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1. 发明授权

US06570642B2 Method and apparatus for placing identifying mark on semiconductor wafer 有权
标题翻译：在半导体晶片上放置识别标记的方法和装置
公开(公告)号：US06570642B2
公开(公告)日：2003-05-27
申请号：US09920605
申请日：2001-08-02
申请人： Yung-Sheng Huang , Hung-Chang Hsieh
发明人： Yung-Sheng Huang , Hung-Chang Hsieh
IPC分类号： G03B2754
CPC分类号： H01L23/544 , H01L2223/54406 , H01L2223/54433 , H01L2223/54493 , H01L2924/0002 , H01L2924/00
摘要： A tool for placing an identifying mark on a semiconductor wafer has a bundle of optical fibers that can be illuminated in a pattern representing an identifying character. Light from the fibers is focused on a photoresist layer during wafer manufacture and a pattern of dots is etched into the wafer to represent the character. The dots are too small to be seen with the human eye but the character can be read by a human or by a machine. The character is etched as part of a conventional etch step in manufacturing the wafer and it is easily repeated as a series of manufacturing steps obscure the original mark.
摘要翻译：用于在半导体晶片上放置识别标记的工具具有可以以表示识别字符的图案照亮的一束光纤。来自纤维的光在晶片制造期间聚焦在光致抗蚀剂层上，并且将点阵图案蚀刻到晶片中以表示字符。这些点太小，不能用人眼看到，但人物可以由人或机器读取。作为制造晶片的常规蚀刻步骤的一部分蚀刻该字符，并且由于一系列制造步骤遮蔽原始标记，因此容易重复该字符。

2. 发明授权

US6110816A Method for improving bondability for deep-submicron integrated circuit package 有权
标题翻译：用于提高深亚微米集成电路封装的粘合性的方法
公开(公告)号：US6110816A
公开(公告)日：2000-08-29
申请号：US261999
申请日：1999-03-05
申请人： Yung-Sheng Huang , Hung-Chang Hsieh , Han-Chang Hsieh
发明人： Yung-Sheng Huang , Hung-Chang Hsieh , Han-Chang Hsieh
IPC分类号： H01L21/60 , H01L23/485 , H01L21/44
CPC分类号： H01L24/85 , H01L24/03 , H01L24/05 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05073 , H01L2224/05093 , H01L2224/05187 , H01L2224/05556 , H01L2224/05557 , H01L2224/05624 , H01L2224/05647 , H01L2224/4807 , H01L2224/48453 , H01L2224/48463 , H01L2224/78301 , H01L2224/85045 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85399 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01039 , H01L2924/01074 , H01L2924/01327 , H01L2924/04941 , H01L2924/10253 , H01L2924/14
摘要： A method is adapted to form wire interconnect pads on integrated circuit devices and includes the steps of providing a semiconductor substrate having an aluminum-copper top metal layer, and a titanium nitride layer covering the aluminum-copper top metal layer, and a photoresist coating applied to the titanium nitride layer. The photoresist coating is partially exposed and partially developed to form openings for etching an array of submicron size holes. Etching through the titanium nitride layer to the aluminum-copper layer, by way of the partially developed photoresist, forms a rough textured surface profile in the array of cavities, with diameters of less than 0.3 um, etched in the aluminum copper layer. After stripping of the photoresist and depositing a passivation film, windows are formed delineating improved bond pads for wire bonding. The textured cavities increase the surface area of the bond pads and provide improved bondability for the 0.35 and 0.3 um IC devices.
摘要翻译：一种适于在集成电路器件上形成导线互连焊盘的方法，包括以下步骤：提供具有铝 - 铜顶层金属层的半导体衬底和覆盖铝 - 铜顶层金属层的氮化钛层和涂覆有光致抗蚀剂涂层到氮化钛层。光致抗蚀剂涂层被部分曝光并部分显影以形成用于蚀刻亚微米尺寸孔阵列的开口。通过部分显影的光致抗蚀剂将氮化钛层蚀刻到铝 - 铜层上，在铝铜层中蚀刻直径小于0.3μm的空腔阵列中形成粗糙的纹理表面轮廓。在剥离光致抗蚀剂并沉积钝化膜之后，形成窗口，描绘改进的用于引线接合的接合焊盘。纹理的空腔增加了接合焊盘的表面积，并为0.35和0.3um IC器件提供了改进的粘合性。

