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1. 发明授权

US4091316A Method and apparatus for damping stepper motors 失效
标题翻译：阻尼步进电机的方法和装置
公开(公告)号：US4091316A
公开(公告)日：1978-05-23
申请号：US620125
申请日：1975-09-30
申请人： David Friedman
发明人： David Friedman
IPC分类号： H02P8/32 , G05B19/40
CPC分类号： H02P8/32
摘要： A method and apparatus for damping stepper motors are disclosed. A tachometer feedback is used to modulate the phase angle of the stepper motor command currents to achieve damping.
摘要翻译：公开了一种用于阻尼步进电动机的方法和装置。转速计反馈用于调节步进电机指令电流的相位角以实现阻尼。

2. 发明授权

US3955163A Method of positioning a semiconductor wafer for contact printing 失效
标题翻译：定位用于接触印刷的半导体晶片的方法
公开(公告)号：US3955163A
公开(公告)日：1976-05-04
申请号：US482202
申请日：1974-06-24
申请人： Walter Thomas Novak
发明人： Walter Thomas Novak
IPC分类号： G03B27/20 , G03F7/20 , G03B27/02
CPC分类号： G03F7/707 , G03B27/20 , Y10S438/942 , Y10T279/11
摘要： A non-planar semiconductor wafer chuck having a plurality of outwardly extending channels in the chuck face and a plurality of vacuum/pressure ports extending through the chuck and communicating with the face thereof. When a semiconductor wafer is positioned with respect to an overlying photomask by the chuck, atmospheric pressure is applied to the centrally located port or ports and a vacuum is applied to the peripheral ports of the chuck. The resulting pressure differentials acting in concert with a surrounding vacuum chamber causes the central portion of the wafer to rise against the photomask while the peripheral portions of the wafer are drawn down into the channels. At this point in the operational sequence, the normally trapped nitrogen can escape through breaks in the peripheral seal between the mask and wafer which are formed by the downwardly extending wafer surface in each channel. Thereafter, pressure is applied to all of the ports to press the wafer firmly against the overlying photomask for subsquent exposure.
摘要翻译：一种非平面半导体晶片卡盘，其在卡盘面中具有多个向外延伸的通道，以及多个真空/压力端口，其延伸穿过卡盘并与其表面连通。当半导体晶片通过卡盘相对于上覆的光掩模定位时，大气压力被施加到位于中心的端口上，并且真空被施加到卡盘的周边端口。所产生的与周围真空室一起作用的压力差导致晶片的中心部分抵靠光掩模上升，同时晶片的周边部分被拉入通道。在操作顺序的这一点上，正常捕获的氮气可以通过在每个通道中由向下延伸的晶片表面形成的掩模和晶片之间的周边密封件中的断裂而逸出。此后，对所有端口施加压力以将晶片牢固地压靠在覆盖的光掩模上以进行暴露。

3. 发明授权

US3941486A Wire bonder 失效
标题翻译：焊线机
公开(公告)号：US3941486A
公开(公告)日：1976-03-02
申请号：US475961
申请日：1974-06-03
申请人： Arthur W. Tyler
发明人： Arthur W. Tyler
IPC分类号： G01B11/27
CPC分类号： G01B11/27 , H01L24/78 , H01L2224/78 , H01L2224/78301 , H01L2924/00014
摘要： A thermocompression, tailless wire bonder which permits the bonding operation to take place at any location along the path of the bonding tool without affecting the length of wire protruding below the bonding tool or the location of the end of the wire relative to the torch. A non-frictional wire tensioning device is employed to produce a constant and adjustable tension on the bonding wire. A virtual image, parallax free, optical positioning system is utilized to position the bonding tool.
摘要翻译：一种热压无尾线接合器，其允许接合操作沿着接合工具的路径发生在任何位置处，而不会影响在接合工具下方突出的线的长度或相对于割炬的线的端部的位置。使用非摩擦线张紧装置在接合线上产生恒定和可调节的张力。使用虚拟图像，无视差的光学定位系统来定位焊接工具。

