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    • 8. 发明申请
    • Polymide thin film self-assembly process
    • 聚酰亚胺薄膜自组装工艺
    • US20070039919A1
    • 2007-02-22
    • US11248340
    • 2005-10-13
    • Alex HongI-Yu HuangChih-Hung Wang
    • Alex HongI-Yu HuangChih-Hung Wang
    • B44C1/22C23F1/00C03C15/00
    • B81C1/00007G03F7/0035G03F7/40
    • The invention presents a novel polyimide-based thin film self-assembly technology, including five process steps described as follows: (1) deposits a sacrificial layer and a low-stress microstructure layer on a silicon substrate; (2) patterns and etches the low-stress microstructure layer to provide a stationary part and a movable part of the microstructure; (3) coats a photosensitive polyimide thin film as elastic joint of the microstructure layer and defines the shape by using photolithography technique; (4) releases the sacrificial layer beneath the movable part of microstructure layer by wet etching; (5) lastly proceeds the reflow process of polyimide to result in the contraction of the elastic joint further to rotate and lift the movable part in completion of the self-assembly of the microstructure. As the invention can be extensively applied to a myriad of miniaturizing industries, it can solve all the drawbacks of the prior art manufacturing process and miniaturization.
    • 本发明提出了一种新型的基于聚酰亚胺的薄膜自组装技术,包括以下五个工艺步骤:(1)在硅衬底上沉积牺牲层和低应力微结构层; (2)模拟和蚀刻低应力微结构层,以提供微观结构的固定部分和可移动部分; (3)涂覆感光性聚酰亚胺薄膜作为微结构层的弹性接头,并使用光刻技术限定形状; (4)通过湿法蚀刻在微结构层的可移动部分下方释放牺牲层; (5)最后进行聚酰亚胺的回流处理,导致弹性接头的收缩进一步旋转并提升可移动部件,完成微结构的自组装。 由于本发明可广泛应用于各种小型化行业,因此可以解决现有技术制造工艺和小型化的所有缺陷。