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1. 发明授权

US06903456B2 Package carrier having multiple individual ceramic substrates 有权
标题翻译：具有多个单独陶瓷衬底的封装载体
公开(公告)号：US06903456B2
公开(公告)日：2005-06-07
申请号：US10680893
申请日：2003-10-08
申请人： Shao-Pin Ru
发明人： Shao-Pin Ru
IPC分类号： H01L21/44 , H01L21/68 , H01L23/053
CPC分类号： H01L21/568 , H01L21/6835 , H01L24/96 , H01L24/97 , H01L2221/68377 , H01L2924/01006 , H01L2924/01027 , H01L2924/09701 , H01L2924/15787 , H01L2924/18162 , H01L2924/00
摘要： A package carrier has multiple ceramic substrates and a frame with a polymid tape. The frame has multiple through holes for receiving the ceramic substrates. The ceramic substrates are packaged with chips. The frame is made of plastic so the package carrier can be easily cut to separate individual electronic devices. The present invention combines individual ceramic substrates with the plastic frame so the cutting time can be reduced and the quantity of electronic devices fabricated is increased.
摘要翻译：包装载体具有多个陶瓷基板和具有聚粒胶带的框架。框架具有用于接收陶瓷基板的多个通孔。陶瓷基板与芯片一起封装。框架由塑料制成，因此包装托架可以容易地切割以分离各个电子设备。本发明将单独的陶瓷基板与塑料框架结合在一起，从而可以减少切割时间并增加制造的电子装置的数量。

2. 发明申请

US20050067188A1 Thin film circuit integrating thick film resistors thereon and method of fabricating the same 有权
标题翻译：在其上集成厚膜电阻器的薄膜电路及其制造方法
公开(公告)号：US20050067188A1
公开(公告)日：2005-03-31
申请号：US10670416
申请日：2003-09-25
申请人： Shao-Pin Ru
发明人： Shao-Pin Ru
IPC分类号： H05K1/09 , H05K1/16 , H05K3/10 , H05K3/38 , H05K3/30
CPC分类号： H05K1/167 , H05K1/092 , H05K3/108 , H05K3/388 , H05K2203/1461 , Y10T29/49082 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155 , Y10T29/49174 , Y10T29/49194 , Y10T29/49204
摘要： A method of fabricating printed circuit boards integrating thick film resistor components and thin film circuit portions thereon is disclosed. This is a two-phase process, where the first phase is to create multiple thick film resistors, and the second phase is to create a thin film circuit portion on the substrate with thick film resistors in existence, involving the printing of the electrodes and the resistive coating for the thick film resistors, and the printing of a low temperature passivation layer over the resistors; and the thin film circuit is formed by titanium and copper layers over the substrate, and electroplating of interconnections to form copper plated circuit. The present fabrication process does not require drilling of holes nor electroplating of leads to the resistors, thus the whole process can be automated to a greater extent than with conventional techniques.
摘要翻译：公开了一种制造集成厚膜电阻器部件和薄膜电路部分的印刷电路板的方法。这是一个两相工艺，其中第一阶段是制造多个厚膜电阻器，第二阶段是在存在厚膜电阻器的基板上产生薄膜电路部分，其中包括电极的印刷和用于厚膜电阻器的电阻涂层，以及在电阻器上印刷低温钝化层; 并且薄膜电路由衬底上的钛和铜层形成，并且互连电镀形成镀铜电路。本制造工艺不需要钻孔或将电极电镀到电阻器上，因此与常规技术相比，整个过程可以更大程度地自动化。

