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1. 发明申请

US20080130233A1 HEAT SINK ASSEMBLY 失效
标题翻译：散热装置
公开(公告)号：US20080130233A1
公开(公告)日：2008-06-05
申请号：US11566020
申请日：2006-12-01
申请人： Zhao Jin , Jun Cao , Shi-Wen Zhou , Chun-Chi Chen
发明人： Zhao Jin , Jun Cao , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , F28F3/02 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly (10) compatible with an ATX motherboard (20) and a BTX motherboard (30), includes a heat sink and a plurality of fasteners (15) extending through the heat sink. The heat sink includes a base (12) defining a slot (1220) therein. The fastener is capable of sliding along the slot between a first position to a second position to make the heat sink assembly in accordance with the preferred embodiment of the present invention to be adapted for use with the ATX motherboard or the BTX motherboard.
摘要翻译：与ATX母板（20）和BTX母板（30）兼容的散热器组件（10）包括散热器和延伸穿过散热器的多个紧固件（15）。散热器包括在其中限定狭槽（1220）的基部（12）。紧固件能够在第一位置与第二位置之间沿狭槽滑动，以使得根据本发明的优选实施例的散热器组件适于与ATX主板或BTX主板一起使用。

2. 发明申请

US20100155023A1 HEAT DISSIPATION APPARATUS HAVING HEAT PIPES INSERTED THEREIN 审中-公开
标题翻译：具有其中的热管的散热装置
公开(公告)号：US20100155023A1
公开(公告)日：2010-06-24
申请号：US12423816
申请日：2009-04-15
申请人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu , Chun-Chi Chen
发明人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu , Chun-Chi Chen
IPC分类号： F28F7/00 , F28D15/00
CPC分类号： F28D15/0233 , F28D15/0266 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation apparatus includes a base, a heat sink on the base, two heat pipes thermally connecting the base and the heat sink and a fan mounted in the heat sink. The heat sink comprises a first fin group placed on the base and a second fin group located on the first fin group. Each heat pipe comprises an evaporation section connected to the base, a condensation section and an adiabatic section interconnecting the evaporation section and the condensation section. The condensation sections of the heat pipes are sandwiched between the first and second fin groups and surround the fan.
摘要翻译：散热装置包括底座，基座上的散热器，热连接底座和散热器的两个热管和安装在散热器中的风扇。散热器包括放置在基座上的第一翅片组和位于第一翅片组上的第二翅片组。每个热管包括连接到基座的蒸发部分，冷凝部分和互连蒸发部分和冷凝部分的绝热部分。热管的冷凝部分夹在第一和第二翅片组之间并围绕风扇。

3. 发明授权

US07916469B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07916469B2
公开(公告)日：2011-03-29
申请号：US12436786
申请日：2009-05-07
申请人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu , Chun-Chi Chen
发明人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu , Chun-Chi Chen
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： H01L23/467 , F28D15/0266 , F28D15/0275 , F28F2215/00 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device adapted for cooling an electronic device mounted on a printed circuited board includes a heat spreader thermally contacting the electronic device, a fin assembly comprising a plurality of fins, a first heat pipe interconnecting the fin assembly and the heat spreader and a plurality of supporting posts inserted in the fin assembly.
摘要翻译：适于冷却安装在印刷线路板上的电子装置的散热装置包括热接触电子装置的散热器，包括多个散热片的散热片组件，将翅片组件和散热器互连的第一热管和多个插入翅片组件中的支撑柱。

