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1. 发明授权

US3955163A Method of positioning a semiconductor wafer for contact printing 失效
标题翻译：定位用于接触印刷的半导体晶片的方法
公开(公告)号：US3955163A
公开(公告)日：1976-05-04
申请号：US482202
申请日：1974-06-24
申请人： Walter Thomas Novak
发明人： Walter Thomas Novak
IPC分类号： G03B27/20 , G03F7/20 , G03B27/02
CPC分类号： G03F7/707 , G03B27/20 , Y10S438/942 , Y10T279/11
摘要： A non-planar semiconductor wafer chuck having a plurality of outwardly extending channels in the chuck face and a plurality of vacuum/pressure ports extending through the chuck and communicating with the face thereof. When a semiconductor wafer is positioned with respect to an overlying photomask by the chuck, atmospheric pressure is applied to the centrally located port or ports and a vacuum is applied to the peripheral ports of the chuck. The resulting pressure differentials acting in concert with a surrounding vacuum chamber causes the central portion of the wafer to rise against the photomask while the peripheral portions of the wafer are drawn down into the channels. At this point in the operational sequence, the normally trapped nitrogen can escape through breaks in the peripheral seal between the mask and wafer which are formed by the downwardly extending wafer surface in each channel. Thereafter, pressure is applied to all of the ports to press the wafer firmly against the overlying photomask for subsquent exposure.
摘要翻译：一种非平面半导体晶片卡盘，其在卡盘面中具有多个向外延伸的通道，以及多个真空/压力端口，其延伸穿过卡盘并与其表面连通。当半导体晶片通过卡盘相对于上覆的光掩模定位时，大气压力被施加到位于中心的端口上，并且真空被施加到卡盘的周边端口。所产生的与周围真空室一起作用的压力差导致晶片的中心部分抵靠光掩模上升，同时晶片的周边部分被拉入通道。在操作顺序的这一点上，正常捕获的氮气可以通过在每个通道中由向下延伸的晶片表面形成的掩模和晶片之间的周边密封件中的断裂而逸出。此后，对所有端口施加压力以将晶片牢固地压靠在覆盖的光掩模上以进行暴露。

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