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    • 2. 发明授权
    • Methods and circuits for testing a circuit fabrication process for device uniformity
    • 用于测试器件均匀性的电路制造工艺的方法和电路
    • US06507942B1
    • 2003-01-14
    • US09613494
    • 2000-07-11
    • Anthony P. CalderoneFeng WangTho Le La
    • Anthony P. CalderoneFeng WangTho Le La
    • G06F1750
    • H01L22/34
    • Described are systems and methods for measuring the size uniformity of circuit features defined by the critical dimension of an integrated-circuit fabrication process. An integrated circuit is configured to include a number of oscillators, each occupying a region of the integrated circuit. Each oscillator oscillates at a frequency that depends on the critical dimension of features in the region in which it is formed. Consequently, the critical dimensions of regions across the surface of the integrated circuit can be mapped and compared by comparing the oscillation frequencies of identical oscillators formed in various regions of the integrated circuit. In programmable logic devices, oscillators can be implemented using programmable logic resources. In other embodiments, small, simple oscillators can be placed at various locations on the integrated circuit.
    • 描述了用于测量由集成电路制造工艺的关键尺寸限定的电路特征的尺寸均匀性的系统和方法。 集成电路被配置为包括多个振荡器,每个振荡器占据集成电路的一个区域。 每个振荡器以取决于其形成区域中的特征的临界尺寸的频率振荡。 因此,可以通过比较在集成电路的各个区域中形成的相同振荡器的振荡频率来映射和比较集成电路表面上的区域的临界尺寸。 在可编程逻辑器件中,可以使用可编程逻辑资源实现振荡器。 在其他实施例中,小的简单振荡器可以放置在集成电路上的各个位置。