基本信息:
- 专利标题： BUS BAR PLATE, ELECTRONIC COMPONENT UNIT, AND WIRE HARNESS
- 专利标题（中）：总线板，电子元件单元和线束
- 申请号：US15041104 申请日：2016-02-11
- 公开(公告)号：US20160242290A1 公开(公告)日：2016-08-18
- 发明人： Akemi MAEBASHI , Pharima AKANITSUK
- 申请人： Yazaki Corporation
- 申请人地址： JP Tokyo
- 专利权人： Yazaki Corporation
- 当前专利权人： Yazaki Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2015-025818 20150212
- 主分类号： H05K1/18
- IPC分类号： H05K1/18
摘要：
An electronic component unit and a wire harness are provided with a bus bar plate. The bus bar plate is provided with a metallic bus bar that is built in a resin material, and including a through-hole in which a terminal of a relay mounted on a mounting surface is soldered. The through-hole is provided with a bus bar through-hole which penetrates the bus bar, and a resin material through-hole which penetrates the resin material and is formed to be larger than the bus bar through-hole to expose the surface of the bus bar. When an inner diameter of the bus bar through-hole is defined as r and an inner diameter of the resin material through-hole is defined as R, 1.5r≦R is satisfied.
摘要（中）：
电子元件单元和线束设有汇流条板。 汇流条板设置有内置在树脂材料中的金属汇流条，并且包括安装在安装表面上的继电器的端子被焊接在其中的通孔。 通孔设有贯穿母线的汇流条通孔，以及穿过树脂材料形成为比母线通孔大的树脂材料通孔，露出该母线的表面 母线。 当汇流条通孔的内径被定义为r并且树脂材料通孔的内径被定义为R时，满足1.5r≤R。
公开/授权文献:
- US09699919B2 Bus bar plate, electronic component unit, and wire harness 公开/授权日：2017-07-04
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/18 | .在结构上与非印制电元件相联接的印刷电路 |