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    • 3. 发明授权
    • Substrate processing apparatus
    • 基板加工装置
    • US09472441B2
    • 2016-10-18
    • US13869849
    • 2013-04-24
    • Ebara Corporation
    • Takahiro OgawaHisajiro Nakano
    • H01L21/687B23B31/12
    • H01L21/68728B23B31/1261H01L21/687Y10T279/18Y10T279/19Y10T279/26
    • A substrate processing apparatus is used for a spin drying apparatus, a pencil-type scrubbing cleaning apparatus, an IPA drying apparatus and the like, which are used as semiconductor wafer processing apparatuses. The substrate processing apparatus includes a substrate stage and a substrate chuck mechanism. The substrate chuck mechanism includes a chuck body having a substrate placing portion configured to place a peripheral portion of a substrate and a guide surface configured to guide an outer circumferential end surface of the substrate and to position the substrate when the substrate is placed on the substrate placing portion, and a chuck claw rotatably supported on the chuck body and configured to hold the peripheral portion of the substrate between the substrate placing portion and the chuck claw by turning the chuck claw inward in a closing direction. The guide surface comprises a first guide surface and a second guide surface which guide the outer circumferential end surface of the substrate and differ in inclinations from each other.
    • 基板处理装置用作用作半导体晶片处理装置的旋转干燥装置,铅笔式洗涤清洗装置,IPA干燥装置等。 基板处理装置包括基板台和基板卡盘机构。 基板卡盘机构包括卡盘主体,该卡盘主体具有将基板的周边部分配置的基板配置部和被配置为引导基板的外周端面的引导面,并且在将基板配置在基板上时使基板定位 以及可旋转地支撑在卡盘主体上的卡盘爪,其构造成通过沿着关闭方向向内转动卡盘爪来将基板的周边部分保持在基板放置部和卡盘爪之间。 引导表面包括引导基板的外周端面并且彼此倾斜不同的第一引导表面和第二引导表面。