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    • 5. 发明授权
    • Methods and structures for protecting reticles from ESD failure
    • 保护掩模版免受ESD故障的方法和结构
    • US06376131B1
    • 2002-04-23
    • US09542127
    • 2000-04-04
    • Jae ChoZhi-Min LingXin X. Wu
    • Jae ChoZhi-Min LingXin X. Wu
    • G03F900
    • G03F1/40
    • A reticle that is modified to prevent bridging of the masking material (e.g., chrome) between portions of the lithographic mask pattern during an integrated circuit fabrication process. According to a first aspect, the modification involves electrically connecting the various portions of the lithographic mask pattern that balance charges generated in the portions during fabrication processes. In one embodiment, sub-resolution wires that extend between the lithographic mask pattern portions facilitate electrical conduction between the mask pattern portions, thereby equalizing dissimilar charges. In another embodiment, a transparent conductive film is formed over the lithographic mask pattern to facilitate conduction. In accordance with a second aspect, the modification involves separating the various portions of the lithographic mask pattern into relatively small segments by providing sub-resolution gaps between the various portions, thereby minimizing the amount of charge that is generated on each portion.
    • 在集成电路制造工艺期间,被修饰以防止掩模材料(例如,铬)桥接在光刻掩模图案的部分之间的掩模版。 根据第一方面,修改涉及电连接平版印刷掩模图案的各个部分,以平衡在制造工艺期间部分中产生的电荷。 在一个实施例中,在光刻掩模图案部分之间延伸的子分辨率线促进掩模图案部分之间的导电,从而均衡不同的电荷。 在另一个实施例中,在光刻掩模图案之上形成透明导电膜以促进传导。 根据第二方面,修改包括通过在各部分之间提供次分辨率间隙将光刻掩模图案的各个部分分离成相对较小的部分,从而最小化在每个部分上产生的电荷量。
    • 6. 发明授权
    • Method for detecting defect sizes in polysilicon and source-drain
semiconductor devices
    • 用于检测多晶硅和源极 - 漏极半导体器件中的缺陷尺寸的方法
    • US5963780A
    • 1999-10-05
    • US899739
    • 1997-07-24
    • Zhi-Min LingYung-Tao LinYing Shiau
    • Zhi-Min LingYung-Tao LinYing Shiau
    • H01L23/544H01L21/66G01R31/26
    • H01L22/34H01L2924/0002
    • An apparatus and method for detecting defect sizes in polysilicon and source-drain semiconductor devices and methods for making the same. Implemented is a double bridge test structure that includes a resistor path of first semiconductor material, such as doped silicon comprising a plurality of strip segments and with interconnection segments. A plurality of strips of second semiconductor material having a substantially lower resistivity are connected to form parallel circuit interconnections with the corresponding strip segments. The test structure is formed by masking techniques wherein a prescribed mask region enables portions of the silicon resistor or deposited polysilicon to be selectively silicided to form silicide and polycide, respectively. One embodiment for testing for defects in a polysilicon layer uses polycide as the low-resistivity strips, enabling the testing of open and short-circuit defects. A second embodiment selectively silicides exposed portions of a source-drain resistor, thereby enabling testing for defects in a source-drain layer of a metal oxide semiconductor. Defect sizes are determined by comparing the measured resistance values with predetermined width and spacings of the strips.
    • 用于检测多晶硅和源极 - 漏极半导体器件中的缺陷尺寸的装置和方法及其制造方法。 实现的是双桥测试结构,其包括第一半导体材料的电阻器路径,例如包括多个条带段和互连段的掺杂硅。 连接具有基本上较低电阻率的多个第二半导体材料带,以形成与相应条带段的并联电路互连。 测试结构通过掩模技术形成,其中规定的掩模区域使得硅电阻器或沉积的多晶硅的部分分别被选择性地硅化以形成硅化物和多硅化物。 用于测试多晶硅层中的缺陷的一个实施例使用聚硅氧烷作为低电阻率带,能够测试开路和短路缺陷。 第二实施例选择性地硅化源极 - 漏极电阻器的暴露部分,从而能够测试金属氧化物半导体的源极 - 漏极层中的缺陷。 通过将测得的电阻值与条的预定宽度和间距进行比较来确定缺陷尺寸。
    • 9. 发明授权
    • Apparatus for detecting defect sizes in polysilicon and source-drain
semiconductor devices and method for making the same
    • 用于检测多晶硅和源极 - 漏极半导体器件中的缺陷尺寸的装置及其制造方法
    • US5821765A
    • 1998-10-13
    • US900013
    • 1997-07-24
    • Zhi-Min LingYung-Tao LinYing Shiau
    • Zhi-Min LingYung-Tao LinYing Shiau
    • H01L23/544G01R31/26
    • H01L22/34H01L2924/0002
    • An apparatus and method for detecting defect sizes in polysilicon and source-drain semiconductor devices and methods for making the same. Implemented is a double bridge test structure that includes a resistor path of first semiconductor material, such as doped silicon comprising a plurality of strip segments and with interconnection segments. A plurality of strips of second semiconductor material having a substantially lower resistivity are connected to form parallel circuit interconnections with the corresponding strip segments. The test structure is formed by masking techniques wherein a prescribed mask region enables portions of the silicon resistor or deposited polysilicon to be selectively silicided to form silicide and polycide, respectively. One embodiment for testing for defects in a polysilicon layer uses polycide as the low-resistivity strips, enabling the testing of open and short-circuit defects. A second embodiment selectively suicides exposed portions of a source-drain resistor, thereby enabling testing for defects in a source-drain layer of a metal oxide semiconductor. Defect sizes are determined by comparing the measured resistance values with predetermined width and spacings of the strips.
