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1. 发明授权

US5399905A Resin sealed semiconductor device including multiple current detecting resistors 失效
标题翻译：树脂密封的半导体器件包括多个电流检测电阻
公开(公告)号：US5399905A
公开(公告)日：1995-03-21
申请号：US182710
申请日：1994-01-13
申请人： Ziro Honda , Takashi Takahashi
发明人： Ziro Honda , Takashi Takahashi
IPC分类号： G01R15/14 , G01R1/20 , H01L23/48 , H01L23/495 , H01L23/50 , H01L23/16 , H01L29/44 , H01L29/52
CPC分类号： H01L24/49 , G01R1/203 , H01L23/495 , H01L23/49562 , H01L23/49575 , H01L2224/48091 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L24/48 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/19105
摘要： A resin sealed semiconductor device has a plurality of current-detecting resistors mounted and electrically connected in parallel on leads of a lead frame for detecting the current flowing in a semiconductor element mounted on the lead frame. Mounting n current-detecting resistors in parallel reduces the increase in resistance due to mounting to 1/nth the conventional value. Accordingly, changes in resistance values during mounting are minimized for accurate current measurement.
摘要翻译：树脂密封半导体器件具有多个电流检测电阻器，其安装并并联电连接在引线框架的引线上，用于检测在安装在引线框架上的半导体元件中流动的电流。安装n个电流检测电阻并联减少了由于安装到常规值的1 / n的电阻增加。因此，为了精确的电流测量，安装期间的电阻值的变化被最小化。

2. 发明授权

US5495223A Hybrid integrated circuit device 失效
标题翻译：混合集成电路器件
公开(公告)号：US5495223A
公开(公告)日：1996-02-27
申请号：US168184
申请日：1993-12-17
申请人： Ziro Honda , Takashi Takahashi
发明人： Ziro Honda , Takashi Takahashi
IPC分类号： H05K1/18 , H01C1/144 , H05K3/34
CPC分类号： H05K3/3426 , H01C1/144 , H05K3/3442 , H05K2201/10477 , H05K2201/10636 , H05K2201/10916 , Y02P70/611 , Y02P70/613
摘要： A hybrid integrated circuit device includes a circuit board having at least two electrical conductors; a chip resistor bridgingly disposed across two of the electrical conductors of the circuit board; and solder electrically connecting the chip resistor to the two electrical conductors. The chip resistor has an electrically insulating substrate, two electrodes disposed on the electrically insulating substrate, separated from each other, and each electrode has a contact end electrically contacting the electrical conductors of the circuit board and a resistor element disposed on the electrically insulating substrate and electrically connected to the contact ends of the electrodes. The solder electrically connects the electrodes of the chip resistor to the electrical conductors of the circuit board.
摘要翻译：混合集成电路装置包括具有至少两个电导体的电路板; 桥接电路，跨过电路板的两个电导体; 以及将芯片电阻器与两个电导体电连接的焊料。芯片电阻器具有电绝缘基板，设置在电绝缘基板上的两个电极彼此分离，并且每个电极具有与电路板的电导体和设置在电绝缘基板上的电阻元件电接触的接触端，电连接到电极的接触端。焊料将芯片电阻器的电极与电路板的电导体电连接。

3. 发明授权

US5596497A Control circuit for vehicle safety device 失效
标题翻译：车辆安全装置控制电路
公开(公告)号：US5596497A
公开(公告)日：1997-01-21
申请号：US389788
申请日：1995-02-16
申请人： Ziro Honda
发明人： Ziro Honda
IPC分类号： B60R21/16 , B60R21/01 , H03G11/00 , B60R21/32
CPC分类号： B60R21/017 , B60R21/0173
摘要： A control circuit for a vehicle safety device of the invention includes a starting circuit for starting the vehicle safety device by electrical energy supplied from a power supply section. A starting signal generating circuit detects vehicle collision and generates a starting signal based upon the results of the detection. A starting control circuit is provided to detect a vehicle collision and generate a starting signal. A starting control circuit is connected between a power supply section and the starting circuit. The starting control circuit supplies current from the power supply section to the starting circuit when the starting signal has been generated by the starting signal generating circuit, and blocks supply of current from the power supply section to the starting circuit when the current value has exceeded a predetermined value.
摘要翻译：本发明的车辆安全装置的控制电路包括起动电路，其通过从电源部供给的电能来起动车辆安全装置。启动信号发生电路检测车辆碰撞，并根据检测结果生成启动信号。提供启动控制电路以检测车辆碰撞并产生起动信号。启动控制电路连接在电源部分和启动电路之间。当起动信号发生电路产生起动信号时，起动控制电路从电源部向起动电路供给电流，当电流值超过了起动电路时，阻止从电源部向起动电路供给电流预定值。