3. 发明授权

US06312876B1 Method for placing identifying mark on semiconductor wafer 有权
标题翻译：在半导体晶片上放置识别标记的方法
公开(公告)号：US06312876B1
公开(公告)日：2001-11-06
申请号：US09349842
申请日：1999-07-08
申请人： Yung-Sheng Huang , Hung-Chang Hsieh
发明人： Yung-Sheng Huang , Hung-Chang Hsieh
IPC分类号： G03F726
CPC分类号： H01L23/544 , H01L2223/54406 , H01L2223/54433 , H01L2223/54493 , H01L2924/0002 , H01L2924/00
摘要： A tool and method for placing an identifying mark on a semiconductor wafer has a bundle of optical fibers that can be illuminated in a pattern representing an identifying character. Light from the fibers is focused on a photoresist layer during wafer manufacture and a pattern of dots is etched into the wafer to represent the character. The dots are too small to be seen with the human eye but the character can be read by a human or by a machine. The character is etched as part of a conventional etch step in manufacturing the wafer and it is easily repeated as a series of manufacturing steps obscure the original mark.
摘要翻译：用于在半导体晶片上放置识别标记的工具和方法具有可以以表示识别字符的图案照亮的一束光纤。来自纤维的光在晶片制造期间聚焦在光致抗蚀剂层上，并且将点阵图案蚀刻到晶片中以表示字符。这些点太小，不能用人眼看到，但人物可以由人或机器读取。作为制造晶片的常规蚀刻步骤的一部分蚀刻该字符，并且由于一系列制造步骤遮蔽原始标记，因此容易重复该字符。

4. 发明授权

US06242813B1 Deep-submicron integrated circuit package for improving bondability 有权
标题翻译：深亚微米集成电路封装，用于改善粘合性
公开(公告)号：US06242813B1
公开(公告)日：2001-06-05
申请号：US09590122
申请日：2000-06-09
申请人： Yung-Sheng Huang , Hung-Chang Hsieh , Han-Chang Hsieh
发明人： Yung-Sheng Huang , Hung-Chang Hsieh , Han-Chang Hsieh
IPC分类号： H01L2348
CPC分类号： H01L24/85 , H01L24/03 , H01L24/05 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05073 , H01L2224/05093 , H01L2224/05187 , H01L2224/05556 , H01L2224/05557 , H01L2224/05624 , H01L2224/05647 , H01L2224/4807 , H01L2224/48453 , H01L2224/48463 , H01L2224/78301 , H01L2224/85045 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85399 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01039 , H01L2924/01074 , H01L2924/01327 , H01L2924/04941 , H01L2924/10253 , H01L2924/14 , H01L2924/04953 , H01L2224/78 , H01L2224/45099 , H01L2924/00
摘要： A method is adapted to form wire interconnect pads on integrated circuit devices and includes the steps of providing a semiconductor substrate having an aluminum-copper top metal layer, and a titanium nitride layer covering the aluminum-copper top metal layer, and a photoresist coating applied to the titanium nitride layer. The photoresist coating is partially exposed and partially developed to form openings for etching an array of submicron size holes. Etching through the titanium nitride layer to the aluminum-copper layer, by way of the partially developed photoresist, forms a rough textured surface profile in the array of cavities, with diameters of less than 0.3 um, etched in the aluminum copper layer. After stripping of the photoresist and depositing a passivation film, windows are formed delineating improved bond pads for wire bonding. The textured cavities increase the surface area of the bond pads and provide improved bondability for the 0.35 and 0.3 um IC devices.
摘要翻译：一种适于在集成电路器件上形成导线互连焊盘的方法，包括以下步骤：提供具有铝 - 铜顶层金属层的半导体衬底和覆盖铝 - 铜顶层金属层的氮化钛层和涂覆有光致抗蚀剂涂层到氮化钛层。光致抗蚀剂涂层被部分曝光并部分显影以形成用于蚀刻亚微米尺寸孔阵列的开口。通过部分显影的光致抗蚀剂将氮化钛层蚀刻到铝 - 铜层上，在铝铜层中蚀刻直径小于0.3μm的空腔阵列中形成粗糙的纹理表面轮廓。在剥离光致抗蚀剂并沉积钝化膜之后，形成窗口，描绘改进的用于引线接合的接合焊盘。纹理的空腔增加了接合焊盘的表面积，并为0.35和0.3um IC器件提供了改进的粘合性。

