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1. 发明公开

US20240190752A1 GLASS PLATE PROCESSING SYSTEM 审中-公开
公开(公告)号：US20240190752A1
公开(公告)日：2024-06-13
申请号：US17798323
申请日：2021-09-27
申请人： BANDO KIKO Co., Ltd.
发明人： Kazuaki BANDO
IPC分类号： C03B33/03 , B24B9/10 , B24B41/06 , B28D1/22 , B28D7/00 , B28D7/04 , C03B33/037
CPC分类号： C03B33/03 , B24B9/10 , B24B41/068 , B28D1/225 , B28D7/046 , C03B33/037 , B28D7/005
摘要： A glass plate processing system includes a first aligning means. When first and second glass plates different upper and lower surface areas are processed, the first aligning means aligns a first side edge extending in a front-rear direction on one side in a width direction of a first glass plate to be processed first with a first side edge extending in the front-rear direction on the one side in the width direction of a second glass plate to be processed later. The glass plate processing system causes the first aligning means to align the first side edge of the second glass plate at a position of the first side edge of the first glass plate to perform processing on the second glass plate. The glass plate processing system shortens a moving distance and arrival time for a processing device and shortens cycle time of processing.

2. 发明公开

US20240002272A1 METHODS AND APPARATUS FOR MANUFACTURING A GLASS RIBBON 审中-公开
公开(公告)号：US20240002272A1
公开(公告)日：2024-01-04
申请号：US18251643
申请日：2021-11-17
申请人： CORNING INCORPORATED
发明人： James William Brown , Pierre Georges Brunello , Nils Paul Fornell , Misha Andre Gerschel , Keith Mitchell Hill , Mark Thomas Massaro , Gary Edward Merz , Stephane Poissy
IPC分类号： C03B33/023 , C03B33/033 , C03B33/037 , C03B35/18
CPC分类号： C03B33/0235 , C03B33/033 , C03B33/037 , C03B35/188
摘要： Methods for manufacturing a glass ribbon include moving the glass ribbon along a travel path in a travel direction. Methods include directing a first ribbon portion of the glass ribbon to a winding apparatus to wind the first ribbon portion into a roll. Methods include detaching the first ribbon portion from a second ribbon portion of the glass ribbon. Methods include separating the second ribbon portion into a plurality of separated ribbon portions. Methods include directing a first set of the plurality of separated ribbon portions toward a disposal apparatus to crush the first set of the plurality of separated ribbon portions. Methods include forming a stack with a second set of the plurality of separated ribbon portions. A glass manufacturing apparatus is provided.

3. 发明申请

US20180164631A1 CUTTING METHOD OF LIQUID CRYSTAL PANEL 审中-公开
公开(公告)号：US20180164631A1
公开(公告)日：2018-06-14
申请号：US15110094
申请日：2016-05-20
申请人： Shenzhen China Star Optoelectronics Technology Co., Ltd.
发明人： Song BAN
IPC分类号： G02F1/1333 , B26D5/00 , B26D7/26 , G02F1/13
CPC分类号： G02F1/133351 , B26D5/007 , B26D7/2628 , C03B33/037 , C03B33/07 , G02F1/1303 , G02F1/1333 , Y02P40/57
摘要： The present invention discloses a cutting method of a liquid crystal panel, comprising: providing a control device, an image identification device and a knife, and the substrate has respective cutting positions of the knife in a first cutting direction, and the control device is preset with cutting position information of the respective cutting positions; setting a reference alignment mark on the substrate, and the reference alignment mark is positioned between two adjacent cutting positions; capturing the reference alignment mark with the image identification device, and generating reference position information indicating the reference alignment mark; controlling the knife to move to the respective cutting positions in sequence and to cut with the control device according to the reference position information and the cutting position information. The cutting method provided by the present invention can simplify the cutting process and raise the cutting efficiency.

