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1. 发明授权

US10013285B2 Locating wireless-enabled components and applications thereof 有权
公开(公告)号：US10013285B2
公开(公告)日：2018-07-03
申请号：US12877941
申请日：2010-09-08
申请人： Arya Reza Behzad , Michael Boers , Jesus Alfonso Castaneda , Ahmadreza Reza Rofougaran , Sam Zhao
发明人： Arya Reza Behzad , Michael Boers , Jesus Alfonso Castaneda , Ahmadreza Reza Rofougaran , Sam Zhao
IPC分类号： G06F9/50 , H04W4/80 , H04B7/10 , H04B5/00 , H04W4/00 , H04W84/18 , H04B7/26
CPC分类号： G06F9/50 , H04B5/0037 , H04B7/10 , H04B7/26 , H04W4/80 , H04W84/18 , Y10T307/492
摘要： Disclosed herein are systems, apparatuses, and methods for locating wireless-enabled components, and applications thereof. Such an apparatus includes a wireless-enabled component (WEC), which may be a functional block of an integrated circuit (IC), an IC, or a device that includes an IC. The WEC includes a functional module (e.g., a processing resource or a memory resource) and an antenna element coupled to the functional module. The antenna element is configured to (i) transmit a search signal to locate a proximally situated WEC and (ii) transmit a communication signal to communicate with the proximally situated WEC. The antenna element may be a phased array, an electrically steered phased array, a mechanically steered phased array, a directional antenna, a mechanically steered directional antenna, an RF antenna, an optical antenna, and/or any combination thereof.

2. 发明授权

US09570420B2 Wireless communicating among vertically arranged integrated circuits (ICs) in a semiconductor package 有权
标题翻译：在半导体封装中的垂直排列的集成电路（IC）之间进行无线通信
公开(公告)号：US09570420B2
公开(公告)日：2017-02-14
申请号：US13248745
申请日：2011-09-29
申请人： Jesus Alfonso Castaneda , Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Michael Boers
发明人： Jesus Alfonso Castaneda , Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Michael Boers
IPC分类号： H01L23/02 , H01L25/065 , H01P3/12 , H01L25/10 , G02B6/43 , G02B6/12 , H01L23/66 , H01L23/522 , H04L7/00 , H01P3/00
CPC分类号： H01L25/0657 , G02B6/12002 , G02B6/43 , H01L23/5222 , H01L23/66 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L2223/6627 , H01L2223/6677 , H01L2224/16225 , H01L2225/06517 , H01L2225/06531 , H01L2225/06572 , H01L2225/1005 , H01L2924/1461 , H01P3/00 , H01P3/12 , H01P3/121 , H04L7/0091 , H01L2924/00
摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.
摘要翻译：公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。功能模块通过集成波导使用多址传输方案彼此通信以及其他集成电路。一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。多芯片模块可以耦合到半导体封装以形成封装的集成电路。

3. 发明授权

US09008589B2 Wireless bus for intra-chip and inter-chip communication, including wireless-enabled component (WEC) embodiments 有权
标题翻译：用于片内和芯片间通信的无线总线，包括无线使能分量（WEC）实施例
公开(公告)号：US09008589B2
公开(公告)日：2015-04-14
申请号：US12877706
申请日：2010-09-08
申请人： Ahmadreza (Reza) Rofougaran , Arya Reza Behzad , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
发明人： Ahmadreza (Reza) Rofougaran , Arya Reza Behzad , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
IPC分类号： H04B1/38 , G06F13/42 , H04B7/10 , G06F13/364 , H04W84/18
CPC分类号： G06F9/50 , H04B5/0037 , H04B7/10 , H04B7/26 , H04W4/80 , H04W84/18 , Y10T307/492
摘要： Embodiments of the present invention are directed to a wireless-enabled component (WEC) for enabling a wireless bus for intra-chip and inter-chip communication. A WEC encompasses a functional block of an IC (such as, for example, a processing core of a processing unit), an entire IC (such as, for example, a processing unit), or a device that includes a plurality of ICs (such as, for example, a handheld device). According to embodiments, a WEC may be associated with one or more sub-blocks of an IC, a single IC, or a plurality of ICs.
摘要翻译：本发明的实施例涉及一种能够使无线总线进行片内和芯片间通信的无线使能分量（WEC）。 WEC包括IC（例如处理单元的处理核心）的功能块，整个IC（例如，处理单元）或包括多个IC的设备（例如手持设备）。根据实施例，WEC可以与IC，单个IC或多个IC的一个或多个子块相关联。