    • 用于检测多晶硅和源极 - 漏极半导体器件中的缺陷尺寸的装置和方法及其制造方法。 实现的是双桥测试结构,其包括第一半导体材料的电阻器路径,例如包括多个条带段和互连段的掺杂硅。 连接具有基本上较低电阻率的多个第二半导体材料带,以形成与相应条带段的并联电路互连。 测试结构通过掩模技术形成,其中规定的掩模区域使得硅电阻器或沉积的多晶硅的部分分别被选择性地硅化以形成硅化物和多硅化物。 用于测试多晶硅层中的缺陷的一个实施例使用聚硅氧烷作为低电阻率带,能够测试开路和短路缺陷。 第二实施例选择性地使源极 - 漏极电阻器的暴露部分自动化,从而能够测试金属氧化物半导体的源极 - 漏极层中的缺陷。 通过将测得的电阻值与条的预定宽度和间距进行比较来确定缺陷尺寸。
    • 10. 发明授权
    • Apparatus for detecting defect sizes in polysilicon and source-drain
semiconductor devices and method for making the same
    • 用于检测多晶硅和源极 - 漏极半导体器件中的缺陷尺寸的装置及其制造方法
    • US6001663A
    • 1999-12-14
    • US280997
    • 1999-03-30
    • Zhi-Min LingYung-Tao LinYing Shiau
    • Zhi-Min LingYung-Tao LinYing Shiau
    • H01L23/544H01L21/66
    • H01L22/34H01L2924/0002
    • An apparatus and method for detecting defect sizes in polysilicon and source-drain semiconductor devices and methods for making the same. Implemented is a double bridge test structure that includes a resistor path of first semiconductor material, such as doped silicon comprising a plurality of strip segments and with interconnection segments. A plurality of strips of second semiconductor material having a substantially lower resistivity are connected to form parallel circuit interconnections with the corresponding strip segments. The test structure is formed by masking techniques wherein a prescribed mask region enables portions of the silicon resistor or deposited polysilicon to be selectively silicided to form silicide and polycide, respectively. One embodiment for testing for defects in a polysilicon layer uses polycide as the low-resistivity strips, enabling the testing of open and short-circuit defects. A second embodiment selectively silicides exposed portions of a source-drain resistor, thereby enabling testing for defects in a source-drain layer of a metal oxide semiconductor. Defect sizes are determined by comparing the measured resistance values with predetermined width and spacings of the strips.
    • 用于检测多晶硅和源极 - 漏极半导体器件中的缺陷尺寸的装置和方法及其制造方法。 实现的是双桥测试结构,其包括第一半导体材料的电阻器路径,例如包括多个条带段和互连段的掺杂硅。 连接具有基本上较低电阻率的多个第二半导体材料带,以形成与相应条带段的并联电路互连。 测试结构通过掩模技术形成,其中规定的掩模区域使得硅电阻器或沉积的多晶硅的部分分别被选择性地硅化以形成硅化物和多硅化物。 用于测试多晶硅层中的缺陷的一个实施例使用聚硅氧烷作为低电阻率带,能够测试开路和短路缺陷。 第二实施例选择性地硅化源极 - 漏极电阻器的暴露部分,从而能够测试金属氧化物半导体的源极 - 漏极层中的缺陷。 通过将测得的电阻值与条的预定宽度和间距进行比较来确定缺陷尺寸。