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1. 发明授权

US10504643B2 Electrical device with flexible connectors 有权
公开(公告)号：US10504643B2
公开(公告)日：2019-12-10
申请号：US15379631
申请日：2016-12-15
申请人： Hamilton Sundstrand Corporation
发明人： Charles Patrick Shepard , Shin Katsumata
IPC分类号： H01F17/06 , H01F27/28 , H01F27/29
CPC分类号： H01F17/062 , H01F27/2804 , H01F27/2895 , H01F27/29 , H01F27/2866 , H01F27/292 , H01F2027/2814
摘要： An electrical device includes a first flexible connector, including a first flexible conductor and a second flexible conductor, and a flexible insulator disposed between the first flexible conductor and the second flexible conductor, a second flexible connector spaced apart from the first flexible connector, the second flexible connector including a third flexible conductor, a first interconnect to electrically connect the first flexible conductor and the third flexible conductor, a second interconnect to electrically connect the third flexible conductor and the second flexible conductor, wherein the second interconnect is disposed opposite the first interconnect.

2. 发明申请

US20190006077A1 ARRAYED EMBEDDED MAGNETIC COMPONENTS AND METHODS 审中-公开
公开(公告)号：US20190006077A1
公开(公告)日：2019-01-03
申请号：US16102039
申请日：2018-08-13
申请人： Radial Electronics, Inc.
发明人： James E. Quilici
IPC分类号： H01F17/00 , H05K3/46 , H05K3/04 , H05K1/02 , H01F41/064 , H01F5/00 , H01F17/06 , H01F41/02 , H01F27/24 , H01F27/28 , H01F41/04 , H05K1/16 , H01F27/02 , H05K3/00
CPC分类号： H01F17/0033 , H01F5/00 , H01F17/062 , H01F27/027 , H01F27/24 , H01F27/2804 , H01F27/2895 , H01F41/02 , H01F41/0206 , H01F41/041 , H01F41/042 , H01F41/064 , H01F2027/2809 , H01F2027/2814 , H05K1/0284 , H05K1/165 , H05K3/0014 , H05K3/045 , H05K3/4611 , H05K2201/086 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , Y10T29/4902 , Y10T29/49073 , Y10T29/49075 , Y10T156/10
摘要： Disclosed are apparatus and methods for arrayed embedded magnetic components that include magnetic devices that have a core that is embedded between two or more substrates and a winding pattern surrounding the core that is implemented on and through the two or more substrates. The winding pattern is operable to induce a magnetic flux within the core when energized by a time varying voltage potential. The winding pattern may be implemented by printed circuit layers, plated vias, other electrically conductive elements, and combinations thereof. Arrayed embedded magnetic components include two or more electrically interconnected magnetic devices positioned side-by-side in a horizontal integration, positioned top-to-bottom in a vertical integration, or combinations thereof. The magnetic devices may have a magnetic functionality such as, but not limited to, a transformer, inductor, and filter. Disclosed magnetic components and methods provide for low cost construction, consistent performance, and a low profile form, among other benefits.

3. 发明申请

US20180336994A1 EMBEDDED COIL ASSEMBLY AND METHOD OF MAKING 审中-公开
公开(公告)号：US20180336994A1
公开(公告)日：2018-11-22
申请号：US15809750
申请日：2017-11-10
申请人： Texas Instruments Incorporated
发明人： Haiying Li , Benjamin Michael Sutton , Ming Li
IPC分类号： H01F27/28 , H01F27/32 , H01F17/04 , H01F41/12 , H01F41/04 , H01F17/00 , H01F27/02 , H01F17/06
CPC分类号： H01F27/2804 , H01F17/0033 , H01F17/045 , H01F17/062 , H01F27/022 , H01F27/2895 , H01F27/327 , H01F41/041 , H01F41/127 , H01F2027/2809 , H01F2027/2814
摘要： An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

