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    • 2. 发明授权
    • Flexible MEMS thin film without manufactured substrate and process for producing the same
    • 柔性MEMS薄膜无制造底材及其制造方法
    • US07445956B2
    • 2008-11-04
    • US11287427
    • 2005-11-28
    • Wen-Chang Dong
    • Wen-Chang Dong
    • H01L21/44H01L21/48H01L21/50
    • B81C1/0088B81C2201/038H01L2224/16225H01L2224/48227
    • A process for producing flexible MEMS thin film without a manufactured substrate applied in a MEMS manufacture specially includes a method of forming a component interface in the middle between a manufactured substrate and a MEMS thin film formed on the manufactured substrate as a basis, which component interface is so easily destroyed by an external force that the MEMS thin film produced by the mentioned process is easily separated from the manufactured substrate, and the separated MEMS thin film due to out of limitation from the manufactured substrate may be further processed in later working process to obtain a MEMS thin film with special structural features has flexibility and particularly has electrical circuits, micro structure, or MEMS components integrated and manufactured into inside or on its both sides.
    • 用于生产柔性MEMS薄膜的方法,其中没有制造衬底应用于MEMS制造中,特别地包括在所制造的衬底和形成在所制造的衬底上的MEMS薄膜之间的中间形成部件界面的方法, 通过外力容易地破坏由所述工艺制造的MEMS薄膜容易与制造的基板分离,并且由制造的基板不受限制地分离的MEMS薄膜可以在后续工作过程中被进一步处理 获得具有特殊结构特征的MEMS薄膜具有柔性,并且特别地具有集成并制造在其内部或两侧的电路,微结构或MEMS部件。