3. 发明申请

US20110057216A1 Low profile optoelectronic device package 审中-公开
标题翻译：薄型光电器件封装
公开(公告)号：US20110057216A1
公开(公告)日：2011-03-10
申请号：US12584779
申请日：2009-09-10
申请人： Ming-Kuen Chiu , Chin-Ta Fan , Chien-Cheng Wei , Paul Panaccione
发明人： Ming-Kuen Chiu , Chin-Ta Fan , Chien-Cheng Wei , Paul Panaccione
IPC分类号： H01L33/00 , H01L31/0232
CPC分类号： H01L31/0203 , H01L33/54 , H01L2224/16225 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A low profile optoelectronic device package has a matalized transparent substrate, a chip and a dam ring. The matalized transparent substrate has a transparent board, a window area, and a metal pattern formed on a face of the transparent board and around the window area and having at least one outer contact pad and at least two contact pads. An active face of the chip is mounted to the at least two inner contact pads and aligned to the window area. A bottom face of the chip, that is opposite to the active face is further added a soldering layer. The dam ring is sealed a joint between the chip and the matalized transparent substrate so as to define an air cavity among the chip, the matalized transparent substrate and the dam ring. The matalized transparent substrate is used as a substrate and an optical cover of a conventional device package, so the optoelectronic device package provides low profile, small area outline, low fabricating cost and high lighting efficiency.
摘要翻译：薄型光电子器件封装具有成熟的透明衬底，芯片和坝环。成熟的透明基板具有透明板，窗口区域和形成在透明板的表面上并且在窗口区域周围的金属图案，并且具有至少一个外部接触垫和至少两个接触垫。芯片的主动面被安装到至少两个内部接触垫并与窗口区域对准。芯片的与有源面相反的底面进一步添加了焊接层。该密封环密封在芯片和金属化的透明基板之间的接头，以便在芯片，成熟的透明基板和坝环之间形成空气腔。成熟的透明基板用作传统器件封装的基板和光学盖，因此光电子器件封装提供低轮廓，小面积轮廓，低制造成本和高照明效率。

4. 发明申请

US20100175242A1 Method for packaging micro electromechanical systems microphone 有权
标题翻译：微机电系统麦克风包装方法
公开(公告)号：US20100175242A1
公开(公告)日：2010-07-15
申请号：US12319742
申请日：2009-01-12
申请人： Kuo-Jung Wu
发明人： Kuo-Jung Wu
IPC分类号： H04R31/00
CPC分类号： H04R19/005 , H04R19/04 , H04R31/00 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908 , Y10T29/49128 , Y10T29/49155 , Y10T29/49798
摘要： A method for packaging micro electromechanical systems (MEMS) microphone has steps of providing a base, arranging and mounting multiple microphone component assemblies on the base, providing a frame, mounting the frame on the base, forming multiple microphone units, providing a cover; mounting the microphone units on the cover and forming multiple MEMS microphones. Therefore, the MEMS microphones can be produced once in large quantities to save production time and costs.
摘要翻译：用于封装微机电系统（MEMS）麦克风的方法具有在基座上提供底座，布置和安装多个麦克风部件组件的步骤，提供框架，将框架安装在基座上，形成多个麦克风单元，提供盖子; 将麦克风单元安装在盖上并形成多个MEMS麦克风。因此，MEMS麦克风可以大量生产一次，以节省生产时间和成本。

5. 发明申请

US20060024901A1 Method for fabricating a high-frequency and high-power semiconductor module 审中-公开
标题翻译：制造高频大功率半导体模块的方法
公开(公告)号：US20060024901A1
公开(公告)日：2006-02-02
申请号：US10909877
申请日：2004-08-02
申请人： Shao-Pin Ru
发明人： Shao-Pin Ru
IPC分类号： H01L21/20 , H01L21/44
CPC分类号： H01L21/32051 , H01C17/065 , H01L21/76838 , H01L27/013 , H05K1/092 , H05K1/167 , H05K3/108 , H05K3/388 , H05K2201/0317 , H05K2201/0391
摘要： A method for fabricating a high-frequency and high-power semiconductor module uses two stages respectively adopting a thick-film process to form resistors or elements of high impedance, and a thin film process to form precise circuit wires or elements.
摘要翻译：高频大功率半导体模块的制造方法分别采用两层分别采用厚膜工艺形成电阻器或高阻抗元件，以及薄膜工艺以形成精确的电路线或元件。