4. 发明申请

US20170076856A1 COIL COMPONENT AND POWER SUPPLY APPARATUS INCLUDING THE SAME 审中-公开
标题翻译：线圈组件和电源设备，包括它们
公开(公告)号：US20170076856A1
公开(公告)日：2017-03-16
申请号：US15358999
申请日：2016-11-22
申请人： Solum Co., Ltd.
发明人： Xin Lan LI , Jae Gen EOM , Geun Young PARK , Se Hoon JANG , Heung Gyoon CHOI
IPC分类号： H01F27/32 , H01F27/28
CPC分类号： H01F27/324 , H01F27/263 , H01F27/2804 , H01F27/2823 , H01F27/292 , H01F2027/2809 , H01F2027/2814
摘要： A coil component includes a first coil part including a multilayer substrate on which a conductor pattern is formed, a second coil part formed as a wire and stacked together with the first coil part, a core coupled to the first and second coil parts while penetrating through the first and second coil parts to thereby be electromagnetically coupled to the first and second coil parts, and a pressing member interposed between the core and the second coil part to allow the first and second coil parts to closely adhere to each other.
摘要翻译：线圈部件包括：第一线圈部，包括形成有导体图案的多层基板;形成为导线并与第一线圈部堆叠的第二线圈部，与第一线圈部和第二线圈部连接的芯，所述第一和第二线圈部分由此电磁耦合到所述第一和第二线圈部分;以及按压部件，插入在所述芯部和所述第二线圈部分之间，以允许所述第一线圈部件和所述第二线圈部件彼此紧密地粘合。

5. 发明申请

US20170062113A1 COIL COMPONENT AND MODULE INCLUDING THE SAME 审中-公开
标题翻译：线圈组件和模块，包括它们
公开(公告)号：US20170062113A1
公开(公告)日：2017-03-02
申请号：US15351622
申请日：2016-11-15
申请人： Murata Manufacturing Co., Ltd.
发明人： Yoshihito Otsubo , Norio Sakai
IPC分类号： H01F17/06 , H01F27/29
CPC分类号： H01F17/062 , H01F27/266 , H01F27/2804 , H01F27/292 , H01F2027/2814 , H01F2027/297
摘要： An improvement in coil characteristics is achieved by performing accurate positioning of a magnetic core. A coil component 2 includes a wiring substrate 3, a magnetic core 4 that has a ring-like shape and that is disposed on a bottom surface of the wiring board 3, and a coil electrode 5 that is wound around the magnetic core 4, and the coil electrode 5 includes a plurality of inner metallic pins 11a and outer metallic pins 11b that are vertically arranged around the magnetic core 4. First end portions of the plurality of inner and outer metallic pins 11a and 11b are each connected, with solder, to an end surface of a corresponding one of a plurality of via conductors 9a, the end surface being exposed at the bottom surface of the wiring board 3.
摘要翻译：通过执行磁芯的精确定位来实现线圈特性的改善。线圈部件2包括布线基板3，具有环状形状并且配置在布线基板3的底面的磁芯4，以及缠绕在磁芯4上的线圈电极5，以及线圈电极5包括围绕磁芯4垂直设置的多个内部金属销11a和外部金属销11b。多个内部和外部金属销11a和11b的第一端部各自用焊料连接到多个通孔导体9a中的相应一个的端面，该端面露出在布线板3的底面。

6. 发明申请

US20170025218A1 MODULE SUBSTRATE 审中-公开
标题翻译：模块基板
公开(公告)号：US20170025218A1
公开(公告)日：2017-01-26
申请号：US15203366
申请日：2016-07-06
申请人： TAIYO YUDEN CO., LTD.
发明人： Yuichi SUGIYAMA , Masashi MIYAZAKI , Yutaka HATA
IPC分类号： H01F27/28 , H01F27/245 , H05K1/11 , H01L23/498 , H05K1/18
CPC分类号： H01F27/2804 , H01F17/0006 , H01F17/062 , H01F27/245 , H01F2027/2814 , H01L23/49822 , H01L23/49827 , H01L28/00 , H01L2224/16225 , H01L2224/16227 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/056 , H05K1/165 , H05K1/181 , H05K3/445 , H05K2201/086
摘要： Provided is a module substrate including an inductor that can be made thinner and smaller. A module substrate according to an aspect of the present invention includes a substrate member having a mounting surface on which electronic components are mounted, a magnetic core disposed within the substrate member, and a conductor coil provided in the substrate member and wound around the magnetic core. The module substrate has a configuration in which an inductor is built into the substrate member, which makes it possible to make the overall module substrate smaller and thinner.
摘要翻译：提供了包括可以制造得更薄和更小的电感器的模块衬底。根据本发明的一个方面的模块基板包括：基板部件，其具有安装有电子部件的安装面，设置在基板部件内的磁芯，以及设置在该基板部件中并卷绕在磁芯上的导体线圈。模块基板具有将基板部件内置电感器的结构，能够使整个模块基板越来越薄。

