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    • 1. 发明授权
    • Down-stream plasma etching with deflectable radical stream
    • 下游等离子体蚀刻具有可偏转的自由基流
    • US08187484B2
    • 2012-05-29
    • US12083138
    • 2005-10-05
    • Jeff Alistair Hill
    • Jeff Alistair Hill
    • B44C1/22C03C15/00C03C25/68C23F1/00
    • H01J37/32357H01J37/3244
    • The invention relates to a process for etching a substrate (3) in an etching chamber (1) with a plasma ignited outside of the etching chamber (1). The process is characterized in that during the etching process at least temporarily at least one gas jet (10) is directed from the side to the radical stream (7) which is directed towards the substrate (3). Furthermore the invention relates to an etching chamber for etching of a substrate (3) with a substrate holder (2) and a plasma source (4) remote to the substrate holder (2), which is characterized in that between the substrate holder (2) and the plasma source (4) at least one nozzle (9) for lateral introduction of a gas jet (10) into the etching chamber (1) is provided. With this invention the distribution of the active species on the surface of a substrate can be easily influenced.
    • 本发明涉及一种用蚀刻室(1)内的等离子体点蚀蚀刻室(1)中的衬底(3)的方法。 该方法的特征在于,在蚀刻过程期间,至少暂时将至少一个气体射流(10)从侧面引导至指向基底(3)的自由基流(7)。 此外,本发明涉及一种用于用衬底保持器(2)蚀刻衬底(3)和远离衬底保持器(2)的等离子体源(4)的蚀刻室,其特征在于,在衬底保持器(2) )和等离子体源(4),提供用于将气体射流(10)侧向引入蚀刻室(1)的至少一个喷嘴(9)。 通过本发明,可以容易地影响活性物质在基材表面上的分布。