5. 发明授权

US07902828B2 Method and apparatus for monitoring the condition of a battery by measuring its internal resistance 有权
标题翻译：通过测量电池的内阻来监测电池状态的方法和装置
公开(公告)号：US07902828B2
公开(公告)日：2011-03-08
申请号：US11984669
申请日：2007-11-20
申请人： Yung-Sheng Huang
发明人： Yung-Sheng Huang
IPC分类号： G01N27/416
CPC分类号： G01R31/3662 , G01R31/3648 , G01R31/3693
摘要： A method for evaluating the condition of a battery comprises coupling a first power transistor as or as part of a first external load in series with the battery, coupling a second power transistor as or as part of a second external load in series with the battery, and conducting each power transistor to draw a transient large current from the battery while sampling the voltage across the battery and voltage across the load, from which the internal resistance of the battery can be determined. The internal resistance of the battery can then be compared with a predetermined nominal value to issue a warning if the battery is weak. The invention enables, for example, a driver to correctly know the actual condition of an automobile battery in substantially real time while consuming a minimum amount of power.
摘要翻译：一种用于评估电池状态的方法包括将第一功率晶体管与第一外部负载串联耦合作为电池，或者作为与电池串联的第二外部负载的一部分耦合第二功率晶体管，并且对每个功率晶体管进行引导以从电池中抽取瞬时大电流，同时对电池两端的电压进行采样并且跨越负载进行电压测量，从而确定电池的内部电阻。然后可以将电池的内部电阻与预定的标称值进行比较，以在电池较弱时发出警告。本发明使得例如驾驶员能够在消耗最小功率的情况下基本上实时地正确地知道汽车电池的实际状况。

6. 发明授权

US07723503B2 Desaturase genes, enzymes encoded thereby, and uses thereof 有权
标题翻译：去饱和酶基因，由此编码的酶及其用途
公开(公告)号：US07723503B2
公开(公告)日：2010-05-25
申请号：US11621446
申请日：2007-01-09
申请人： Pradip Mukerji , Suzette L. Pereira , Yung-Sheng Huang
发明人： Pradip Mukerji , Suzette L. Pereira , Yung-Sheng Huang
IPC分类号： C07H21/04
CPC分类号： C12N9/0083 , C12P7/6427 , C12P7/6472
摘要： Disclosed are isolated polynucleotides encoding an omega-3 desaturase and a delta-12 desaturase, the enzymes encoded by the isolated polynucleotides, vectors containing the isolated polynucleotides, transgenic hosts that contain the isolated polynucleotides that express the enzymes encoded thereby, methods for producing the desaturase enzymes, and method of using the enzymes to make polyunsaturated fatty acids. The isolated polynucleotides are derived from a fungus, Saprolegnia diclina (ATCC 56851). In particular, omega-3-desaturase may be utilized, for example, in the conversion of arachidonic acid (AA) to eicosapentaenoic acid (EPA). Delta-12 desaturase may be used, for example, in the conversion of oleic acid (OA) to linoleic (LA). EPA or polyunsaturated fatty acids produced therefrom may be added to pharmaceutical compositions, nutritional compositions, animal feeds, as well as other products such as cosmetics.
摘要翻译：公开了编码ω-3去饱和酶和δ-12去饱和酶的分离的多核苷酸，由分离的多核苷酸编码的酶，含有分离的多核苷酸的载体，含有表达由其编码的酶的分离的多核苷酸的转基因宿主，用于产生去饱和酶的方法酶和使用酶制备多不饱和脂肪酸的方法。分离的多核苷酸衍生自真菌Saprolegnia diclina（ATCC 56851）。特别地，ω-3-去饱和酶可用于例如花生四烯酸（AA）转化为二十碳五烯酸（EPA）。 Δ-12去饱和酶可以用于例如将油酸（OA）转化为亚油酸（LA）。由此产生的EPA或多不饱和脂肪酸可以加入到药物组合物，营养组合物，动物饲料中，以及其它产品如化妆品中。

