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    • 1. 发明授权
    • Thermostable gluconate dehydratase and use thereof
    • 高温葡萄糖酸脱水酶及其用途
    • US08383375B2
    • 2013-02-26
    • US12910768
    • 2010-10-22
    • Seonghun KimSun Bok Lee
    • Seonghun KimSun Bok Lee
    • C12P7/58C12P7/42C12P7/50
    • C12N9/88C12P7/58C12Y402/01039
    • The present invention relates to a novel thermostable gluconate dehydratase from the thermoacidophilic archaeon Sulfolobus solfataricus, a coding sequence, and an expression system. The gluconate dehydratase has a molecular weight of about 320,000 to 380,000 daltons as the native protein, and about 40,000 to 50,000 daltons as the monomer protein, and catalyzes the dehydration reaction of aldonic acids to 2-keto-3-deoxy derivatives at temperatures of less than 120° C. The gluconate dehydratase can be produced from native or recombinant host cells and thereby used in the pharmaceutical, agricultural, and other industries.
    • 本发明涉及一种来自热嗜性古细菌Sulfolobus solfataricus的新型耐热葡萄糖酸盐脱水酶,编码序列和表达系统。 葡萄糖酸脱水酶的天然蛋白质的分子量约为320,000至380,000道尔顿,单体蛋白为约40,000至50,000道尔顿,并在较少的温度下催化醛糖酸与2-酮-3-脱氧衍生物的脱水反应 超过120℃。葡萄糖酸脱水酶可由天然或重组宿主细胞产生,从而用于制药,农业和其他工业。
    • 2. 发明申请
    • GaN COMPOUND SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURING THE SAME
    • GaN化合物半导体发光元件及其制造方法
    • US20120146081A1
    • 2012-06-14
    • US13399474
    • 2012-02-17
    • Jong Lam LEE
    • Jong Lam LEE
    • H01L33/60
    • H01L33/40H01L33/0079H01L33/32H01L33/387H01L33/405H01L33/44
    • The present invention relates to a gallium nitride (GaN) compound semiconductor light emitting element (LED) and a method of manufacturing the same. The present invention provides a vertical GaN LED capable of improving the characteristics of a horizontal LED by means of a metallic protective film layer and a metallic support layer. According to the present invention, a metallic protective film layer with a thickness of at least 10 microns may be formed on the lateral and/or bottom sides of the vertical GaN LED. Further, a metallic substrate may be used instead of a sapphire substrate. A metallic support layer may be formed to protect the element from being distorted or damaged. Furthermore, a P-type electrode may be partially formed on a P—GaN layer in a mesh form.
    • 本发明涉及一种氮化镓(GaN)化合物半导体发光元件(LED)及其制造方法。 本发明提供一种能够通过金属保护膜层和金属支撑层改善水平LED的特性的垂直GaN LED。 根据本发明,可以在垂直GaN LED的横向和/或底侧上形成厚度至少为10微米的金属保护膜层。 此外,可以使用金属基板代替蓝宝石基板。 可以形成金属支撑层以保护元件不被扭曲或损坏。 此外,P型电极可以以网状形式部分地形成在P-GaN层上。
    • 4. 发明申请
    • GaN COMPOUND SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURING THE SAME
    • GaN化合物半导体发光元件及其制造方法
    • US20110278628A1
    • 2011-11-17
    • US13192848
    • 2011-07-28
    • Jong Lam LEE
    • Jong Lam LEE
    • H01L33/60
    • H01L33/40H01L33/0079H01L33/32H01L33/387H01L33/405H01L33/44
    • The present invention relates to a gallium nitride (GaN) compound semiconductor light emitting element (LED) and a method of manufacturing the same. The present invention provides a vertical GaN LED capable of improving the characteristics of a horizontal LED by means of a metallic protective film layer and a metallic support layer. According to the present invention, a thick metallic protective film layer with a thickness of at least 10 microns is formed on the lateral and/or bottom sides of the vertical GaN LED to protect the element against external impact and to easily separate the chip. Further, a metallic substrate is used instead of a sapphire substrate to efficiently release the generated heat to the outside when the element is operated, so that the LED can be suitable for a high-power application and an element having improved optical output characteristics can also be manufactured. A metallic support layer is formed to protect the element from being distorted or damaged due to impact. Furthermore, a P-type electrode is partially formed on a P-GaN layer in a mesh form to thereby maximize the emission of photons generated in the active layer toward the N-GaN layer.
    • 本发明涉及一种氮化镓(GaN)化合物半导体发光元件(LED)及其制造方法。 本发明提供一种能够通过金属保护膜层和金属支撑层改善水平LED的特性的垂直GaN LED。 根据本发明,在垂直GaN LED的侧面和/或底面上形成厚度至少为10微米的厚金属保护膜层,以保护元件免受外部冲击并容易地分离芯片。 此外,当元件被操作时,使用金属基板代替蓝宝石基板以有效地将产生的热量释放到外部,使得LED可适用于大功率应用,并且具有改善的光输出特性的元件也可以 制造。 形成金属支撑层以保护元件免于由于冲击而变形或损坏。 此外,P型电极以网格形式部分地形成在P-GaN层上,从而最大限度地发挥在有源层中朝向N-GaN层产生的光子。
    • 7. 发明申请
    • METHOD FOR FORMING OHMIC ELECTRODE AND SEMICONDUCTOR LIGHT EMITTING ELEMENT
    • 形成OHMIC电极和半导体发光元件的方法
    • US20110210363A1
    • 2011-09-01
    • US13102589
    • 2011-05-06
    • Jong-Lam LEE
    • Jong-Lam LEE
    • H01L33/60
    • H01L33/405H01L33/0095H01L33/32
    • The present invention relates to a method of forming an ohmic electrode in a semiconductor light emitting element, comprising: forming a semiconductor layer having a light emitting structure on a substrate, sequentially laminating a bonding layer, a reflective layer and a protective layer on the semiconductor layer, and forming an ohmic electrode by performing a heat treatment process to form ohmic bonding between the semiconductor layer and the bonding layer and to form an oxide film on at least a portion of the protective layer; and a semiconductor light emitting element using the ohmic electrode. According to the present invention, since a reflective layer is formed of Ag, Al and an alloy thereof with excellent light reflectivity, the light availability is enhanced. Further, since contact resistance between a semiconductor layer and a bonding layer is small, it is easy to apply large current for high power.
    • 本发明涉及一种在半导体发光元件中形成欧姆电极的方法,包括:在衬底上形成具有发光结构的半导体层,在半导体上依次层叠结合层,反射层和保护层 并通过进行热处理工艺形成欧姆电极,以在半导体层和接合层之间形成欧姆接合,并在保护层的至少一部分上形成氧化膜; 以及使用欧姆电极的半导体发光元件。 根据本发明,由于反射层由具有优异的光反射率的Ag,Al及其合金形成,所以光可用性得到提高。 此外,由于半导体层和接合层之间的接触电阻小,因此容易施加大电流用于大功率。