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1. 发明申请

US20110057216A1 Low profile optoelectronic device package 审中-公开
标题翻译：薄型光电器件封装
公开(公告)号：US20110057216A1
公开(公告)日：2011-03-10
申请号：US12584779
申请日：2009-09-10
申请人： Ming-Kuen Chiu , Chin-Ta Fan , Chien-Cheng Wei , Paul Panaccione
发明人： Ming-Kuen Chiu , Chin-Ta Fan , Chien-Cheng Wei , Paul Panaccione
IPC分类号： H01L33/00 , H01L31/0232
CPC分类号： H01L31/0203 , H01L33/54 , H01L2224/16225 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A low profile optoelectronic device package has a matalized transparent substrate, a chip and a dam ring. The matalized transparent substrate has a transparent board, a window area, and a metal pattern formed on a face of the transparent board and around the window area and having at least one outer contact pad and at least two contact pads. An active face of the chip is mounted to the at least two inner contact pads and aligned to the window area. A bottom face of the chip, that is opposite to the active face is further added a soldering layer. The dam ring is sealed a joint between the chip and the matalized transparent substrate so as to define an air cavity among the chip, the matalized transparent substrate and the dam ring. The matalized transparent substrate is used as a substrate and an optical cover of a conventional device package, so the optoelectronic device package provides low profile, small area outline, low fabricating cost and high lighting efficiency.
摘要翻译：薄型光电子器件封装具有成熟的透明衬底，芯片和坝环。成熟的透明基板具有透明板，窗口区域和形成在透明板的表面上并且在窗口区域周围的金属图案，并且具有至少一个外部接触垫和至少两个接触垫。芯片的主动面被安装到至少两个内部接触垫并与窗口区域对准。芯片的与有源面相反的底面进一步添加了焊接层。该密封环密封在芯片和金属化的透明基板之间的接头，以便在芯片，成熟的透明基板和坝环之间形成空气腔。成熟的透明基板用作传统器件封装的基板和光学盖，因此光电子器件封装提供低轮廓，小面积轮廓，低制造成本和高照明效率。

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