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1. 发明授权

US12026439B2 Method for simulating the optical power of a laminated glass 有权
公开(公告)号：US12026439B2
公开(公告)日：2024-07-02
申请号：US16971947
申请日：2019-02-18
申请人： SAINT-GOBAIN GLASS FRANCE
发明人： Yolande Sikali Mamden
IPC分类号： G06F30/20 , B32B17/10 , G01N21/88 , G01N21/958 , G02B27/00
CPC分类号： G06F30/20 , B32B17/10036 , G01N21/958 , G02B27/0012 , B32B2307/40 , B32B2605/00 , G01N2021/8883 , G01N2021/9586
摘要： A simulation method, implemented by computer, simulates the optical power of a laminated glass of given shape liable to be obtained by laminating at least two glass sheets and at least one lamination interlayer, the laminated glass being liable to have an edge, a first main face, and a second main face. The method is suitable for determining a minimum value of optical quality index which a combination of glass sheets must satisfy so as to form a laminated glass of given shape with a given optical quality constraint.

2. 发明申请

US20180149603A1 Defect Discovery And Recipe Optimization For Inspection Of Three-Dimensional Semiconductor Structures 审中-公开
公开(公告)号：US20180149603A1
公开(公告)日：2018-05-31
申请号：US15826019
申请日：2017-11-29
申请人： KLA-Tencor Corporation
发明人： Santosh Bhattacharyya , Devashish Sharma , Christopher Maher , Bo Hua , Philip Measor , Robert M. Danen
IPC分类号： G01N21/95 , G01N23/04 , G01R31/28 , G06T7/00
CPC分类号： G01N21/9505 , G01N21/956 , G01N23/04 , G01N2021/8883 , G01N2223/6462 , G01R31/2831 , G01R31/311 , G06T7/001 , G06T2207/10061 , G06T2207/20081 , G06T2207/20084 , G06T2207/30148
摘要： Methods and systems for discovery of defects of interest (DOI) buried within three dimensional semiconductor structures and recipe optimization are described herein. The volume of a semiconductor wafer subject to defect discovery and verification is reduced by storing images associated with a subset of the total depth of the semiconductor structures under measurement. Image patches associated with defect locations at one or more focus planes or focus ranges are recorded. The number of optical modes under consideration is reduced based on any of a comparison of one or more measured wafer level defect signatures and one or more expected wafer level defect signatures, measured defect signal to noise ratio, and defects verified without de-processing. Furthermore, verified defects and recorded images are employed to train a nuisance filter and optimize the measurement recipe. The trained nuisance filter is applied to defect images to select the optimal optical mode for production.

3. 发明申请

US20180106717A1 MEASURING A SIZE DISTRIBUTION OF NUCLEIC ACID MOLECULES IN A SAMPLE 审中-公开
公开(公告)号：US20180106717A1
公开(公告)日：2018-04-19
申请号：US15715761
申请日：2017-09-26
申请人： Government of the United States of America, as represented by the Secretary of Commerce
发明人： SAMUEL MARTIN STAVIS , CRAIG ROBERT COPELAND
IPC分类号： G01N21/31 , C12N15/10 , G02B21/36 , G01N1/30 , G01N21/64 , G01N21/89 , C12Q1/6825
CPC分类号： G01N21/314 , C12N15/1006 , C12Q1/68 , C12Q1/6825 , G01N1/30 , G01N21/6428 , G01N21/6458 , G01N21/8903 , G01N2021/174 , G01N2021/3129 , G01N2021/3196 , G01N2021/556 , G01N2021/558 , G01N2021/6419 , G01N2021/6441 , G01N2021/6491 , G01N2021/7756 , G01N2021/8883 , G01N2201/1247 , G02B21/361 , G02B21/367 , C12Q2525/204 , C12Q2563/107 , C12Q2565/601
摘要： A process for measuring a size distribution of a plurality of nucleic acid molecules, the process comprising: labeling the nucleic acid molecules with a fluorescent dye comprising a plurality of fluorescent dye molecules to form labeled nucleic acid molecules, such that a number of fluorescent dyes molecules attached to each nucleic acid molecule is reliably proportional to the number of base pairs in the nucleic acid molecule, the fluorescent dye molecules having a first florescence spectrum; producing, by the labeled nucleic acid molecules, the first florescence spectrum in response to irradiating the labeled nucleic acid molecules at the first wavelength; and detecting the first florescence spectrum to measure the size distribution of the plurality of nucleic acid molecules.

