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1. 发明申请

US20030080175A1 Soldering apparatus 失效
标题翻译：焊接设备
公开(公告)号：US20030080175A1
公开(公告)日：2003-05-01
申请号：US10269985
申请日：2002-10-15
申请人： NIHON DEN-NETSU KEIKI CO., LTD.
发明人： Hideaki Toba
IPC分类号： B23K001/08
CPC分类号： B23K3/0653 , B23K2101/42
摘要： A soldering apparatus for soldering a printed wiring board, including a solder vessel for containing a molten solder, a nozzle disposed in the vessel and having a first opening and a second opening, and an electromagnetic pump secured in the vessel and including a tubular member defining a solder flow path therein and having an inlet and an outlet connected to the second opening of the nozzle. The pump has cores and coils disposed at a position below the surface level of the molten solder and arranged to generate a moving magnetic field in the path when the coils are electrically energized, so that the molten solder is fed from the inlet to the outlet and is projected from the first opening of the nozzle to form a solder wave.
摘要翻译：一种用于焊接印刷电路板的焊接装置，包括用于容纳熔融焊料的焊料容器，设置在容器中并具有第一开口和第二开口的喷嘴，以及固定在容器中的电磁泵，包括限定其中具有焊料流动路径并且具有连接到喷嘴的第二开口的入口和出口。泵具有设置在熔融焊料的表面水平以下的位置处的芯和线圈，并布置成当线圈通电时在路径中产生移动磁场，使得熔融焊料从入口进给到出口，从喷嘴的第一开口突出形成焊波。

2. 发明申请

US20020038815A1 Process and apparatus for flow soldering 失效
标题翻译：流动焊接的工艺和设备
公开(公告)号：US20020038815A1
公开(公告)日：2002-04-04
申请号：US09924555
申请日：2001-08-09
发明人： Atsushi Yamaguchi , Masato Hirano , Yoshinori Sakai
IPC分类号： B23K001/08 , B23K031/02 , B23K035/12
CPC分类号： B23K1/08 , B23K1/0016 , B23K2101/36 , H05K3/3447 , H05K3/3468 , H05K2203/1121
摘要： There is provided a flow soldering process for mounting an electronic component onto a board by means of a lead-free solder material, wherein the molten solder material is supplied and attached to a predetermined portion of the board in a solder material supplying zone, and thereafter the board is cooled by a cooling unit in a cooling zone such that the solder material adhering to the board is rapidly cooled to solidify.
摘要翻译：提供了一种通过无铅焊料材料将电子部件安装在基板上的流动焊接工艺，其中熔融的焊料材料被供应并附着到焊料供应区的板的预定部分，之后通过冷却单元在冷却区中冷却板，使得粘附到板上的焊料材料被快速冷却以固化。

3. 发明申请

US20010054641A1 Machine for wave soldering of tinning 失效
标题翻译：镀锡波峰焊机
公开(公告)号：US20010054641A1
公开(公告)日：2001-12-27
申请号：US09791035
申请日：2001-02-20
发明人： Marc Leturmy
IPC分类号： B23K035/38 , B23K001/08
CPC分类号： B23K1/085 , B23K2101/36 , B23K2101/42
摘要： The invention relates to a machine for wave soldering or tinning comprising a solder reservoir (9); means that can form at least one solder wave with a so-called laminar form (8b); a conveyor system (2) that can bring a piece (1) to be soldered or tinned into contact with said laminar wave; and means for injecting (12) a gas in the vicinity of the wave; characterized in that the said injection means includes an injector located in a position adjacent to and downstream from the wave and provided with a wall (17) facing the solder wave, wherein the wall of the injector has at least a first group (15) of openings positioned so as to provide a first gas jet directed toward the flat surface of the solder wave.
摘要翻译：本发明涉及一种用于波峰焊或镀锡的机器，其包括焊料储存器（9）; 意味着可以形成具有所谓的层状（8b）的至少一个焊波; 输送机系统（2），其可以使要焊接或镀锡的片（1）与所述层流接触; 以及用于在波附近注入（12）气体的装置; 其特征在于，所述注射装置包括位于与波浪相邻并且位于下游的位置并且设置有面向焊波的壁（17）的喷射器，其中喷射器的壁具有至少第一组（15）定位的开口以提供朝向焊波的平坦表面的第一气体射流。