4. 发明授权

US08251132B2 Heat sink assembly and method for manufacturing the same 有权
标题翻译：散热器组件及其制造方法
公开(公告)号：US08251132B2
公开(公告)日：2012-08-28
申请号：US12056298
申请日：2008-03-27
申请人： Jun Cao , Shi-Wen Zhou , Chun-Chi Chen
发明人： Jun Cao , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28F1/32 , F28D15/02
CPC分类号： F28F1/32 , F28D15/0266 , F28D15/0275 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink assembly includes a base, a fin group and a heat pipe connecting with the base and the fin group. The fin group includes a plurality of fins. Each of the fins defines a recess at a lower portion thereof. The heat pipe includes an evaporating portion extending through the base and a condensing portion extending through the fin group. The base is interferentially fitted into the recesses of the fins. The base, the fin group and the heat pipe directly and intimately connect with each other. The recess and the base have correspondingly T-shaped profiles. Each fin forms a bended flange defining the recess. The bended flange intimately contacts with the base and the evaporating portion of the heat pipe.
摘要翻译：散热器组件包括基座，翅片组和与基座和翅片组连接的热管。翅片组包括多个翅片。每个翅片在其下部限定凹部。热管包括延伸穿过基座的蒸发部分和延伸穿过翅片组的冷凝部分。基座沿圆周方向嵌合在翅片的凹槽中。基座，翅片组和热管直接相互紧密连接。凹槽和底座具有相应的T形轮廓。每个翅片形成限定凹部的弯曲凸缘。弯曲的法兰与基座和热管的蒸发部分紧密接触。

5. 发明授权

US08365810B2 Active heat sink for use with electronic device 失效
标题翻译：主动散热器，用于电子设备
公开(公告)号：US08365810B2
公开(公告)日：2013-02-05
申请号：US12496653
申请日：2009-07-02
申请人： Shou-Biao Xu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Shou-Biao Xu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28D15/02
CPC分类号： H01L23/427 , F28D15/0208 , F28D15/0275 , F28F1/34 , F28F13/125 , F28F2215/00 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a heat conducting base, a heat conducting shaft thermally connected to and rotating with respect to the base, and a plurality of fins. The shaft includes a heat absorbing section thermally connected to the base and a heat dissipating section connected with the heat absorbing section. The fins are disposed on the heat dissipating section of the shaft.
摘要翻译：散热器包括导热基座，热连接并相对于基座旋转的导热轴和多个翅片。轴包括热连接到基座的热吸收部分和与吸热部分连接的散热部分。翅片设置在轴的散热部分上。

6. 发明授权

US08296947B2 Heat sink and method of manufacturing the same 有权
标题翻译：散热器及其制造方法
公开(公告)号：US08296947B2
公开(公告)日：2012-10-30
申请号：US12506213
申请日：2009-07-20
申请人： Peng Liu , Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Peng Liu , Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： B21D53/02 , H05K7/20
CPC分类号： B21D53/085 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.
摘要翻译：散热器包括：基部，其具有限定在其中的多个凹部;多个柱状散热片，各自具有从头部延伸的头部和主体;以及与基部接合的盖。每个头部被接收在基座的相应凹部中并且高于基座的相应凹部。头部被夹在盖和基座之间，由此将柱状翅片固定在基座上。接触每个柱状翅片的头部的盖的一部分突出以形成变形部分。还公开了一种制造散热器的方法。

7. 发明授权

US08220527B2 Heat dissipation device with heat pipe 有权
标题翻译：散热装置带热管
公开(公告)号：US08220527B2
公开(公告)日：2012-07-17
申请号：US12056295
申请日：2008-03-27
申请人： Peng Liu , Shi-Wen Zhou , Chun-Chi Chen , Yi-Jiun Li
发明人： Peng Liu , Shi-Wen Zhou , Chun-Chi Chen , Yi-Jiun Li
IPC分类号： F28D15/02
CPC分类号： F28D15/0233
摘要： A heat dissipation device includes a heat spreader for thermally engaging with a heat generating electronic device, a heat sink assembly located above the heat spreader, and first and second heat pipes connecting with the heat spreader and the heat sink assembly. Each of the first and second heat pipes comprises an evaporation section engaged in the heat spreader, two arc-shaped condensation sections thermally inserted in the heat sink assembly, and two connecting sections interconnecting corresponding condensation sections and the evaporation section. The condensation sections are coplanar with each other and located in a same circle. The condensation sections of the first heat pipe extend in a clockwise direction, while the condensation sections of the second heat pipe extend in an anticlockwise direction.
摘要翻译：散热装置包括用于与发热电子设备热接合的散热器，位于散热器上方的散热器组件，以及与散热器和散热器组件连接的第一和第二热管。第一和第二热管中的每一个包括接合在散热器中的蒸发部分，热插入散热器组件中的两个弧形冷凝部分和互连相应的冷凝部分和蒸发部分的两个连接部分。冷凝段彼此共面并且位于同一个圆中。第一热管的冷凝部沿顺时针方向延伸，第二热管的冷凝部沿逆时针方向延伸。

