown of the material to be removed, most preferably the region of minimum intensity is disposed at the surface of the material to be removed. The beam may be used in combination with a mask in the beam path. The beam or mask may be moved in the x, y, and Z directions to produce desired features. The technique can produce features smaller than the spot size and Rayleigh range due to enhanced damage threshold accuracy in the short pulse regime.
摘要翻译：在一个方面，本发明提供了一种用于脉冲激光束的材料的激光诱导击穿的方法，其中材料的特征在于注射击穿阈值（Fth）与激光束脉冲宽度（T）的关系，其显示突然，快速，并且在预定的激光脉冲宽度值处具有明显的变化或至少清楚可检测和明显的斜率变化。该方法包括生成激光脉冲束，其中每个脉冲具有等于或小于预定激光脉冲宽度值的脉冲宽度。光束聚焦在需要激光诱发击穿的材料的表面之上。最小混乱（最小光束腰部或平均光点尺寸）的区域高于激光诱发击穿所需的材料的表面，因为光束的强度在向前方向上脱落，优选地在波束的或在其内的区域表面处于最少混淆的区域之间并且足以去除材料并且要被去除的材料的激光诱发击穿所需的最小强度，最优选地，最小强度的区域设置在要去除的材料的表面上。光束可以与光束路径中的掩模组合使用。光束或掩模可以在x，y和z方向上移动以产生期望的特征。该技术可以产生小于点尺寸和瑞利范围的特征，这是由于在短脉冲状态下增强的损伤阈值精度。

5. 发明授权

US06303903B1 Method and apparatus for determining focus position of a laser 失效
标题翻译：用于确定激光的焦点位置的方法和装置
公开(公告)号：US06303903B1
公开(公告)日：2001-10-16
申请号：US09372121
申请日：1999-08-11
申请人： Xinbing Liu
发明人： Xinbing Liu
IPC分类号： B23K2602
CPC分类号： B23K26/04
摘要： A method and apparatus for positioning a surface of a workpiece for laser machining. A laser beam is focused to a focal point to form a plasma generating a plasma emission. An imaging system is oriented to receive the plasma emission and generate a plasma image. The imaging system is adjusted to focus the plasma image and is then fixed. The laser is then diverted away from the focal point and an illumination source is activated to illuminate the surface of the workpiece. The imaging system generates an image of the surface of the workpiece. The workpiece is adjusted in position toward the focal point until the image of the surface of the workpiece is in focus.
摘要翻译：一种用于定位用于激光加工的工件的表面的方法和装置。将激光束聚焦到焦点以形成产生等离子体发射的等离子体。成像系统被定向为接收等离子体发射并产生等离子体图像。调整成像系统以聚焦等离子体图像，然后固定。然后将激光器从焦点转移离开，并且激活照明源以照射工件的表面。成像系统产生工件表面的图像。工件被调整到朝向焦点的位置，直到工件的表面的图像被聚焦。

6. 发明授权

US06835912B2 Laser cutting machine with two Y-axis drives 失效
标题翻译：带两个Y轴驱动的激光切割机
公开(公告)号：US06835912B2
公开(公告)日：2004-12-28
申请号：US10156886
申请日：2002-05-28
申请人： Peter Leibinger , Thomas Rauser , Leonid Zeygerman
发明人： Peter Leibinger , Thomas Rauser , Leonid Zeygerman
IPC分类号： B23K2602
CPC分类号： B23K26/0884 , B23K26/38 , B23K37/0235 , B23Q1/012 , B23Q1/626
摘要： A tool for machining workpieces by motion of the machining tool relative to the workpiece has a support extending in the X-axis over a work support table and movable in the Y-axis. A machining tool housing is movable on the support in the Y-axis. A portion of the housing containing the machining tool is movable with respect to the mounted portion in the Y-axis within a limited range of motion. A computer control effects operation of drive motors to move the housing along the support and the support along the machining tool table to machine a workpiece supported on said worktable in X and Y axes, and the computer control can also effect operation of another drive motor to rapidly move of the housing portion and machining tool in the Y-axis when the desired length of motion in the Y-axis is within its range of motion.
摘要翻译：通过加工工具相对于工件的运动来加工工件的工具具有在工件支撑台上在X轴上延伸并可在Y轴上移动的支撑件。加工工具壳体可以在Y轴上的支撑件上移动。容纳加工工具的壳体的一部分可在有限的运动范围内相对于Y轴上的安装部分移动。计算机控制对驱动电机进行操作，以沿壳体和支撑沿着加工工具台移动壳体，以对在X轴和Y轴上支撑在所述工作台上的工件进行加工，并且计算机控制还可以实现另一个驱动马达的操作当Y轴的所需运动长度在其运动范围内时，壳体部分和机械加工工具在Y轴上快速移动。

7. 发明授权

US06737607B2 Apparatus for laser cutting a workpiece 失效
公开(公告)号：US06737607B2
公开(公告)日：2004-05-18
申请号：US10195000
申请日：2002-07-12
申请人： Antonios Nicholas , Michael Towler
发明人： Antonios Nicholas , Michael Towler
IPC分类号： B23K2602
CPC分类号： B23K26/032 , B23K26/03 , B23K26/034 , B23K26/0342 , B23K26/389 , B23K26/40 , B23K2103/172 , B23K2103/34 , B23K2103/38 , B23K2103/42 , B23K2103/50 , B29C59/007 , B29C2791/009 , B29L2031/3008
摘要： An apparatus is disclosed for cutting a workpiece. A laser beam is directed at successive points along a workpiece surface to be cut and a sensor emits a sensing beam directed at the same successive points as the cutting beam. A beam combining device receives both the sensor beam and the cutting beam and causes downstream beam segments to be collinear with each other as they impinge the workpiece surface. The cutting is thereby able to be carried out in a single pass, and is precise, repeatable and independent of cutting depth, angle of cutting, scoring patterns, material inconsistency, material color, and surface grain variability.

