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    • 7. 发明授权
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US09130044B2
    • 2015-09-08
    • US13529125
    • 2012-06-21
    • Yutaka OkazakiAtsuo Isobe
    • Yutaka OkazakiAtsuo Isobe
    • H01L29/12H01L29/786
    • H01L29/7869
    • The invention relates to a semiconductor device including an oxide semiconductor layer, a gate electrode overlapping with a channel formation region of the oxide semiconductor layer, and a source electrode or a drain electrode overlapping with a first region of the oxide semiconductor layer, and a second region between the channel formation region and the first region. An upper layer of the second region includes a microvoid. The microvoid is formed by adding nitrogen to the upper layer of the second region. Thus, upper layer of the second region contains lager amount of nitrogen than a lower layer of the second region.
    • 本发明涉及包括氧化物半导体层,与氧化物半导体层的沟道形成区重叠的栅电极以及与氧化物半导体层的第一区重叠的源电极或漏电极的半导体器件,以及第二 在通道形成区域和第一区域之间。 第二区域的上层包括微孔。 通过向第二区域的上层添加氮形成微孔。 因此,第二区域的上层比第二区域的下层含有大量的氮。