4. 发明申请

US20160123898A1 Wafer Defect Discovery 有权
标题翻译：晶圆缺陷发现
公开(公告)号：US20160123898A1
公开(公告)日：2016-05-05
申请号：US14931226
申请日：2015-11-03
申请人： KLA-Tencor Corporation
发明人： Hong Chen , Kenong Wu , Martin Plihal , Vidur Pandita , Ravikumar Sanapala , Vivek Bhagat , Rahul Lakhawat , Oksen Baris , Rajesh Ramachandran , Naoshin Haque
IPC分类号： G01N21/95
CPC分类号： H01J37/28 , G01N21/8851 , G01N21/9501 , G01N2021/8854 , G01N2021/8883 , G03F7/70625 , G03F7/7065 , H01J2237/24592
摘要： Systems and methods for discovering defects on a wafer are provided. One method includes detecting defects on a wafer by applying a threshold to output generated by a detector in a first scan of the wafer and determining values for features of the detected defects. The method also includes automatically ranking the features, identifying feature cut-lines to group the defect into bins, and, for each of the bins, determining one or more parameters that if applied to the values for the features of the defects in each of the bins will result in a predetermined number of the defects in each of the bins. The method also includes applying the one or more determined parameters to the output generated by the detector in a second scan of the wafer to generate a defect population that has a predetermined defect count and is diversified in the values for the features.
摘要翻译：提供了发现晶片缺陷的系统和方法。一种方法包括通过在晶片的第一次扫描中施加由检测器产生的输出的阈值来检测晶片上的缺陷，并确定检测到的缺陷的特征的值。该方法还包括对特征进行自动排序，识别特征切割线以将缺陷分组成箱，并且对于每个箱，确定一个或多个参数，如果应用于每个中的缺陷的特征的值箱将导致每个箱中预定数量的缺陷。该方法还包括将一个或多个确定的参数应用于在晶片的第二次扫描中由检测器产生的输出，以产生具有预定缺陷计数并且在特征值中多样化的缺陷群体。

5. 发明申请

US20120141010A1 IMAGE ANALYSIS DEVICE AND METHOD 失效
标题翻译：图像分析装置及方法
公开(公告)号：US20120141010A1
公开(公告)日：2012-06-07
申请号：US13211320
申请日：2011-08-17
申请人： WEN-WU WU , MENG-ZHOU LIU , XIAO-JUN FU
发明人： WEN-WU WU , MENG-ZHOU LIU , XIAO-JUN FU
IPC分类号： G06K9/64
CPC分类号： G01N21/95607 , G01N21/8851 , G01N2021/8883 , G06T7/001 , G06T2207/30141
摘要： An image analysis device reads a reference image and a real-time image of a printed circuit board (PCB), determines feature points and feature information of the feature points in the reference image; and creates two 1×N matrices based on the feature points. Furthermore, a mapping matrix is determined based on the two 1×N matrices. The device then reads coordinates of base points designated in the reference image, and determines matching points in the real-time image based on the coordinates of base points and the mapping matrix. A reference region in the reference image is determined based on all the base points, and a matching region is determined in the real-time image based on all the matching points. The reference region and the matching region are compared to determine existence of any surface feature defects of the PCB.
摘要翻译：图像分析装置读取参考图像和印刷电路板（PCB）的实时图像，确定参考图像中特征点的特征点和特征信息; 并基于特征点创建两个1×N矩阵。此外，基于两个1×N矩阵来确定映射矩阵。然后，该装置读取参考图像中指定的基点的坐标，并且基于基点和映射矩阵的坐标来确定实时图像中的匹配点。基于所有基点确定参考图像中的参考区域，并且基于所有匹配点在实时图像中确定匹配区域。比较参考区域和匹配区域以确定PCB的任何表面特征缺陷的存在。

6. 发明授权

US07239735B2 Pattern inspection method and pattern inspection device 有权
标题翻译：图案检验方法和图案检查装置
公开(公告)号：US07239735B2
公开(公告)日：2007-07-03
申请号：US09735840
申请日：2000-12-13
申请人： Takeo Nozaki
发明人： Takeo Nozaki
IPC分类号： G06K9/00 , G01N37/00 , G06F19/00 , G01C17/38 , G01P21/00 , G06K9/40 , G06F15/00 , H03F1/26 , H04B15/00
CPC分类号： G06T7/001 , G01N21/8851 , G01N21/95607 , G01N2021/8883 , G01R31/311 , G06T2207/30148
摘要： In this pattern inspection device, the optical scanning section scans the inspected pattern using a laser beam. A photoelectric image processing section generates an image of the inspected pattern. A reference image generation section calculates the gray level of each pixel according to the number of sub-pixels belonging to the pattern developed in each pixel and calculates the pattern width for the inspected pattern and the reference data with treating the count obtained by dividing the gray level by the gray level step count as the width of the pattern developed in that pixel.
摘要翻译：在该图案检查装置中，光扫描部使用激光扫描被检查图案。光电图像处理部生成检查图案的图像。参考图像生成部根据属于各像素中显示的图案的子像素的个数计算各像素的灰度，并且通过对灰度图像进行分割而得到的计数来计算检查图案的图案宽度和参照数据通过灰度级级数的级别作为在该像素中显影的图案的宽度。