8. 发明授权

US06717106B2 Laser sintering apparatus 失效
标题翻译：激光烧结设备
公开(公告)号：US06717106B2
公开(公告)日：2004-04-06
申请号：US10236930
申请日：2002-09-09
申请人： Kazuhiko Nagano , Yoji Okazaki
发明人： Kazuhiko Nagano , Yoji Okazaki
IPC分类号： B23K2602
CPC分类号： B23K26/0665 , B23K26/0604 , B23K26/0613 , B23K26/0643 , B23K26/0648 , B29C64/153 , B33Y30/00 , H01S3/067 , H01S3/0941 , H01S3/109 , H01S3/1613 , H01S3/1653 , H01S5/32341
摘要： A laser sintering apparatus for realizing high-speed and high-precision forming. When a first position of an exposure unit is decided by an XY-positioning mechanism, a micromirror of a DMD is turned on and off in accordance with image data in a region corresponding to the first position and a laser beam in a predetermined region including ultraviolet is supplied to the DMD and modulated for each pixel in accordance with image data. A laser beam reflected in the direction of a reflection mirror is reflected therefrom in the direction of a surface of a powdered body. A region having a predetermined area on the surface of the powdered body is exposed by the laser beam, and the exposed portion is thereby cured. Similarly, by repeating movement of and exposure with the exposure unit, the entire surface of the powdered body is exposed.
摘要翻译：一种用于实现高速高精度成形的激光烧结装置。当通过XY定位机构确定曝光单元的第一位置时，根据包括紫外线的预定区域中的与第一位置相对应的区域和激光束的图像数据，DMD的微镜被打开和关闭被提供给DMD并且根据图像数据针对每个像素进行调制。在反射镜的方向上反射的激光束从粉末体的表面的方向反射。在该粉体的表面上具有规定面积的区域被激光束曝光，露出部由此固化。类似地，通过重复曝光单元的移动和曝光，粉末体的整个表面被暴露。

9. 发明授权

US06696668B2 Laser soldering method and apparatus 有权
标题翻译：激光焊接方法及装置
公开(公告)号：US06696668B2
公开(公告)日：2004-02-24
申请号：US09832894
申请日：2001-04-12
申请人： Jun Hayakawa
发明人： Jun Hayakawa
IPC分类号： B23K2602
CPC分类号： H01R43/0256 , B23K1/0056 , B23K26/032 , B23K37/0258 , B25J9/1697 , G05B2219/37555 , G05B2219/37563 , G05B2219/37572 , G05B2219/40611 , G05B2219/45165 , H01R43/0263 , H05K3/3447 , H05K3/3494
摘要： An image pickup camera is mounted on a soldering head for projecting a laser beam in such a manner that its optical axis coincides with that of the laser beam. An image of the object to be soldered, which is taken by the camera, is displayed on a monitor screen, and a projection spot, which is positioned on an optical axis of the laser beam, is displayed on the screen. While the positional relationship between the object to be soldered and the projection spot is observed on the monitor screen, the soldering head and the object to be soldered are moved relative to each other and the projection spot is positioned. Subsequently, the laser beam is projected from the soldering head, thus, performing soldering.
摘要翻译：摄像摄像机安装在焊接头上，用于以使其光轴与激光束的光轴重合的方式投射激光束。由摄像机拍摄的被焊接物体的图像被显示在监视器屏幕上，并且位于激光束的光轴上的投影点被显示在屏幕上。虽然在监视器屏幕上观察到要焊接的物体与投影点之间的位置关系，但是焊接头和待焊接的物体相对于彼此移动并且投影点被定位。随后，激光束从焊接头突出，从而进行焊接。

10. 发明授权

US06670575B1 Method and apparatus for removing substance from the surface of a workpiece 有权
标题翻译：从工件表面去除物质的方法和装置
公开(公告)号：US06670575B1
公开(公告)日：2003-12-30
申请号：US09806353
申请日：2001-05-18
申请人： Peter Wrba , Peter Hildebrand , Michael Kuhl , Martin Reisacher
发明人： Peter Wrba , Peter Hildebrand , Michael Kuhl , Martin Reisacher
IPC分类号： B23K2602
CPC分类号： B23K26/0853 , B23K26/361
摘要： A method of removing substance from the surface of a workpiece in which the removal of substance is effected layer-wise by irradiating a working site on the workpiece surface with a laser beam from a working head, the layer-wise removal of substance being carried out with the aid of a laser guidance guiding the laser across the surface of the workpiece within a working area predetermined by the apparatus, comprises positioning steps in which, after the start of the substance removal, the relative position of the workpiece and the working head are changed in accordance with a first and/or second criterion and adjusted so that a boundary of the working area comes to be disposed on different sections of the workpiece surface for identical working sites.
摘要翻译：通过用来自工作头的激光束照射工件表面上的工作部位来从物体的表面除去物质的方法，其中物质的去除被层次地进行，层进行物质的层析去除借助于在由设备预定的工作区域内引导激光穿过工件的表面的激光引导，包括定位步骤，其中在物质移除开始之后，工件和工作头的相对位置是根据第一和/或第二标准改变，并且调整为使得工作区域的边界被布置在相同工作位置的工件表面的不同部分上。

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