7. 发明申请

US20160093431A1 ARRAYED EMBEDDED MAGNETIC COMPONENTS AND METHODS 审中-公开
标题翻译：嵌入式嵌入式磁性元件和方法
公开(公告)号：US20160093431A1
公开(公告)日：2016-03-31
申请号：US14963619
申请日：2015-12-09
申请人： Radial Electronics, Inc.
发明人： James E. Quilici
IPC分类号： H01F17/00 , H01F17/06
CPC分类号： H01F17/0033 , H01F5/00 , H01F17/062 , H01F27/027 , H01F27/24 , H01F27/2804 , H01F27/2895 , H01F41/02 , H01F41/0206 , H01F41/041 , H01F41/042 , H01F41/064 , H01F2027/2809 , H01F2027/2814 , H05K1/0284 , H05K1/165 , H05K3/0014 , H05K3/045 , H05K3/4611 , H05K2201/086 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , Y10T29/4902 , Y10T29/49073 , Y10T29/49075 , Y10T156/10
摘要： Disclosed are apparatus and methods for arrayed embedded magnetic components that include magnetic devices that have a core that is embedded between two or more substrates and a winding pattern surrounding the core that is implemented on and through the two or more substrates. The winding pattern is operable to induce a magnetic flux within the core when energized by a time varying voltage potential. The winding pattern may be implemented by printed circuit layers, plated vias, other electrically conductive elements, and combinations thereof. Arrayed embedded magnetic components include two or more electrically interconnected magnetic devices positioned side-by-side in a horizontal integration, positioned top-to-bottom in a vertical integration, or combinations thereof. The magnetic devices may have a magnetic functionality such as, but not limited to, a transformer, inductor, and filter. Disclosed magnetic components and methods provide for low cost construction, consistent performance, and a low profile form, among other benefits.
摘要翻译：公开了用于阵列嵌入式磁性部件的装置和方法，其包括具有嵌入在两个或更多个基板之间的磁芯的磁性装置和围绕该芯的绕组图案，该绕组图案被实现在并通过两个或多个基板。当通过时变电压电位通电时，绕组模式可操作以在芯内感应磁通量。绕组图案可以由印刷电路层，电镀通孔，其它导电元件及其组合来实现。阵列嵌入式磁性部件包括以水平整合并排定位的两个或更多个电互连磁性装置，以垂直整合方式从顶部到底部定位，或其组合。磁性器件可以具有磁性功能，例如但不限于变压器，电感器和滤波器。公开的磁性部件和方法提供了低成本构造，一致的性能和低调的形式以及其他益处。

8. 发明授权

US08701272B2 Method of forming a power module with a magnetic device having a conductive clip 有权
标题翻译：用具有导电夹子的磁性装置形成功率模块的方法
公开(公告)号：US08701272B2
公开(公告)日：2014-04-22
申请号：US11243787
申请日：2005-10-05
申请人： Ashraf W. Lotfi , Mathew A. Wilkowski , Trifon M. Liakopoulos , John D. Weld
发明人： Ashraf W. Lotfi , Mathew A. Wilkowski , Trifon M. Liakopoulos , John D. Weld
IPC分类号： H01F27/30 , H01L23/495
CPC分类号： H01F27/2847 , H01F17/04 , H01F2027/2814 , H01L23/495 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/16 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/49052 , H01L2224/49096 , H01L2224/49171 , H01L2224/49175 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01047 , H01L2924/10253 , H01L2924/14 , H01L2924/19105 , H01L2924/19107 , H02M3/00 , Y10T29/4902 , Y10T29/49073 , Y10T29/49076 , Y10T29/49121 , Y10T29/49146 , H01L2924/00 , H01L2224/05599 , H01L2924/01033
摘要： A method of forming a power module located on a conductive substrate by providing power conversion circuitry. The method of providing the power conversion circuitry includes forming a magnetic device by placing a magnetic core proximate a conductive substrate with a surface thereof facing a conductive substrate, and placing a conductive clip proximate a surface of the magnetic core. The method of forming the magnetic device also includes electrically coupling ends of the conductive clip to the conductive substrate to cooperatively form a winding therewith about the magnetic core. The method of providing the power conversion circuitry also includes providing at least one switch on the conductive substrate. The method of forming the power module also includes depositing an encapsulant about the power conversion circuitry.
摘要翻译：一种通过提供电力转换电路形成位于导电衬底上的功率模块的方法。提供功率转换电路的方法包括通过将磁芯靠近导电衬底形成磁性器件，导电衬底的表面面向导电衬底，并将导电夹子放置在靠近磁芯的表面。形成磁性器件的方法还包括将导电夹子的端部电耦合到导电衬底，以协同地形成围绕磁芯的绕组。提供功率转换电路的方法还包括在导电衬底上提供至少一个开关。形成功率模块的方法还包括在电力转换电路周围沉积密封剂。