4. 发明申请

US20180134607A1 SUBSTRATE PROCESSING METHOD 有权
公开(公告)号：US20180134607A1
公开(公告)日：2018-05-17
申请号：US15793754
申请日：2017-10-25
申请人： Via Mechanics, Ltd.
发明人： Kenichi ICHIKAWA , Kaori TATEISHI , Yasushi ITO
IPC分类号： C03B33/10 , B25H7/04 , B23K26/00 , B23K26/035
CPC分类号： C03B33/102 , B23K26/0006 , B23K26/035 , B23K26/352 , B23K26/389 , B23K26/402 , B23K2103/172 , B23K2103/54 , B25H7/04 , C03B33/037 , C03B33/074 , C03C17/32 , C03C19/00 , C03C2218/328
摘要： In a substrate processing method in which, for a substrate including a first layer made of a glass substrate and second layers made of a material different from that of the first layer and provided on a front surface and a back surface of the first layer, respectively, an intended mark is formed in each of the second layers, the substrate processing method includes the step of irradiating with a laser beam having an energy density capable of processing the second layers but incapable of processing the first layer from one surface side of the substrate, thereby simultaneously forming the mark at corresponding positions on each of a front surface and a back surface of the substrate.

5. 发明授权

US09963376B2 Method for cutting substrate by laser and laser cutting device 有权
公开(公告)号：US09963376B2
公开(公告)日：2018-05-08
申请号：US14770581
申请日：2015-05-19
申请人： BOE TECHNOLOGY GROUP CO., LTD. , HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
发明人： Dai Dong , Yang Huang , Sheng Tao , Bingbing Chu
IPC分类号： C03B33/08 , B23K26/364 , B23K26/402 , C03B33/02 , C03B33/037 , C03B33/04 , B23K103/00
CPC分类号： C03B33/082 , B23K26/0006 , B23K26/359 , B23K26/364 , B23K26/402 , B23K2103/50 , B23K2103/54 , C03B33/0222 , C03B33/037 , C03B33/04
摘要： A method for cutting a substrate by laser and a laser cutting device are disclosed. The method includes the following steps: engraving a plurality of intercrossed first parallel lines and second parallel lines on a substrate, in which regions for engraving a shape of sub-substrates are encircled between the first parallel lines and the second parallel lines; shaped lines are disposed in the regions; auxiliary split lines are engraved on an outside of the shaped lines; and a minimum distance from end portions of the auxiliary split lines towards the shaped lines to the shaped lines falls within the first default threshold. The method adopts the arrangement of the parallel lines and the auxiliary split lines to help splitting the substrate, and can increase stress rupture points in the process of cutting the substrate, avoid the phenomenon of rupture of the glass substrate in the cutting process, and effectively improve the yield of substrate cutting.

6. 发明申请

US20160362325A1 METHOD FOR CUTTING SUBSTRATE BY LASER AND LASER CUTTING DEVICE 有权
标题翻译：用激光和激光切割装置切割基板的方法
公开(公告)号：US20160362325A1
公开(公告)日：2016-12-15
申请号：US14770581
申请日：2015-05-19
申请人： BOE TECHNOLOGY GROUP CO., LTD. , HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
发明人： Dai DONG , Yang HUANG , Sheng TAO , Bingbing CHU
IPC分类号： C03B33/08 , B23K26/402 , B23K26/364
CPC分类号： C03B33/082 , B23K26/0006 , B23K26/359 , B23K26/364 , B23K26/402 , B23K2103/50 , B23K2103/54 , C03B33/0222 , C03B33/037 , C03B33/04
摘要： A method for cutting a substrate by laser and a laser cutting device are disclosed. The method includes the following steps: engraving a plurality of intercrossed first parallel lines and second parallel lines on a substrate, in which regions for engraving a shape of sub-substrates are encircled between the first parallel lines and the second parallel lines; shaped lines are disposed in the regions; auxiliary split lines are engraved on an outside of the shaped lines; and a minimum distance from end portions of the auxiliary split lines towards the shaped lines to the shaped lines falls within the first default threshold. The method adopts the arrangement of the parallel lines and the auxiliary split lines to help splitting the substrate, and can increase stress rupture points in the process of cutting the substrate, avoid the phenomenon of rupture of the glass substrate in the cutting process, and effectively improve the yield of substrate cutting.
摘要翻译：公开了一种通过激光切割基板的方法和激光切割装置。该方法包括以下步骤：在基板上雕刻多个交叉的第一平行线和第二平行线，其中用于雕刻子基板形状的区域包围在第一平行线和第二平行线之间; 形状的线条设置在该区域中; 辅助分割线刻在成形线的外侧; 并且从辅助分割线的端部朝向成形线到成形线的最小距离落在第一默认阈值内。该方法采用平行线和辅助分割线的布置，有助于分割基板，并可以在切割基板的过程中增加应力断裂点，避免玻璃基板在切割过程中破裂的现象，有效地提高基材切割的产量。