4. 发明授权

US09002673B2 Simultaneous testing of semiconductor components on a wafer 有权
标题翻译：同时测试晶圆上的半导体元件
公开(公告)号：US09002673B2
公开(公告)日：2015-04-07
申请号：US13025657
申请日：2011-02-11
申请人： Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
发明人： Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
IPC分类号： G01R31/14 , G01R31/28 , G01R31/302 , G01R31/311
CPC分类号： G01R31/2834 , G01R31/3025 , G01R31/311
摘要： Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.
摘要翻译：公开了同时无线地测试形成在半导体晶片上的半导体元件的方法和装置。半导体部件通过公共通信信道将各自的测试结果传送到无线自动测试设备。多个接收天线在三维空间中观察多个方向的结果。无线自动测试设备确定一个或多个半导体组件是否按预期运行，并且可选地，可以使用三维空间的属性来确定一个或多个半导体组件的位置。无线测试设备还可以通过检测在独立测试操作之前，期间和/或之后由半导体晶片发射，传输和/或反射的红外能量来确定半导体组件的性能。

5. 发明授权

US08923765B2 Establishing a wireless communications bus and applications thereof 有权
标题翻译：建立无线通信总线及其应用
公开(公告)号：US08923765B2
公开(公告)日：2014-12-30
申请号：US12877868
申请日：2010-09-08
申请人： Arya Reza Behzad , Michael Boers , Jesus Alfonso Castaneda , Ahmadreza (Reza) Rofougaran , Sam Ziqun Zhao
发明人： Arya Reza Behzad , Michael Boers , Jesus Alfonso Castaneda , Ahmadreza (Reza) Rofougaran , Sam Ziqun Zhao
IPC分类号： H04B7/00 , H01L23/48 , H01L23/66 , H04L12/40 , H04W84/18 , H04W8/00
CPC分类号： H04W84/18 , H01L23/48 , H01L23/66 , H01L2223/6677 , H01L2924/0002 , H04L12/4011 , H04W8/005 , H01L2924/00
摘要： Disclosed herein are systems, apparatuses, and methods for establishing wireless communications among a plurality of wireless-enabled components (WECs), and applications thereof. Such a system includes a plurality of WECs, each configured to transmit and receive over a wireless bus. The wireless bus includes (i) a first channel to identify proximally located WECs and (ii) a second channel to support communications among the proximally located WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips across multiple devices.
摘要翻译：这里公开的是用于在多个启用无线组件（WEC）之间建立无线通信的系统，装置和方法及其应用。这样的系统包括多个WEC，每个WEC被配置为通过无线总线进行发送和接收。无线总线包括（i）识别近端位置的WEC的第一信道和（ii）支持在近端位置的WEC之间的通信的第二信道。多个WEC可以位于单个芯片上，在单个设备的多个芯片上，或者位于跨多个设备的多个芯片上。

6. 发明授权

US08884417B2 Wireless communicating among vertically arranged integrated circuits (ICs) in a semiconductor package 有权
公开(公告)号：US08884417B2
公开(公告)日：2014-11-11
申请号：US13248745
申请日：2011-09-29
申请人： Jesus Alfonso Castaneda , Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Michael Boers
发明人： Jesus Alfonso Castaneda , Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Michael Boers
IPC分类号： H01L23/02 , G02B6/43 , H01L25/065 , H01L25/10 , H01L23/522 , H01L23/66 , G02B6/12
摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

7. 发明授权

US08866502B2 Simultaneously tagging of semiconductor components on a wafer 有权
标题翻译：同时在晶片上标记半导体元件
公开(公告)号：US08866502B2
公开(公告)日：2014-10-21
申请号：US13029653
申请日：2011-02-17
申请人： Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
发明人： Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
IPC分类号： G01R31/36 , G01R31/319 , G01R31/302 , G01R31/311 , G01R31/28
CPC分类号： G01R31/319 , G01R31/2834 , G01R31/3025 , G01R31/311 , H01L23/544 , H01L2223/54433 , H01L2924/0002 , Y10T29/49121 , H01L2924/00
摘要： Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.
摘要翻译：公开了同时无线地测试形成在半导体晶片上的半导体元件的方法和装置。半导体部件通过公共通信信道将各自的测试结果传送到无线自动测试设备。多个接收天线在三维空间中观察多个方向的结果。无线自动测试设备确定一个或多个半导体组件是否按预期运行，并且可选地，可以使用三维空间的属性来确定一个或多个半导体组件的位置。无线测试设备还可以通过检测在独立测试操作之前，期间和/或之后由半导体晶片发射，传输和/或反射的红外能量来确定半导体组件的性能。