8. 发明授权

US07990719B2 Electronic system with heat dissipation device 有权
标题翻译：具有散热装置的电子系统
公开(公告)号：US07990719B2
公开(公告)日：2011-08-02
申请号：US12610388
申请日：2009-11-02
申请人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20154
摘要： A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.
摘要翻译：散热装置用于散发电子系统中安装在印刷电路板上的电子元件产生的热量。电子元件具有不同的高度。所述散热装置包括连接板，安装在所述连接板上的至少两个弹性部件和散热器，所述散热器具有安装在所述连接板上且位于所述电子部件之一上方的基板。多个接合构件延伸穿过印刷电路板并与衬底接合以将衬底附着在印刷电路板上的一个电子部件上。基板和连接板之间的距离可通过调节连接部件来调节，以使基板与一个电子部件紧密接触。

9. 发明授权

US07866375B2 Heat dissipation device with heat pipes 有权
标题翻译：带热管的散热装置
公开(公告)号：US07866375B2
公开(公告)日：2011-01-11
申请号：US11566003
申请日：2006-12-01
申请人： Shi-Wen Zhou , Chun-Chi Chen , Bao-Chun Chen
发明人： Shi-Wen Zhou , Chun-Chi Chen , Bao-Chun Chen
IPC分类号： F28D15/00 , F28F7/00 , H01L23/24 , H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base (10), a plurality of fins (20), first and second heat pipes (30), (40), a fan holder (50) and a fan (60) secured to the fan holder. The first heat pipe includes a heat-receiving section (32) and two heat-discharging sections (34). The second heat pipe includes an evaporating portion (42) and two condensing portions (44). The condensing portions of the second heat pipe extend into the fins and are disposed adjacent to opposite ends of each of the fins. One heat-discharging section extends in the fins and is disposed between the condensing portions, thus allowing heat absorbed from the base to be evenly distributed throughout the fins by the heat-discharging sections and the condensing portions.
摘要翻译：一种散热装置，包括底座（10），多个翅片（20），第一和第二热管（30），（40），风扇架（50）和固定到风扇架的风扇（60）。第一热管包括受热部（32）和两个散热部（34）。第二热管包括蒸发部分（42）和两个冷凝部分（44）。第二热管的冷凝部分延伸到翅片中并且与每个翅片的相对端相邻设置。一个放热部分在翅片中延伸并且设置在冷凝部分之间，从而允许从基座吸收的热量通过散热部分和冷凝部分均匀分布在整个翅片上。

10. 发明授权

US07493940B2 Heat dissipation device having mounting brackets 失效
标题翻译：具有安装支架的散热装置
公开(公告)号：US07493940B2
公开(公告)日：2009-02-24
申请号：US11309841
申请日：2006-10-10
申请人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen , Li He , Peng Liu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen , Li He , Peng Liu
IPC分类号： F24H3/02 , F28F9/00 , H05K7/20
CPC分类号： H01L23/467 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device (100) includes a heat sink (10) having a plurality of fins (14) and a plurality of mounting brackets (20) buckled with the fins of the heat sink. Each of the mounting brackets includes a mounting plate (22) mounted on a top of the heat sink and a baffle plate (26) extending from one side of the mounting plate to a bottom of the heat sink. The baffle plate terminates with a retaining plate (28). A plurality of fasteners (50) extends through the retaining plates to mount the heat dissipation device onto a printed circuit board. Self-tapping screws (40) are used to extend through the fan and the mounting plates of the mounting brackets and threadedly engage with the fins thereby mounting the fan on the heat sink.
摘要翻译：散热装置（100）包括散热片（10），散热片（10）具有多个散热片（14）和多个与散热片的翅片相互扣合的安装支架（20）。每个安装支架包括安装在散热器顶部的安装板（22）和从安装板的一侧延伸到散热器底部的挡板（26）。挡板终止于保持板（28）。多个紧固件（50）延伸穿过保持板以将散热装置安装到印刷电路板上。自攻螺钉（40）用于延伸通过风扇和安装支架的安装板，并与翅片螺纹接合，从而将风扇安装在散热器上。

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