4. 发明授权

US5659196A Integrated circuit device for acceleration detection 失效
标题翻译：用于加速度检测的集成电路装置
公开(公告)号：US5659196A
公开(公告)日：1997-08-19
申请号：US633694
申请日：1996-04-19
申请人： Ziro Honda
发明人： Ziro Honda
IPC分类号： G01P15/12 , H01L29/84 , H01L29/82
CPC分类号： G01P15/123 , G01P2015/0831
摘要： An integrated circuit device for acceleration detection (100) includes a thick substrate (1) and a semiconductor strain sensor (2) provided on the thick substrate (1) with conductive solder bump electrodes (8) interposed therebetween. The semiconductor strain sensor (2) has a mass holding part (2b), an acceleration sensing part (2a) provided with a piezoresistance layer, a base end part (2c) fixed on the solder bump electrode (8) and a balance keeping part (2d). Electric signals obtained from the semiconductor strain sensor (2) are connected to pattern wiring lines (7) which are provided on the thick substrate (1) by means of the solder bump electrode (8) interposed therebetween. A space (W) between the thick substrate (1) and the mass holding part (2b) depends upon the solder bump electrode (8). When an acceleration is applied to the integrated circuit device for acceleration detection (100) having the above constitution, the acceleration sensing part (2a) and a mass holding part (2b), and the balance keeping part (2d) vibrate unbalancedly in the respective natural vibration modes which are different from one another above the solder bump electrode (8), affecting one another. Thus, the integrated circuit device for acceleration detection (100) which achieves high yield and quality is provided.
摘要翻译：一种用于加速度检测的集成电路装置（100）包括厚衬底（1）和设置在厚衬底（1）上的导电焊料凸块电极（8）之间的半导体应变传感器（2）。半导体应变传感器（2）具有质量保持部（2b），设置有压阻层的加速度检测部（2a），固定在焊料凸块电极（8）上的基端部（2c）和平衡保持部（2d）。从半导体应变传感器（2）获得的电信号通过插在其间的焊料凸块电极（8）连接到设置在厚基板（1）上的图案布线（7）。厚基板（1）和质量保持部（2b）之间的空间（W）取决于焊料凸块电极（8）。当对具有上述结构的加速度检测用集成电路装置（100）施加加速度时，加速度检测部（2a）和质量保持部（2b）以及平衡保持部（2d）在各自的在焊料凸块电极（8）上方彼此不同的固有振动模式，彼此影响。因此，提供了实现高产量和质量的用于加速度检测的集成电路装置（100）。

5. 发明授权

US5834823A Transistor with constant voltage diode 失效
标题翻译：具有恒压二极管的晶体管
公开(公告)号：US5834823A
公开(公告)日：1998-11-10
申请号：US874504
申请日：1997-06-13
申请人： Ziro Honda
发明人： Ziro Honda
IPC分类号： H01L21/331 , H01L27/07 , H01L29/73 , H01L29/732 , H01L29/866 , H01L29/76
CPC分类号： H01L27/0755 , H01L29/7302
摘要： A power transistor incorporating a constant-voltage diode maintains the breakdown voltage of the constant-voltage diode at a specified level and prevents local breakdown of an insulating film located between an A1 field plate electrode and a base region of the transistor by spacing the A1 field plate electrode located on a collector region by a distance "d" from the base region.
摘要翻译：结合有恒压二极管的功率晶体管将恒压二极管的击穿电压维持在规定的电平，并且通过间隔A1场来防止位于A1场板电极和晶体管的基极区之间的绝缘膜的局部击穿平板电极位于集电极区域上距离基极区域距离“d”。

6. 发明授权

US5459350A Resin sealed type semiconductor device 失效
标题翻译：树脂密封型半导体器件
公开(公告)号：US5459350A
公开(公告)日：1995-10-17
申请号：US318447
申请日：1994-10-05
申请人： Shoji Date , Ziro Honda , Toshiya Nakano , Hazime Kato
发明人： Shoji Date , Ziro Honda , Toshiya Nakano , Hazime Kato
IPC分类号： G01R15/14 , H01L23/48 , H01L23/495 , H01L23/50 , H01L23/16
CPC分类号： H01L23/495 , H01L23/49548 , H01L23/49562 , H01L24/06 , H01L24/49 , H01L2224/04042 , H01L2224/0603 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4516 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48472 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49111 , H01L2224/49113 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/351
摘要： A resin sealed semiconductor device includes a current-detecting resistance for detecting current flowing in a semiconductor element that is a metallic resistance having a coefficient of thermal expansion almost equal to that of the lead frame. Compared to a conventional ceramic chip resistance, its coefficient of thermal expansion differs less from that of the lead frame, thereby preventing deterioration caused by heat stress.
摘要翻译：树脂密封半导体器件包括用于检测在半导体元件中流动的电流检测电阻，该半导体元件是具有几乎等于引线框的热膨胀系数的金属电阻。与常规陶瓷芯片电阻相比，其热膨胀系数与引线框架的热膨胀系数不同，从而防止热应力引起的劣化。

