Provided is a chip resistor in which cracks, fracture, etc. can be surely prevented from occurring due to thermal stress in solder bonding portions. The chip resistor 1 includes: a ceramic substrate 2 that is shaped like a cuboid; a pair of front electrodes 3 that are provided on lengthwise opposite end portions of a front surface of the ceramic substrate 2; a resistor body 4 that is provided between and connected to the two front electrodes 3; a protective layer 5 that covers the resistor body 4; a pair of back electrodes 6 that are provided on lengthwise opposite end portions of a back surface of the ceramic substrate 2; end-surface electrodes 7 through which the front electrodes 3 and the back electrodes 6 are electrically conductively connected to each other respectively; external electrodes 8 that cover the end-surface electrodes 7; and a pair of insulating resin layers 9 that are provided to cover edge portions of the back electrodes 6; wherein: the pair of insulating resin layers 9 are opposed to each other with interposition of a predetermined interval therebetween on the back surface of the ceramic substrate 2; and at least opposed side end portions of the insulating resin layers 9 are exposed from the external electrodes 8.