7. 发明申请

US20160175987A1 CUTTING METHOD OF FLEXIBLE DISPLAY PANEL, CONTROLLING DEVICE IN THE CUTTING METHOD, AND CUTTING APPARATUS OF FLEXIBLE DISPLAY PANEL 有权
标题翻译：柔性显示面板的切割方法，切割方法中的控制装置以及柔性显示面板的切割装置
公开(公告)号：US20160175987A1
公开(公告)日：2016-06-23
申请号：US14436954
申请日：2014-11-21
申请人： BOE Technology Group Co., Ltd.
发明人： Jing YANG , Lu LIU
IPC分类号： B23K26/38 , B29C59/16 , B23K26/00
CPC分类号： B23K26/38 , B23K26/0093 , B23K2103/172 , B29C59/16 , B29L2031/723 , C03B33/0222 , C03B33/037 , C03B33/074
摘要： Disclosed are a cutting method of flexible display panel, a controlling device in the cutting method and a cutting apparatus of flexible display panel. The cutting method comprises steps of placing a transparent substrate (21) carried with a flexible film layer (22) on a base (10); cutting only the transparent substrate (21) by means of a cutting tool (30); obtaining a cutting trace of the cutting tool (30); and controlling a laser knife (40) to cut the flexible film layer (22) carried on the transparent substrate (21) along the cutting trace of the cutting tool cutting the transparent substrate. In this way, by controlling the laser knife (40) to cut the flexible film layer (22) disposed on the transparent substrate (21) following the cutting trace of the cutting tool (30) cutting the transparent substrate (21), the flexible film layer (22) can be completely cut at the same time when or after the transparent substrate (21) is completely cut, so as to avoid rough selvedges during cutting the flexible film layer (22), thereby improving the cutting effect of cutting the flexible display panel; besides, in case that the cutting tool (30) and the laser knife (40) operate in parallel cutting mode, it can also improve the cutting efficiency.
摘要翻译：公开了一种柔性显示面板的切割方法，切割方法中的控制装置和柔性显示面板的切割装置。切割方法包括以下步骤：将带有柔性膜层（22）的透明基底（21）放置在基底（10）上; 通过切割工具（30）仅切割透明基板（21）; 获得切割工具（30）的切割迹线; 以及控制激光刀（40）沿着切割所述透明基板的切割工具的切割轨迹切割承载在所述透明基板（21）上的所述柔性膜层（22）。以这种方式，通过控制激光刀（40）切割设置在切割工具（30）上的切割工具（30）上的透明基板（21）上的柔性膜层（22），从而切割透明基板（21），柔性在透明基板（21）被完全切割之后或之后的同时可以完全切割薄膜层（22），以避免在切割柔性薄膜层（22）期间的粗糙边缘，从而提高切割效果柔性显示面板; 此外，在切割工具（30）和激光刀（40）以平行切割模式操作的情况下，还可以提高切割效率。

8. 发明授权

US09290412B2 Method of processing tempered glass and device of processing tempered glass 有权
标题翻译：加工钢化玻璃的方法和加工钢化玻璃的装置
公开(公告)号：US09290412B2
公开(公告)日：2016-03-22
申请号：US14414757
申请日：2012-08-31
申请人： Hironori Minami
发明人： Hironori Minami
IPC分类号： B28D1/14 , C03C17/00 , C03B33/037 , G05B19/418
CPC分类号： B24B1/04 , B24B7/248 , B24B9/10 , B24D7/18 , B28D1/041 , B28D1/14 , B28D5/021 , B28D5/047 , C03B33/037 , C03B33/10 , C03C17/00 , G05B13/0205 , G05B19/418 , G05B2219/45009 , Y10T409/303752 , Y10T409/304312
摘要： To provide a method of processing a tempered glass in a simple and appropriate manner while a degree of freedom of processing is secured.Vibration of the processing device is controlled in a feedback fashion such that a vibration amplitude and a vibration frequency of the processing device approach to a target vibration amplitude and a target vibration frequency not to keep them in a range where a value of worsening the quality is generated. Further, a specified sample cycle of 0.3 msec or less in the feedback control is employed.
摘要翻译：提供一种在确保加工自由度的同时以简单和适当的方式处理钢化玻璃的方法。处理装置的振动以反馈方式进行控制，使得处理装置的振动振幅和振动频率接近目标振幅和目标振动频率，不会使其处于质量恶化值的范围内生成。此外，采用反馈控制中0.3msec以下的指定采样周期。