4. 发明授权

US3972424A Automatic wafer loading and pre-alignment system 失效
标题翻译：自动晶片装载和预对准系统
公开(公告)号：US3972424A
公开(公告)日：1976-08-03
申请号：US604805
申请日：1975-08-14
申请人： Kenneth Levy , David Corbin , Alan J. Fleming , David Friedman , Gilbert G. Fryklund , Vance Parker , Gerd Schliemann
发明人： Kenneth Levy , David Corbin , Alan J. Fleming , David Friedman , Gilbert G. Fryklund , Vance Parker , Gerd Schliemann
IPC分类号： H01L21/00 , H01L21/677 , H01L21/68 , B65G47/24
CPC分类号： H01L21/67259 , H01L21/67766 , H01L21/67778 , H01L21/681 , B65H2301/42256
摘要： An automatic wafer loading and pre-alignment system for integrated circuit wafer-mask Aligners. A belt feed track system is employed to transport wafers from a "send" wafer storage carrier to a wafer pre-alignment station. The wafer is machanically pre-aligned with respect to the wafer chuck of the Aligner by means of a roller arm and flat-finder system. After completion of the pre-alignment process, the Aligner turntable is rotated to carry the pre-aligned wafer and chuck to the home position of the turntable and at the same time position another chuck at the pre-alignment station. If the new chuck at the pre-alignment station contains a wafer, the wafer is transported from the chuck to a "receive" wafer storage carrier by means of a belt return track system. The feed and return wafer belt track systems have a common portion between the pre-alignment station and the respective "send" and "receive" wafer storage carriers. Photosensors are used to detect the presence or absence of wafers at critical locations in the loading system and at the pre-alignment station.
摘要翻译：用于集成电路晶片掩模对准器的自动晶片装载和预对准系统。使用带馈送轨道系统将晶片从“发送”晶片存储载体传送到晶片预对准站。相对于对准器的晶片卡盘，通过辊臂和取平器系统机械地预对准晶片。在完成预对准过程之后，Aligner转盘旋转，以将预对准的晶片和卡盘运送到转台的原始位置，同时将另一个卡盘放置在预对准工位。如果预对准站上的新卡盘包含晶片，则通过带返回轨道系统将晶片从卡盘传送到“接收”晶片存储载体。馈送和返回晶片带轨道系统在预对准站和相应的“发送”和“接收”晶片存储载体之间具有公共部分。光传感器用于检测加载系统和预对准站的关键位置处晶圆的存在或不存在。

5. 发明授权

US4133918A Method of marking semiconductors 失效
标题翻译：半导体标记方法
公开(公告)号：US4133918A
公开(公告)日：1979-01-09
申请号：US797738
申请日：1977-05-16
申请人： Douglas P. Simms , Anthony F. White , Carl W. Miller
发明人： Douglas P. Simms , Anthony F. White , Carl W. Miller
IPC分类号： B41F31/02 , B65D47/18 , B05D5/00
CPC分类号： B41F31/02
摘要： A non-contacting, non-clogging, electro-mechanically operated marking device or inker for continuous or intermittently marking a semiconductor wafer die is disclosed together with a method of operating the device. The marking device has an ambient pressure ink reservoir within which is mounted a thin, capillary filament guide tube. A length of filament such as, fishline, is positioned within the tube and secured at one end to the plunger of a solenoid. The distal end of the filament is driven out of the capillary tube by the solenoid to force a small amount of the marking fluid or ink out of the reservoir and onto the die without the filament contacting the die. The solenoid coil is energized by a current pulse having a first current level and a second current level that is less than the first current level. The second current level provides a short holding current for the solenoid to prevent spattering of the marking fluid.
摘要翻译：公开了一种用于连续或间歇地标记半导体晶片管芯的非接触，非堵塞，电机械操作的标记装置或墨水器以及操作该装置的方法。标记装置具有环境压力油墨储存器，其中安装有薄的毛细管丝导管。长丝如钓线位于管内，并在一端固定在螺线管的柱塞上。灯丝的远端由螺线管从毛细管中驱出，以将少量的标记液或墨水从储存器中挤出并流到模具上，而不会使细丝与模具接触。电磁线圈由具有小于第一电流电平的第一电流电平和第二电流电平的电流脉冲通电。第二电流电平为电磁线圈提供短的保持电流，以防止标记液体飞溅。

6. 发明授权

US3969004A Air bearing piston assembly for semiconductor mask-to-wafer aligner 失效
标题翻译：用于半导体掩模到晶圆对准器的空气轴承活塞组件
公开(公告)号：US3969004A
公开(公告)日：1976-07-13
申请号：US494111
申请日：1974-08-02
申请人： Gerd Schliemann
发明人： Gerd Schliemann
IPC分类号： B28D5/00 , F16C7/04 , F16C29/02 , F16C32/06 , G01D11/30 , G03F7/20 , G12B5/00 , H01L21/68
CPC分类号： G03F7/70691 , B28D5/0094 , F16C29/025 , F16C32/0644 , F16C32/067 , F16C7/04 , G01D11/30 , G12B5/00 , H01L21/682
摘要： An air bearing piston assembly for semiconductor mask-to-wafer aligner which utilizes a plurality of air bearings to produce a very low friction and a very predictable force system for bringing a mask into contact and level with a semiconductor wafer. Two small driver pistons are employed to move a main piston. An outside air bearing between a rotation clamp ring and the main piston and an inside air bearing between a piston guide and the main piston produce an almost frictionless system. A third air bearing is established between a leveling ball and the ball table so that the wafer with the chunk can level accurately with a minimum of force against the mask.
摘要翻译：一种用于半导体掩模到晶片对准器的空气轴承活塞组件，其利用多个空气轴承产生非常低的摩擦力和非常可预测的力系统，用于使掩模与半导体晶片接触并平整。采用两个小型司机活塞来移动主活塞。旋转夹环与主活塞之间的外部空气轴承以及活塞导向件和主活塞之间的内部空气轴承产生几乎无摩擦的系统。在调平球和球台之间建立第三空气轴承，使得具有块的晶片可以以对面罩最小的力准确地水准。

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