7. 发明申请

US20080006882A1 Spiral Inductor with High Quality Factor of Integrated Circuit 审中-公开
标题翻译：具有高品质因数的集成电路的螺旋电感器
公开(公告)号：US20080006882A1
公开(公告)日：2008-01-10
申请号：US11468105
申请日：2006-08-29
申请人： Yung-Sheng Huang
发明人： Yung-Sheng Huang
IPC分类号： H01L29/76
CPC分类号： H01L28/10
摘要： A spiral inductor with high quality factor for an integrated circuit (IC) is disclosed, in which the metal layers arranged under a spiral inductor layer are parallel-connected to each other by the use of interconnects so as to increase the thickness of the metal layer and thus effectively reduce the parasitic resistance of the spiral inductor. In a preferred aspect, the parasitic resistance of the spiral inductor is reduced by increasing the interconnects, used for connecting the spiral inductor layer and the metal layer arranged underneath the same. In another preferred aspect, an interconnect is formed under the spiral inductor layer while enabling the same to be disconnected from the metal layer directly under the spiral inductor layer, by which the quality factor of the spiral inductor is increased since the substantial sectional area of the spiral inductor layer is increased and thus the parasitic resistance of the spiral inductor is decreased.
摘要翻译：公开了一种用于集成电路（IC）的具有高品质因数的螺旋电感器，其中布置在螺旋电感器层下方的金属层通过互连而彼此平行连接，以增加金属层的厚度从而有效地降低螺旋电感器的寄生电阻。在优选的方面，螺旋电感器的寄生电阻通过增加用于连接螺旋电感器层和布置在其下方的金属层的互连而减小。在另一个优选的方面，在螺旋形电感器层下方形成互连，同时使它们能够直接从螺旋形电感层下方的金属层断开，从而螺线形电感器的品质因数增加，因为它的实质截面积螺旋电感层增加，螺旋电感器的寄生电阻降低。

8. 发明授权

US07212006B2 Method and apparatus for monitoring the condition of a battery by measuring its internal resistance 有权
标题翻译：通过测量电池的内阻来监测电池状态的方法和装置
公开(公告)号：US07212006B2
公开(公告)日：2007-05-01
申请号：US10882196
申请日：2004-07-02
申请人： Yung-Sheng Huang
发明人： Yung-Sheng Huang
IPC分类号： H01M10/46
CPC分类号： G01R31/3662 , B60L11/1861 , B60L2240/547 , B60L2240/549 , Y02T10/7005 , Y02T10/7044 , Y02T10/705
摘要： The method comprises coupling an external load having a predetermined resistance directly in series with the battery, conducting a power transistor to supply a transient large current to the battery for sampling voltage of the battery in a set very short period of time, and determining the internal resistance of the battery. The internal resistance of the battery can then be compared with a predetermined warning value of internal resistance of the battery so as to determine whether the former is equal to or larger than the warning value, and displaying a warning on a display if the determination is affirmative. The invention enables a driver to correctly know the condition of the battery in substantially real time while consuming a minimum amount of current.
摘要翻译：该方法包括将具有预定电阻的外部负载直接与电池串联耦合，导通功率晶体管以在非常短的时间段内为电池提供瞬时大电流以对电池进行采样电压，以及确定内部电池的电阻。然后可以将电池的内部电阻与电池的内部电阻的预定警告值进行比较，以便确定前者是否等于或大于警告值，并且如果确定是肯定的，则在显示器上显示警告。本发明使驾驶员能够在消耗最小量的电流的情况下基本上实时地正确地知道电池的状况。

