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    • 6. 发明授权
    • Method of manufacturing an on-chip transformer balun
    • 制造片上变压器平衡不平衡变压器的方法
    • US07171739B2
    • 2007-02-06
    • US10727378
    • 2003-12-04
    • Hung Yu (David) YangJesse A. CastanedaReza Rofougaran
    • Hung Yu (David) YangJesse A. CastanedaReza Rofougaran
    • H01F7/06
    • H03H7/42H01F17/0013H01F19/04H01F2021/125H01L23/5227H01L23/645H01L2924/0002Y10T29/4902Y10T29/49135H01L2924/00
    • A method of manufacturing an on-chip transformer balun includes creating, on a semiconductor substrate, a primary winding having at least one substantially symmetrical primary turn on a first dielectric layer and at least one metal bridge on a second layer. A secondary winding is created on the semiconductor substrate, the secondary winding having at least one substantially symmetrical secondary turn on a third dielectric layer and at least one metal bridge on a fourth dielectric layer. In an alternative embodiment, the primary winding has at least one first primary turn on a first dielectric layer and at least one second primary turn on a second dielectric layer and at least one via that operably connects the first primary turn to the second primary turn. The secondary winding has at least one first secondary turn on a third dielectric layer and at least one second secondary turn on a fourth dielectric layer.
    • 制造片上变压器平衡 - 不平衡变压器的方法包括在半导体衬底上形成在第一介电层上具有至少一个基本对称的初级绕组的初级绕组和在第二层上的至少一个金属桥。 在半导体衬底上产生次级绕组,次级绕组在第三电介质层上具有至少一个基本对称的次级绕组,在第四介电层上具有至少一个金属桥。 在替代实施例中,初级绕组在第一电介质层上具有至少一个第一初级绕组,在第二电介质层上具有至少一个第二初级转弯,以及至少一个通孔,其可操作地将第一初级转弯连接到第二初级转弯。 次级绕组在第三电介质层上具有至少一个第一次级转弯,在第四电介质层上具有至少一个第二次级转弯。