4. 发明申请

US20010008249A1 METHOD AND APPARATUS FOR RELEASE AND OPTIONAL INSPECTION FOR CONDUCTIVE PREFORMS PLACEMENT APPARATUS 失效
标题翻译：用于导电性放置设备的发布和可选检查方法和装置
公开(公告)号：US20010008249A1
公开(公告)日：2001-07-19
申请号：US09309697
申请日：1999-05-11
发明人： ERIC LEE HERTZ , ALLEN D. HERTZ
IPC分类号： B23K035/12 , B23K001/08 , H05K003/00
CPC分类号： H05K3/3478 , B23K3/0623 , H05K2203/0338 , H05K2203/041 , H05K2203/082 , Y10T29/4913 , Y10T29/49147
摘要： A method and apparatus are disclosed for releasing solder spheres during the locating and/or placing of a pattern of conductive preforms 32 on a respective pattern of electronic pads 14 on a receiving substrate 12 for such uses as a Ball Grid Array component 24. The release mechanisms are of either compliant mechanical 11, vibratory 90, air pressure 100 or 120, or sound pressure waves 140. Additionally, a method and apparatus is disclosed for the electrical inspection for presence or absence of the complete pattern of conductive preforms.
摘要翻译：公开了用于在将导电预制件32的图案定位和/或放置在接收基板12上的相应图案的电子焊盘14上以用于诸如球栅阵列组件24的用途时释放焊球的方法和装置。释放机构具有柔性机械11，振动90，空气压力100或120或声压波140.此外，公开了用于电检查导电预制件的完整图案的存在或不存在的方法和装置。

5. 发明申请

US20040060960A1 Selective gas knife for wave soldering 有权
标题翻译：波峰焊选择性气刀
公开(公告)号：US20040060960A1
公开(公告)日：2004-04-01
申请号：US10260944
申请日：2002-09-30
发明人： Eric Wayne Becker , Kenneth Kirby
IPC分类号： B23K001/08 , B23K031/02 , B23K035/12
CPC分类号： B23K1/085 , B23K3/0653 , B23K3/08
摘要： Selective gas knives for wave soldering provide for targeted gas flow at a particular location on a substrate, such as a printed circuit board. Both the temperature and flow rate of gas through a segment of a gas knife can be independently controlled.
摘要翻译：用于波峰焊的选择性气刀在诸如印刷电路板的基板上的特定位置提供目标气体流。可以独立地控制通过气刀段的气体的温度和流速。

6. 发明申请

US20020047039A1 Automatic wave soldering apparatus and method 有权
标题翻译：波峰焊自动装置及方法
公开(公告)号：US20020047039A1
公开(公告)日：2002-04-25
申请号：US09983188
申请日：2001-10-23
发明人： Shohei Mawatari
IPC分类号： B23K001/08 , B23K031/02 , B23K035/12
CPC分类号： B23K3/0653
摘要： An automatic wave soldering apparatus includes a solder reservoir for holding a supply of molten solder and a solder nozzle vertically disposed in the solder reservoir to establish a solder wave through which a printed circuit board is moved. A pair of trapezoidal elements are secured within the nozzle. A Y-shaped baffle is disposed between the trapezoidal elements to form upwardly inclined narrowed upstream and downstream outlets. The upstream and downstream outlets are inclined at an acute angle against and in the direction of movement of the printed circuit board, respectively. A pair of valves are disposed at opposite sides of the baffle to selectively open and close the outlets. The bottom side of the trapezoidal elements forms a step to promote turbulence in the solder wave. The trapezoidal elements and the baffle collectively serve to increase the flow velocity of the molten solder through the outlets.
摘要翻译：自动波峰焊装置包括用于保持熔融焊料供应的焊料储存器和垂直设置在焊料储存器中的焊接喷嘴，以建立移动印刷电路板的焊料波。一对梯形元件固定在喷嘴内。 Y形挡板设置在梯形元件之间以形成向上倾斜的变窄的上游和下游出口。上游和下游出口分别相对于印刷电路板的移动方向倾斜成锐角。一对阀设置在挡板的相对侧，以选择性地打开和关闭出口。梯形元件的底部形成了促进焊波中的湍流的步骤。梯形元件和挡板共同用于增加熔融焊料通过出口的流速。

