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    • 8. 发明申请
    • OUTER LAYER HAVING ENTANGLEMENT OF HYDROPHOBIC POLYMER HOST AND HYDROPHILIC POLYMER GUEST
    • 具有疏水性聚合物主体和聚合物聚合物接头的外层
    • US20140093717A1
    • 2014-04-03
    • US14013856
    • 2013-08-29
    • COLORADO STATE UNIVERSITY RESEARCH FOUNDATION
    • Susan P. JAMESMin ZHANGGuy BEAUREGARD
    • C08J9/42B29C67/24B05D5/00
    • C08J9/42B05D5/00B29C67/24C08B37/00C08B37/0072C08L5/08C08L101/00Y10T428/249953Y10T428/31504Y10T428/31855Y10T428/31971C08L2666/02C08L2666/26
    • An outer layer having an entanglement comprising an intermingling of cloaked hydrophilic guest and a hydrophobic polymer host, wherein molecules of the guest have been crosslinked with each other. Under certain circumstances, using complexes of the guest may be desirable or even necessary. The intermingling of the guest and host includes a physical tangling, whether it also comprises crosslinking by primary bonding (e.g., chemical/covalent bonding) there-between. Also a method of producing an outer layer having such an entanglement, including the steps of: temporarily cloaking at least a portion of the hydrophilic groups of the guest; intermingling at least a portion of the cloaked groups with a porous polymeric structure by diffusing the guest with cloaked groups into at least a portion of the structure's pores; within the pores, crosslinking at least a portion of the molecules of the guest with the guest; and removing the cloaking. Cloaking may be performed by silylation or acylation. Intermingling may be performed by producing a mixture of guest and host (whether in solution, powdered, granular, etc., form); next, a crosslinking of the guest with itself is performed; then, the mixture is molded into the outer layer.
    • 具有缠结的外层,其包含掩蔽的亲水客体和疏水性聚合物主体的混合物,其中客体的分子彼此交联。 在某些情况下,使用客人的复合物可能是理想的或甚至是必需的。 客人和主持人的混合包括物理缠结,无论其是否还包括通过其间的初次键合(例如,化学/共价键合)的交联。 还有一种制造具有这种缠结的外层的方法,包括以下步骤:暂时隐藏客人的至少一部分亲水基团; 通过将具有掩蔽基团的客体扩散到结构的孔的至少一部分中来将具有多孔聚合物结构的至少一部分掩蔽组混合; 在孔内,与客体交联客体的至少一部分分子; 并去除隐形。 掩蔽可以通过甲硅烷基化或酰化进行。 混合可以通过生产客体和主机的混合物(无论是溶液,粉末,颗粒等)形式进行; 接下来,进行客人与其自身的交联; 然后将混合物模塑成外层。
    • 9. 发明申请
    • COMPOSITE MATERIAL, HIGH-FREQUENCY CIRCUIT BASEBOARD MADE THEREFROM AND PRODUCTION METHOD THEREOF
    • 复合材料,高频电路板及其制造方法
    • US20140057094A1
    • 2014-02-27
    • US14115748
    • 2011-09-14
    • Minshe Su
    • Minshe Su
    • H05K1/03
    • H05K1/0373B32B27/04C08J5/18C08J9/42C08J2201/038C08J2327/18C08J2427/18H05K1/024H05K1/036H05K1/0366H05K2201/0116H05K2201/015H05K2201/0209Y10T428/249955Y10T428/249958Y10T428/3154
    • Disclosed is a composite material, a high-frequency circuit baseboard made therefrom and a production method thereof. The composite material comprises: a dispersed emulsion of fluoropolymer with a low dielectric loss; a porous, expanded polytetrafluoroethylene film;and a powdery packing. The high-frequency circuit baseboard made from the composite material comprises: several laminated sheets of prepreg made from the composite material, and copper foils pressed over the two sides thereof. The baseboard uses a porous ePTFE film with an excellent dielectric property as a carrier material, which can lower the dielectric constant and dielectric loss angle tangent of the composite material and high-frequency circuit baseboard; due to good flatness and uniformity of the porous ePTFE film, the dielectric constant of the high-frequency circuit baseboard and prepreg made by using the film as the carrier material is isotropic in both X and Y directions; and the thickness of the prepreg made from the composite material can be regulated by employing porous ePTFE films with a different thickness, which avoids the cracking problem caused by using a thick film produced by casting.
    • 公开了一种复合材料,由其制成的高频电路基板及其制造方法。 复合材料包括:具有低介电损耗的含氟聚合物的分散乳液; 多孔膨胀聚四氟乙烯膜; 和粉状包装。 由复合材料制成的高频电路基板包括:由复合材料制成的多个预浸料层压片,以及在其两侧压制的铜箔。 基板使用具有优良介电性能的多孔ePTFE膜作为载体材料,可以降低复合材料和高频电路基板的介电常数和介电损耗角切线; 由于多孔ePTFE膜的平坦度和均匀性好,通过使用膜作为载体材料制成的高频电路基板和预浸料的介电常数在X方向和Y方向都是各向同性的, 并且可以通过使用不同厚度的多孔ePTFE膜来调节由复合材料制成的预浸料坯的厚度,避免了使用通过铸造制造的厚膜引起的开裂问题。