7. 发明授权

US11900028B2 Scatterometry system and method 有权
公开(公告)号：US11900028B2
公开(公告)日：2024-02-13
申请号：US17301548
申请日：2021-04-06
申请人： NOVA LTD.
发明人： Ruslan Berdichevsky , Eyal Grubner , Shai Segev
IPC分类号： G01N21/88 , G01N21/956 , G06F30/20
CPC分类号： G06F30/20 , G01N21/8851 , G01N21/956 , G01N2021/8883
摘要： Scatterometry analysis for a patterned structure, in which a patterned structure model is provided having a selected number of virtual segment data pieces indicative of a respective number of segments of the patterned structure along Z-axis through the structure, the segment data pieces processed for determining a matrix comprising Z-axis derivatives of electromagnetic elds' response of the segment to incident eld based on Maxwell's equations' solution, transforming this matrix into an approximated response matrix corresponding to the electromagnetic eld interaction between two different points spaced along the Z-axis, the transformation preferably carried out by a GPU, and comprises embedding the matrix in a series expansion of the matrix exponential term, the approximated response matrices for all the segment data pieces are multiplied for determining a general propagation matrix utilized to determine a scattering matrix for the patterned structure.

8. 发明公开

US20230393078A1 Identifying 3D Objects 审中-公开
公开(公告)号：US20230393078A1
公开(公告)日：2023-12-07
申请号：US18250757
申请日：2021-12-08
申请人： FUNDACIÓ INSTITUT DE CIÈNCIES FOTÒNIQUES , INSTITUCIÓ CATALANA DE RECERCA I ESTUDIS AVANÇATS
发明人： Valerio PRUNERI , Mehmet Alican NOYAN , Anatoly GRUDININ
IPC分类号： G01N21/87 , G01N21/88 , G01N21/3563 , G06N3/045
CPC分类号： G01N21/87 , G01N21/8851 , G01N21/3563 , G06N3/045 , G01N2021/8883 , G01N2021/3595
摘要： Identifying 3D objects A method for identification of 3D objects comprises illuminating at least part of a 3D object with electromagnetic radiation, spectroscopically obtaining spectral data for one or more regions of the 3D object, and generating, at a data processing apparatus, an identification result for the 3D object using a trained machine learning model. The trained machine learning model processes the obtained spectral data for the one or more regions to generate one or more model outputs from which the identification result is derived.

9. 发明公开

US20230258574A1 METHOD FOR DETECTING DEFECTS IN A COMPONENT, METHOD FOR TRAINING A MACHINE LEARNING SYSTEM, COMPUTER PROGRAM PRODUCT, COMPUTER-READABLE MEDIUM, AND SYSTEM FOR DETECTING DEFECTS IN A COMPONENT 审中-公开
公开(公告)号：US20230258574A1
公开(公告)日：2023-08-17
申请号：US17619135
申请日：2020-06-24
申请人： MTU Aero Engines AG
发明人： Marius BONHAGE , Lars ASCHERMANN , Frank SEIDEL , Uwe SCHULZE , Matthias LÜTKE , Philipp DÖBBER
IPC分类号： G01N21/91 , G06T7/00
CPC分类号： G01N21/91 , G06T7/0004 , G01N2021/8883
摘要： Provided is a method for detecting defects, in particular cracks and/or pores, in a component, in particular in a component of a turbomachine, preferably in a component of an engine, the method including the following steps: applying penetrant to at least a sub-region of the component such that the penetrant penetrates into any defects, in particular cracks and/or pores, present in the component; cleaning the surface of the component of penetrant that has not penetrated into defects, in particular cracks and/or pores, of the component; capturing an image, in particular a complete image, of the component; inputting the captured image into a machine learning system trained to detect defects, in particular cracks and/or pores; and detecting defects, in particular cracks and/or pores, in the component by machine learning system on the basis of light emitted and/or reflected by the penetrant in the defects, in particular cracks and/or pores.

10. 发明申请

US20180144996A1 SYSTEM, METHOD AND NON-TRANSITORY COMPUTER READABLE MEDIUM FOR TUNING SENSITIVIES OF, AND DETERMINNG A PROCESS WINDOW FOR, A MODULATED WAFER 审中-公开
公开(公告)号：US20180144996A1
公开(公告)日：2018-05-24
申请号：US15813004
申请日：2017-11-14
申请人： KLA-Tencor Corporation
发明人： David Craig Oram , Abhinav Mathur , Kenong Wu , Eugene Shifrin
IPC分类号： H01L21/66 , H01L21/67 , G01N21/88 , G01N21/95
CPC分类号： H01L22/12 , G01N21/8806 , G01N21/9501 , G01N2021/8825 , G01N2021/8848 , G01N2021/8883 , H01L21/67288 , H01L22/20
摘要： A system, method, and non-transitory computer readable medium are provided for tuning sensitivities of, and determining a process window for, a modulated wafer. The sensitivities for dies of the modulated wafer are tuned dynamically based on a single set of parameters. Further, the process window is determined for the modulated wafer from prior determined parameter-specific nominal process windows.

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