7. 发明申请

US20020005429A1 Apparatus and method for manufacturing solder balls 失效
标题翻译：焊球制造装置及方法
公开(公告)号：US20020005429A1
公开(公告)日：2002-01-17
申请号：US09900956
申请日：2001-07-10
发明人： Choong-Won Lee
IPC分类号： B23K031/02 , B23K035/12 , B23K020/08 , B23K001/08
CPC分类号： B23K3/06 , B22F9/08 , B22F2999/00 , B23K3/08 , B23K31/02 , B23K35/0244 , B23K35/025 , B22F2202/01
摘要： An apparatus and method for manufacturing solder balls used for an electrical and/or mechanical connection between a semiconductor chip and a substrate are provided. The apparatus includes a melting furnace having a nozzle through which a molten solder paste flows and drops, for producing solder balls; a vibrating mechanism attached to the nozzle of the melting furnace, for applying vibration to the nozzle; and a vibration controlling mechanism for controlling the vibration frequency of the vibrating mechanism to adjust the size of the solder balls dropped from the nozzle. The method includes the steps of setting a vibration frequency according to a desired solder ball size, applying vibration to a nozzle with the set vibration frequency, making the molten solder paste flow through the nozzle to manufacture solder balls of a predetermined size according to the vibration frequency, and measuring the size of the manufactured solder balls. Since the solder balls are manufactured using nozzle vibration, the accuracy, roundness and recovery efficiency of the solder balls are excellent. Also, because the apparatus and method for manufacturing solder balls is simplified, productivity is increased.
摘要翻译：提供了用于制造用于半导体芯片和基板之间的电和/或机械连接的焊球的装置和方法。该装置包括熔融炉，其具有喷嘴，熔融焊膏通过该喷嘴流动和滴落，用于制造焊球; 安装在熔炉的喷嘴上的振动机构，用于向喷嘴施加振动; 以及振动控制机构，用于控制振动机构的振动频率，以调节从喷嘴下落的焊球的尺寸。该方法包括以下步骤：根据期望的焊球尺寸设定振动频率，以设定的振动频率向喷嘴施加振动，使熔融焊膏流过喷嘴，根据振动产生预定尺寸的焊球频率，并测量制造的焊球的尺寸。由于焊球使用喷嘴振动制造，所以焊球的精度，圆度和回收效率优异。此外，由于简化了用于制造焊球的装置和方法，所以提高了生产率。

8. 发明申请

US20010030220A1 Apparatus and methods for wave soldering 失效
标题翻译：波峰焊接装置及方法
公开(公告)号：US20010030220A1
公开(公告)日：2001-10-18
申请号：US09802197
申请日：2001-03-08
发明人： Scott E. Willis , Greg Hueste
IPC分类号： B23K001/08 , B23K035/12
CPC分类号： B23K3/0653
摘要： Apparatus for use in wave soldering applications can include an adjustable wing device, a front gate and/or a mounted member. Each of these components are easily adjustable, thereby improving the quality of the soldered product and allowing for improved process efficiency and decreased downtime of the wave soldering equipment.
摘要翻译：用于波峰焊接应用的装置可以包括可调翼装置，前门和/或安装构件。这些部件中的每一个都易于调节，从而提高了焊接产品的质量，并且允许提高工艺效率并减少波峰焊设备的停机时间。