7. 发明授权

US5324977A Hybrid ferromagnetic integrated circuit device 失效
标题翻译：混合铁磁集成电路器件
公开(公告)号：US5324977A
公开(公告)日：1994-06-28
申请号：US978424
申请日：1992-11-18
申请人： Ziro Honda , Masato Imanaka
发明人： Ziro Honda , Masato Imanaka
IPC分类号： H01L43/08 , H01L27/22
CPC分类号： H01L27/22
摘要： A hybrid integrated circuit device has a magnetic sensor formed directly on a substrate by photolithography. Alternatively, a flip chip type magnetic sensor is mounted on a substrate by fusion. The magnetic sensor can be mounted on the substrate with high positional precision.
摘要翻译：混合集成电路器件具有通过光刻直接在衬底上形成的磁传感器。或者，通过融合将倒装芯片型磁传感器安装在基板上。磁传感器可以高位置精度安装在基板上。

8. 发明授权

US5369298A Bipolar transistor having an emitter with interdigitated comb-shaped inner and outer edger 失效
标题翻译：双极晶体管具有带梳齿状的内外边缘的发射器
公开(公告)号：US5369298A
公开(公告)日：1994-11-29
申请号：US088054
申请日：1993-07-08
申请人： Ziro Honda , Yasushi Nomoto
发明人： Ziro Honda , Yasushi Nomoto
IPC分类号： H01L21/331 , H01L29/06 , H01L29/08 , H01L29/73 , H01L29/732 , H01L27/082 , H01L29/70
CPC分类号： H01L29/0804 , H01L29/0692 , H01L29/73
摘要： A semiconductor device has a semiconductor substrate including a base region and an emitter region in the base region. The emitter region in the base region has a comb-teeth-shaped outer edge. The emitter region has a window through which the base region is exposed. The window has an extended ares to reach portions of the emitter region near the comb-teeth-shaped outer edge of the emitter region. Consequently, the area of junction between the window and the emitter region os increased to suppress concentration of electrical current in the window and to improve electrical characteristics such as secondary yield breakdown strength.
摘要翻译：半导体器件具有在基极区域中包括基极区域和发射极区域的半导体衬底。基部区域中的发射极区域具有梳齿形的外边缘。发射极区域具有露出基极区域的窗口。窗口具有扩展的区域，以到达发射极区域的梳齿形外边缘附近的发射极区域的部分。因此，窗口和发射极区域os之间的接合面积增加以抑制窗口中电流的浓度并改善电特性，例如次级屈服击穿强度。

9. 发明授权

US5245510A Hybrid integrated circuit device 失效
标题翻译：混合集成电路器件
公开(公告)号：US5245510A
公开(公告)日：1993-09-14
申请号：US958720
申请日：1992-10-09
申请人： Ziro Honda
发明人： Ziro Honda
IPC分类号： G01K1/14 , G01K7/02 , G05F1/56 , H01L23/34 , H01L23/58 , H01L25/16
CPC分类号： H01L23/34 , H01L25/16 , H01L2224/32225 , H01L2224/45124 , H01L2224/48095 , H01L2224/48227 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/14 , H01L2924/19041 , H01L2924/19105
摘要： A hybrid integrated circuit device has a primary heat sink and a secondary heat sink. A heat-generating semiconductor chip is mounted on the primary heat sink. A thermocouple is embedded in a portion of the primary heat sink immediately below a heat-generating portion of the semiconductor chip. The thermocouple measures the temperature of the heat-generating portion of the semiconductor chip with a high degree of accuracy. Power supplied to the semiconductor chip is controlled in accordance with the measured temperature of the heat-generating portion of the semiconductor chip, thus enabling the semiconductor chip to operate at its full output performance without risk of breakdown due to overheating.
摘要翻译：混合集成电路器件具有主散热器和次级散热器。发热半导体芯片安装在主散热器上。热电偶被嵌入在半导体芯片的发热部分正下方的主散热片的一部分中。热电偶以高精度测量半导体芯片的发热部分的温度。根据半导体芯片的发热部分的测量温度来控制提供给半导体芯片的功率，从而使得半导体芯片能够在其全输出性能下工作，而不会由于过热而导致故障。

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