9. 发明申请

US20130299941A1 INDUCTOR 有权
标题翻译：电感器
公开(公告)号：US20130299941A1
公开(公告)日：2013-11-14
申请号：US13746366
申请日：2013-01-22
申请人： Jae Sup LEE , Seong Joong KIM
发明人： Jae Sup LEE , Seong Joong KIM
IPC分类号： H01L49/02
CPC分类号： H01L28/10 , H01F17/0006 , H01F2027/2814 , H01L23/645 , H01L23/66 , H01L24/06 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2224/05553 , H01L2224/05554 , H01L2224/451 , H01L2224/48091 , H01L2224/4813 , H01L2224/4903 , H01L2224/49113 , H01L2924/00014 , H01L2924/10253 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： An inductor is provided. The inductor includes first and second bonding pads on a semiconductor substrate, a lead pin on a board trace, a first bonding wire being configured to connect the first bonding pad and the lead pin, and a second bonding wire configured to connect the second bonding pad and the lead pin, the second bonding wire being connected to the first bonding wire in parallel.
摘要翻译：提供电感器。电感器包括半导体衬底上的第一和第二接合焊盘，板迹线上的引脚，被配置为连接第一接合焊盘和引线引脚的第一接合线，以及被配置为将第二接合焊盘并且所述引导销，所述第二接合线并联连接到所述第一接合线。

10. 发明授权

US08471664B1 Transformer without coil racks 有权
标题翻译：没有线圈架的变压器
公开(公告)号：US08471664B1
公开(公告)日：2013-06-25
申请号：US13454805
申请日：2012-04-24
申请人： Yung-Hsin Huang , Tzung-Han Lee , Yun-Chen Chen
发明人： Yung-Hsin Huang , Tzung-Han Lee , Yun-Chen Chen
IPC分类号： H01F27/30 , H01F27/28
CPC分类号： H01F27/2866 , H01F27/306 , H01F2027/065 , H01F2027/2814
摘要： A transformer without coil racks includes a winding set, multiple conductive plates and an insulation mounting sheet. The winding set includes a coil portion and a magnetic core set running through the coil portion. The magnetic core set includes at least one inner magnetic core portion and at least two outer magnetic core portions that are spaced from each other by a gap. Each conductive plate includes a connecting section and two extended arms connected to two ends of the connecting section and running through the gap. The insulation mounting sheet includes multiple retaining slots corresponding to the gap to allow the extended arms to pass through and multiple retaining portions each being formed between two neighboring retaining slots to prevent the extended arms from contacting each other. The conductive plates run through the retaining slots and are confined by the retaining portions from moving.
摘要翻译：没有线圈架的变压器包括绕组，多个导电板和绝缘安装片。线圈组包括线圈部分和贯穿线圈部分的磁芯组。磁芯组包括至少一个内部磁芯部分和至少两个彼此间隔开的外部磁芯部分。每个导电板包括连接部分和连接到连接部分两端并延伸通过间隙的两个延伸臂。绝缘安装片包括对应于间隙的多个保持槽，以允许延伸的臂通过，并且每个保持部分形成在两个相邻的保持槽之间，以防止伸出的臂彼此接触。导电板穿过保持槽并被保持部分限制移动。

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