9. 发明申请

US20150375415A1 METHOD FOR CUTTING OUT ONE OR MORE GLASS PANELS 有权
标题翻译：切割一个或多个玻璃面板的方法
公开(公告)号：US20150375415A1
公开(公告)日：2015-12-31
申请号：US14769557
申请日：2014-02-24
申请人： SAINT-GOBAIN GLASS FRANCE
发明人： François SAUSSET , Laurent VILAIN
IPC分类号： B26D5/00 , C03B33/037 , G05B19/18 , B26D1/08
CPC分类号： B26D5/005 , B26D1/085 , C03B33/037 , G05B19/182 , G05B19/4097 , G05B2219/35162 , G05B2219/45009 , Y02P40/57 , Y02P80/40
摘要： A method for cutting out pieces of glass from a glass sheet, includes, a step of automatic generation by a computer with a storage unit, containing programs to calculate a first optimum plan for guillotine cutting at a number of hierarchical levels of different pieces from each of the glass sheet, as a function of information; a step of reading information relating to defects in the glass sheet, a step of automatic generation by a computer with a storage unit, containing programs to calculate a second optimum plan for guillotine cutting at a number of hierarchical levels from the glass sheet, based on the first optimum cutting plan and at least some of the information relating to the defects, including permutations of cross cut sections at the same hierarchical level within the glass sheet; a step of cutting pieces of glass in accordance with the second optimum cutting plan generated.
摘要翻译：一种用于从玻璃板切割玻璃的方法包括：通过具有存储单元的计算机自动生成的步骤，其包含用于计算用于从每个不同部件的多个分级等级切割的第一最佳切割计划的程序作为信息的函数; 读取与玻璃板中的缺陷有关的信息的步骤，具有存储单元的计算机自动生成的步骤，包含根据玻璃板从多个层次上计算用于断层切割的第二最佳计划的程序，基于第一最佳切割计划和与缺陷有关的至少一些信息，包括在玻璃板内的相同层级上的横切部分的排列; 根据产生的第二最佳切割计划切割玻璃片的步骤。

10. 发明申请

US20150251944A1 METHODS AND APPARATUSES FOR SEPARATING GLASS RIBBONS 审中-公开
标题翻译：用于分离玻璃纤维的方法和装置
公开(公告)号：US20150251944A1
公开(公告)日：2015-09-10
申请号：US14638488
申请日：2015-03-04
申请人： Corning Incorporated
发明人： Douglas Edward Brackley , Todd Benson Fleming , David Joseph Kuhn , Zhiqiang Shi , Ningli Yang , Chester Hann Huei Chang
IPC分类号： C03B33/037 , C03B33/03 , B26D7/32 , C03B33/023
CPC分类号： C03B33/037 , B26D7/32 , B65G2249/04 , C03B33/0235 , C03B33/03 , C03B33/033 , C03B33/09 , C03B33/091 , C03B35/243 , Y02P40/57 , Y10T83/0448 , Y10T83/178 , Y10T83/2024
摘要： Apparatus and methods of separating a glass ribbon are provided. In one embodiment, an apparatus for severing glass ribbon includes a plurality of manufacturing components arranged into a travel path, a glass cutting device, and a severing zone positioned in a downstream direction from the glass cutting device, where the severing zone comprising a targeted separation region along the travel path. The apparatus also includes an acoustic transmitter positioned in a first direction from the targeted separation region, an acoustic receiver positioned in a second direction from the targeted separation region opposite the first direction, and a manufacturing component positioned along the travel path in the downstream direction from the targeted separation region.
摘要翻译：提供了分离玻璃带的装置和方法。在一个实施例中，一种用于切割玻璃带的设备包括布置在行进路径中的多个制造部件，玻璃切割装置和从玻璃切割装置沿下游方向定位的切割区域，其中切割区域包括目标分离沿着行进路径的区域。该设备还包括从目标分离区域沿第一方向定位的声发射器，从与第一方向相反的目标分离区域沿第二方向定位的声学接收器，以及沿着行进路径沿下游方向定位的制造部件，目标分离区域。

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