9. 发明授权

US07045683B2 Δ4-desaturase genes and uses thereof 有权
标题翻译： Δ4-去饱和酶基因及其用途
公开(公告)号：US07045683B2
公开(公告)日：2006-05-16
申请号：US10120637
申请日：2002-04-11
申请人： Pradip Mukerji , Jennifer Thurmond , Yung-Sheng Huang , Tapas Das , Amanda Eun-Yeong Leonard , Suzette L. Pereira
发明人： Pradip Mukerji , Jennifer Thurmond , Yung-Sheng Huang , Tapas Das , Amanda Eun-Yeong Leonard , Suzette L. Pereira
IPC分类号： A01H5/00 , C12N9/02 , C12N5/00 , C07H21/04
CPC分类号： C12N9/0083 , A23D9/00 , A23K20/158 , A23L7/126 , A23L9/12 , A61K38/00 , C12P7/6427 , C12P7/6472
摘要： The subject invention relates to the identification of genes involved in the desaturation of polyunsaturated fatty acids at carbon 4 (i.e., “Δ4-desaturase”). In particular, Δ4-desaturase may be utilized, for example, in the conversion of adrenic acid to ω6-docosapentaenoic acid and in the conversion of ω3-docosapentaenoic acid to docosahexaenoic acid. The polyunsaturated fatty acids produced by use of the enzyme may be added to pharmaceutical compositions, nutritional compositions, animal feeds, as well as other products such as cosmetics.
摘要翻译：本发明涉及鉴定涉及碳4处多不饱和脂肪酸去饱和的基因（即“Δ4-去饱和酶”）。特别地，可以使用Δ4-去饱和酶，例如，将肾上腺酸转化为ω6-二十二碳五烯酸，并将ω3-二十二碳五烯酸转化成二十二碳六烯酸。通过使用酶产生的多不饱和脂肪酸可以加入到药物组合物，营养组合物，动物饲料中，以及其它产品如化妆品中。

10. 发明申请

US20050110140A1 Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC) 有权
标题翻译：散热器球栅阵列（HSBGA）设计用于低k集成电路（IC）
公开(公告)号：US20050110140A1
公开(公告)日：2005-05-26
申请号：US10718192
申请日：2003-11-20
申请人： Yian-Liang Kuo , Yung-Sheng Huang , Yu-Ting Lin
发明人： Yian-Liang Kuo , Yung-Sheng Huang , Yu-Ting Lin
IPC分类号： H01L23/31 , H01L23/36 , H01L23/42 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/36 , H01L23/3128 , H01L23/42 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01019 , H01L2924/01322 , H01L2924/01327 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of forming a heat spreader ball grid array package, and the resultant heat spreader ball grid array package, comprising the following steps. A semiconductor chip affixed to a ball grid substrate is provided. The semiconductor chip over the ball grid substrate is encased with a molding compound. A heat spreader is mounted over the ball grid substrate and spaced apart from the molding compound to form a gap. Thermal grease is placed into the gap, at least between the heat spreader and the molding compound, to form the heat spreader ball grid array package. It is also possible to place thermal grease over the molding compound and then mounting the heat spreader over the ball grid substrate.
摘要翻译：一种形成散热器球栅阵列封装的方法，以及所得的散热器球栅阵列封装，包括以下步骤。提供固定在球栅基板上的半导体芯片。球形栅极衬底上的半导体芯片被模制化合物封装。散热器安装在球栅基板上并与模塑料间隔开以形成间隙。至少在散热器和模塑料之间，将热油脂放置在间隙中，形成散热器球栅阵列封装。还可以将热油脂放置在模制化合物上，然后将散热器安装在球栅基板上。

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