9. 发明申请

US20040035917A1 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece 有权
标题翻译：用于在微电子工件上沉积和回流焊膏的装置和方法
公开(公告)号：US20040035917A1
公开(公告)日：2004-02-26
申请号：US10226509
申请日：2002-08-22
发明人： Michel Koopmans
IPC分类号： B23K001/08 , B23K037/06 , B23K020/14 , B23K035/12
CPC分类号： H05K3/3484 , B23K1/0016 , B23K1/0053 , B23K1/0056 , B23K1/012 , B23K3/0607 , B23K3/0638 , B23K37/06 , B23K2101/36 , H01L21/4853 , H01L24/11 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05569 , H01L2224/05571 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H05K3/1216 , H05K3/3494 , H05K2203/043 , H05K2203/0557 , H05K2203/107 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： Stenciling machines and methods for forming solder balls on microelectronic-workpieces are disclosed herein. In one embodiment, a method for depositing and reflowing solder paste on a microelectronic workpiece having a plurality of dies includes positioning a stencil having a plurality of apertures at least proximate to the workpiece. The method further includes placing discrete masses of solder paste into the apertures and reflowing the discrete masses of solder paste while the stencil is positioned at least proximate to the workpiece and while the discrete masses are in the apertures. In another embodiment of the invention, a stenciling machine for depositing and reflowing solder paste on the microelectronic workpiece includes a heater for reflowing the solder paste, a stencil having a plurality of apertures, and a controller operatively coupled to the heater and the stencil. The controller has a computer-readable medium containing instructions to perform the above-mentioned method.
摘要翻译：本文公开了用于在微电子工件上形成焊球的模板机和方法。在一个实施例中，一种用于在具有多个模具的微电子工件上沉积和回流焊膏的方法包括将具有多个孔的模板定位至少靠近工件。该方法还包括将离散质量的焊膏放置在孔中并回流焊料糊的离散质量，同时模板至少靠近工件定位，而离散质量位于孔中。在本发明的另一个实施例中，用于在微电子工件上沉积和回流焊膏的模板机包括用于回流焊膏的加热器，具有多个孔的模板，以及可操作地耦合到加热器和模板的控制器。控制器具有包含执行上述方法的指令的计算机可读介质。

10. 发明申请

US20030121950A1 TROUGH DEVICE IN A SOLDERING FURNACE 失效
标题翻译：焊接炉中的设备
公开(公告)号：US20030121950A1
公开(公告)日：2003-07-03
申请号：US10033884
申请日：2001-12-27
发明人： Yu-Chen Tu
IPC分类号： B23K001/08
CPC分类号： B23K3/0653
摘要： A trough device in a soldering furnace comprises a motor, a soldering pot, support device, a trough part and transmission device. The support device connects with a fixing base of the motor via a micro adjustment device and an inclinometer for adjusting an inclining angle of the soldering pot and informing the adjusted inclining angle. A guidance part with double layer structure is located at the soldering pot and can receive the solder oxide residue falling down from the circuit board or spattered out from the soldering pot to prevent the solder oxide residue from flowing back to the trough part. The transmission device further comprises a transmission shaft, a shaft hub, a fan blade part and fixing plate assembly. The shaft hub surrounds the transmission shaft with bearings being disposed between the shaft hub and the transmission shaft. The fixing plate assembly is arranged at the lower end of the shaft hub and engages with the soldering pot by way of screw threads. The transmission shaft, the shaft hub, the fan blade part, and the fixing plate assembly can be fixed coaxially with being firmly supported by the shaft hub. Hence, the transmission shaft can rotates more steadily and the component parts thereof can be free from being contaminated by the tin solder.
摘要翻译：焊接炉中的槽装置包括电动机，焊接锅，支撑装置，槽部和传输装置。支撑装置通过微调装置和倾斜计与电动机的固定底座连接，用于调节焊接锅的倾斜角度并通知调整后的倾斜角度。具有双层结构的引导部件位于焊接锅处，并且可以接收从电路板掉落的焊料氧化物残余物或从焊接锅喷出，以防止焊料氧化物残留物流回到槽部分。传动装置还包括传动轴，轴毂，风扇叶片部分和固定板组件。轴毂围绕传动轴，轴承设置在轴毂和传动轴之间。固定板组件布置在轴毂的下端，并通过螺纹与焊盘接合。传动轴，轴毂，风扇叶片部分和固定板组件可以同轴地固定，由轴毂牢固地支撑。因此，传动轴可以更稳定地旋转，并且其部件可以不被锡焊料污染。

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