6. 发明授权

US07934306B2 Method for packaging micro electromechanical systems microphone 有权
标题翻译：微机电系统麦克风包装方法
公开(公告)号：US07934306B2
公开(公告)日：2011-05-03
申请号：US12319742
申请日：2009-01-12
申请人： Kuo-Jung Wu
发明人： Kuo-Jung Wu
IPC分类号： H04R31/00
CPC分类号： H04R19/005 , H04R19/04 , H04R31/00 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908 , Y10T29/49128 , Y10T29/49155 , Y10T29/49798
摘要： A method for packaging micro electromechanical systems (MEMS) microphone has steps of providing a base, arranging and mounting multiple microphone component assemblies on the base, providing a frame, mounting the frame on the base, forming multiple microphone units, providing a cover; mounting the microphone units on the cover and forming multiple MEMS microphones. Therefore, the MEMS microphones can be produced once in large quantities to save production time and costs.
摘要翻译：用于封装微机电系统（MEMS）麦克风的方法具有在基座上提供底座，布置和安装多个麦克风部件组件的步骤，提供框架，将框架安装在基座上，形成多个麦克风单元，提供盖子; 将麦克风单元安装在盖上并形成多个MEMS麦克风。因此，MEMS麦克风可以大量生产一次，以节省生产时间和成本。

7. 发明申请

US20080316716A1 Frame for a packaging method using flexible printed circuit boards and method thereof 审中-公开
标题翻译：使用柔性印刷电路板的封装方法的框架及其方法
公开(公告)号：US20080316716A1
公开(公告)日：2008-12-25
申请号：US11820669
申请日：2007-06-20
申请人： Ting-An Yang
发明人： Ting-An Yang
IPC分类号： H05K1/02 , H05K3/36
CPC分类号： H05K3/0097 , H01L21/6835 , H05K1/189 , H05K3/0008 , H05K3/0052 , H05K2201/09063 , H05K2203/0169 , H05K2203/049 , Y10T29/49126
摘要： A frame for a packaging method using flexible printed circuit boards is provided. Before chips are bonded onto the at least one flexible printed circuit board, the frame is bonded to the at least one flexible printed circuit board to increase strength and weight of the at least one printed circuit board. Therefore, the flexible printed circuit board with the frame is used to package the chip by packaging equipment for a packaging method using printed circuit board.
摘要翻译：提供了一种使用柔性印刷电路板的封装方法的框架。在将芯片粘合到至少一个柔性印刷电路板上之前，框架被结合到至少一个柔性印刷电路板，以增加至少一个印刷电路板的强度和重量。因此，具有框架的柔性印刷电路板用于通过使用印刷电路板的封装方法的包装设备来封装芯片。

8. 发明授权

US07100270B2 Method of fabricating a thin film integrated circuit with thick film resistors 有权
标题翻译：用厚膜电阻制造薄膜集成电路的方法
公开(公告)号：US07100270B2
公开(公告)日：2006-09-05
申请号：US10670416
申请日：2003-09-25
申请人： Shao-Pin Ru
发明人： Shao-Pin Ru
IPC分类号： H01C17/00
CPC分类号： H05K1/167 , H05K1/092 , H05K3/108 , H05K3/388 , H05K2203/1461 , Y10T29/49082 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155 , Y10T29/49174 , Y10T29/49194 , Y10T29/49204
摘要： A method of fabricating printed circuit boards integrating thick film resistor components and thin film circuit portions thereon is disclosed. This is a two-phase process, where the first phase is to create multiple thick film resistors, and the second phase is to create a thin film circuit portion on the substrate with thick film resistors in existence, involving the printing of the electrodes and the resistive coating for the thick film resistors, and the printing of a low temperature passivation layer over the resistors; and the thin film circuit is formed by titanium and copper layers over the substrate, and electroplating of interconnections to form copper plated circuit. The present fabrication process does not require drilling of holes nor electroplating of leads to the resistors, thus the whole process can be automated to a greater extent than with conventional techniques.
摘要翻译：公开了一种制造集成厚膜电阻器部件和薄膜电路部分的印刷电路板的方法。这是一个两相工艺，其中第一阶段是制造多个厚膜电阻器，第二阶段是在存在厚膜电阻器的基板上产生薄膜电路部分，其中包括电极的印刷和用于厚膜电阻器的电阻涂层，以及在电阻器上印刷低温钝化层; 并且薄膜电路由衬底上的钛和铜层形成，并且互连电镀形成镀铜电路。本制造工艺不需要钻孔或将电极电镀到电阻器上，因此与常规技术相比，整个过程可以更大程度地自动化。

