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1. 发明申请

US20030080175A1 Soldering apparatus 失效
标题翻译：焊接设备
公开(公告)号：US20030080175A1
公开(公告)日：2003-05-01
申请号：US10269985
申请日：2002-10-15
申请人： NIHON DEN-NETSU KEIKI CO., LTD.
发明人： Hideaki Toba
IPC分类号： B23K001/08
CPC分类号： B23K3/0653 , B23K2101/42
摘要： A soldering apparatus for soldering a printed wiring board, including a solder vessel for containing a molten solder, a nozzle disposed in the vessel and having a first opening and a second opening, and an electromagnetic pump secured in the vessel and including a tubular member defining a solder flow path therein and having an inlet and an outlet connected to the second opening of the nozzle. The pump has cores and coils disposed at a position below the surface level of the molten solder and arranged to generate a moving magnetic field in the path when the coils are electrically energized, so that the molten solder is fed from the inlet to the outlet and is projected from the first opening of the nozzle to form a solder wave.
摘要翻译：一种用于焊接印刷电路板的焊接装置，包括用于容纳熔融焊料的焊料容器，设置在容器中并具有第一开口和第二开口的喷嘴，以及固定在容器中的电磁泵，包括限定其中具有焊料流动路径并且具有连接到喷嘴的第二开口的入口和出口。泵具有设置在熔融焊料的表面水平以下的位置处的芯和线圈，并布置成当线圈通电时在路径中产生移动磁场，使得熔融焊料从入口进给到出口，从喷嘴的第一开口突出形成焊波。

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