8. 发明授权

US08508029B2 Semiconductor package including an integrated waveguide 有权
标题翻译：包括集成波导的半导体封装
公开(公告)号：US08508029B2
公开(公告)日：2013-08-13
申请号：US13248673
申请日：2011-09-29
申请人： Michael Boers , Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Jesus Alfonso Castaneda
发明人： Michael Boers , Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Jesus Alfonso Castaneda
IPC分类号： H01L23/02
CPC分类号： H01L23/49811 , H01L23/5222 , H01L23/66 , H01L24/16 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L2223/6627 , H01L2223/6677 , H01L2223/6683 , H01L2224/0401 , H01L2224/0557 , H01L2224/05647 , H01L2224/131 , H01L2224/14181 , H01L2224/16225 , H01L2224/17181 , H01L2224/81815 , H01L2225/06531 , H01L2225/06572 , H01L2924/00014 , H01L2924/1461 , H01L2924/15311 , H01P1/182 , H01P3/023 , H01P3/12 , H01P3/121 , H01L2924/014 , H01L2924/00 , H01L2224/05552
摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.
摘要翻译：公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。功能模块通过集成波导使用多址传输方案彼此通信以及其他集成电路。一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。多芯片模块可以耦合到半导体封装以形成封装的集成电路。

9. 发明授权

US08484395B2 System and method for dynamically configuring processing resources and memory resources of wireless-enabled components 有权
标题翻译：用于动态配置无线组件的处理资源和存储资源的系统和方法
公开(公告)号：US08484395B2
公开(公告)日：2013-07-09
申请号：US12877955
申请日：2010-09-08
申请人： Michael Boers , Arya Reza Behzad , Jesus Alfonso Castaneda , Ahmadreza (Reza) Rofougaran , Sam Ziqun Zhao
发明人： Michael Boers , Arya Reza Behzad , Jesus Alfonso Castaneda , Ahmadreza (Reza) Rofougaran , Sam Ziqun Zhao
IPC分类号： G06F13/42 , G06F13/364
CPC分类号： G06F9/50 , H04B5/0037 , H04B7/10 , H04B7/26 , H04W4/80 , H04W84/18 , Y10T307/492
摘要： Disclosed herein is a configurable system of wireless-enabled components (WECs) and applications thereof. The system includes a plurality of WECs and a controller. Each WEC comprises a functional resource and is adapted to wirelessly communicate with other WECs. The controller is adapted to dynamically configure the functional resource of each WEC and wireless communications among the plurality of WECs to form a field-programmable communications array. The controller may be one of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices.
摘要翻译：这里公开了一种可配置的无线组件（WEC）系统及其应用。该系统包括多个WEC和控制器。每个WEC包括功能资源，并且适于与其他WEC无线通信。所述控制器适于动态地配置所述多个WEC中的每个WEC的功能资源和无线通信，以形成现场可编程通信阵列。控制器可以是多个WEC之一。多个WEC可以位于单个芯片上，在单个设备的多个芯片上，或者位于多个设备的多个芯片上。

10. 发明授权

US08472889B2 Radio frequency transceiver integrated circuit floor plan applicable to MIMO 有权
标题翻译：射频收发器集成电路平面图适用于MIMO
公开(公告)号：US08472889B2
公开(公告)日：2013-06-25
申请号：US11168831
申请日：2005-06-28
申请人： Arya Reza Behzad
发明人： Arya Reza Behzad
IPC分类号： H04B1/40
CPC分类号： H04B1/406
摘要： A Radio Frequency (RF) transceiver Integrated Circuit (IC) includes a first RF transceiver group, a first baseband section, a second RF transceiver group, a second baseband section, local oscillation circuitry, and local oscillation distribution circuitry. The first baseband section communicatively couples to the first RF transceiver group. The second RF transceiver group resides in substantial symmetry with the first RF transceiver group about a center line of symmetry of the RF transceiver IC. The second baseband section communicatively coupled to the second RF transceiver group. The local oscillation distribution circuitry operably couples to the local oscillation generation circuitry, to the first RF transceiver group, and to the second RF transceiver group. The second baseband section may reside in substantial symmetry with the first baseband section about the center line of symmetry of the RF transceiver IC.
摘要翻译：射频（RF）收发器集成电路（IC）包括第一RF收发器组，第一基带部分，第二RF收发器组，第二基带部分，本地振荡电路和本地振荡分配电路。第一基带部分通信地耦合到第一RF收发机组。第二RF收发器组与第一RF收发器组关于RF收发器IC的中心对称线基本对称。通信地耦合到第二RF收发机组的第二基带部分。本地振荡分配电路可操作地耦合到本地振荡发生电路，第一RF收发器组和第二RF收发器组。第二基带部分可以围绕RF收发器IC的对称中心线与第一基带部分基本对称。

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