9. 发明申请

US20080315383A1 CHIP FRAME FOR OPTICAL DIGITAL PROCESSOR 审中-公开
标题翻译：光学数字处理器芯片框架
公开(公告)号：US20080315383A1
公开(公告)日：2008-12-25
申请号：US11768191
申请日：2007-06-25
申请人： Zzu-Chi Chiu
发明人： Zzu-Chi Chiu
IPC分类号： H01L23/02
CPC分类号： H01L23/32 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A chip frame for an optical digital processor has a body with a concave seat integrally protruding downward from a bottom surface of the body. Multiple dents are defined on the bottom surface of the body to receive conductive elements such as springs. With the conductive elements, the chip frame can electronically contact ground pads on a circuit board, without needing of conductive epoxy coating.
摘要翻译：用于光学数字处理器的芯片框架具有主体，该主体具有从主体的底表面向下整体突出的凹座。在身体的底表面上限定多个凹痕，以接收诸如弹簧的导电元件。使用导电元件，芯片框架可以电连接电路板上的接地焊盘，而不需要导电环氧树脂涂层。

10. 发明申请

US20060096780A1 Thin film circuit integrating thick film resistors thereon 审中-公开
标题翻译：在其上集成厚膜电阻器的薄膜电路
公开(公告)号：US20060096780A1
公开(公告)日：2006-05-11
申请号：US11312730
申请日：2005-12-20
申请人： Shao-Pin Ru
发明人： Shao-Pin Ru
IPC分类号： H05K1/16
CPC分类号： H05K1/167 , H05K1/092 , H05K3/108 , H05K3/388 , H05K2203/1461 , Y10T29/49082 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155 , Y10T29/49174 , Y10T29/49194 , Y10T29/49204
摘要： A method of fabricating printed circuit boards integrating thick film resistor components and thin film circuit portions thereon is disclosed. This is a two-phase process, where the first phase is to create multiple thick film resistors, and the second phase is to create a thin film circuit portion on the substrate with thick film resistors in existence, involving the printing of the electrodes and the resistive coating for the thick film resistors, and the printing of a low temperature passivation layer over the resistors; and the thin film circuit is formed by titanium and copper layers over the substrate, and electroplating of interconnections to form copper plated circuit. The present fabrication process does not require drilling of holes nor electroplating of leads to the resistors, thus the whole process can be automated to a greater extent than with conventional techniques.
摘要翻译：公开了一种制造集成厚膜电阻器部件和薄膜电路部分的印刷电路板的方法。这是一个两相工艺，其中第一阶段是制造多个厚膜电阻器，第二阶段是在存在厚膜电阻器的基板上产生薄膜电路部分，其中包括电极的印刷和用于厚膜电阻器的电阻涂层，以及在电阻器上印刷低温钝化层; 并且薄膜电路由衬底上的钛和铜层形成，并且互连电镀形成镀铜电路。本制造工艺不需要钻孔或将电极电镀到电阻器上，因此与常规技术相比，整个过程可以更大程度地自动化。

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