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    • 1. 发明授权
    • Method of manufacturing semiconductor device having trench type element isolation regions
    • 制造具有沟槽型元件隔离区域的半导体器件的方法
    • US06461934B2
    • 2002-10-08
    • US09862311
    • 2001-05-23
    • Yukio NishidaShuichi UenoMasashi Kitazawa
    • Yukio NishidaShuichi UenoMasashi Kitazawa
    • H01L2176
    • H01L21/76229
    • Trench isolation regions of different depths are formed through a simple manufacturing process, and reliability of a semiconductor device is increased. Trenches (103a, 103b) of different widths are formed on a semiconductor substrate (101) on which an underlying film (104) such as a silicon oxide film and a mask material (105) such as a silicon nitride film are formed. Then, an insulating film such as a silicon oxide film is deposited over the entire surface to such a degree that the narrower trench (103a) is filled up. At this time, the wider trench (103b) has an unfilled space in its central portion. a The surface of the substrate (101) is then vertically etched back until it is exposed in the trench 103b. With insulating films (106a, 106b) in the trenches (103a, 103b) as a mask, the surface of the substrate (101) is anisotropically etched vertically to form a deeper bottom (103c) in the trench (103b). After that, the surface is planarizedby depositing an insulating film in the unfilled space of the trench (103b).
    • 通过简单的制造工艺形成不同深度的沟槽隔离区域,并且增加了半导体器件的可靠性。 在半导体衬底(101)上形成不同宽度的沟槽(103a,103b),在其上形成诸如氧化硅膜的底层膜(104)和诸如氮化硅膜的掩模材料(105)。 然后,在整个表面上沉积诸如氧化硅膜的绝缘膜,使得填充较窄的沟槽(103a)的程度。 此时,较宽的沟槽(103b)在其中央部分具有未填充的空间。 a然后将衬底(101)的表面垂直蚀刻回直到其暴露在沟槽103b中。 以沟槽(103a,103b)中的绝缘膜(106a,106b)作为掩模,垂直地各向异性地蚀刻衬底(101)的表面,以在沟槽(103b)中形成更深的底部(103c)。 之后,通过在沟槽(103b)的未填充空间中沉积绝缘膜来平坦化表面。
    • 3. 发明授权
    • Method for manufacturing magnetic storage device and magnetic storage device
    • 磁存储装置和磁存储装置的制造方法
    • US08546151B2
    • 2013-10-01
    • US12528854
    • 2008-02-25
    • Haruo FurutaShuichi UenoRyoji MatsudaTatsuya FukumuraTakeharu KuroiwaLien-Chang WangEugene ChenYiming Huai
    • Haruo FurutaShuichi UenoRyoji MatsudaTatsuya FukumuraTakeharu KuroiwaLien-Chang WangEugene ChenYiming Huai
    • H01L21/00
    • H01L43/12B82Y10/00H01L27/228
    • Disclosed is a method for manufacturing a magnetic storage device comprising a TMR element, which comprises a step for forming an insulting film on an interlayer insulating film provided with a wiring layer, an opening formation step for forming an opening in the insulating film so that the wiring layer is exposed therefrom, a metal layer formation step for forming a metal layer on the insulating layer so that the opening is filled therewith, a CMP step for polishing and removing the metal layer on the insulating layer by a CMP method and forming the metal layer remaining in the opening into a lower electrode, and a step for forming a TMR element on the lower electrode. Also disclosed is a magnetic storage device comprising an interlayer insulating film provided with a wiring layer, an insulating film formed on the interlayer insulating film, an opening formed in the insulating film so that the wiring layer is exposed therefrom, a barrier metal layer provided so as to cover the inner surface of the opening, a lower electrode formed on the barrier metal so as to fill the opening, and a TMR element formed on the lower electrode.
    • 公开了一种制造包括TMR元件的磁存储装置的方法,该方法包括在具有布线层的层间绝缘膜上形成绝缘膜的步骤,用于在绝缘膜上形成开口的开口形成步骤, 布线层暴露于其中,金属层形成步骤用于在绝缘层上形成金属层以使其开口被填充; CMP步骤,用于通过CMP方法在绝缘层上抛光和去除金属层,并形成金属 剩余在开口中的层形成下电极,以及在下电极上形成TMR元件的步骤。 还公开了一种磁存储装置,其包括设置有布线层的层间绝缘膜,形成在层间绝缘膜上的绝缘膜,形成在绝缘膜中的开口,使得布线层暴露于其中,阻挡金属层设置为 为了覆盖开口的内表面,形成在阻挡金属上以便填充开口的下电极和形成在下电极上的TMR元件。
    • 6. 发明申请
    • EPOXY RESIN COMPOSITION, CURED OBJECT OBTAINED THEREFROM, AND LIGHT-EMITTING DIODE
    • 环氧树脂组合物,由其获得的固化对象和发光二极管
    • US20100193831A1
    • 2010-08-05
    • US12678166
    • 2008-09-22
    • Takashi SatoShuichi UenoTakeshi Koyama
    • Takashi SatoShuichi UenoTakeshi Koyama
    • H01L23/29C08L63/00C08K5/13
    • C08G59/24C08G59/226C08G59/42C08L63/00H01L33/56H01L51/5237H01L51/5246C08L2666/22
    • Provided are an epoxy resin composition including acid anhydrides (A) and epoxy resins (B), in which: (a) cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride accounts for 50 to 90 mass % of the acid anhydrides (A); (b) an alicyclic epoxy resin compound accounts for 30 to 90 mass % of the epoxy resins (B) and an epoxy resin compound represented by the following general formula (1) accounts for 10 to 50 mass % of the epoxy resins (B); and (c) contents of the acid anhydrides (A) and the epoxy resins (B) are such that a blending equivalent ratio between the acid anhydrides and the epoxy resins ranges from 0.4 to 0.7, a cured product of the composition, and a light-emitting diode. The epoxy resin composition has the following characteristics. That is, (1) the composition has a low viscosity after the mixing, a low degree of viscosity increase in standing at room temperature, and excellent workability, (2) the composition has satisfactory curability even when no curing accelerator is added, and (3) a cured product is colorless and transparent, has crack resistance, and changes its color to a small extent with long-term light irradiation and heating. The composition is suitable for an encapsulant for a photoelectric conversion element such as a blue LED or white LED. (In the formula, R's each independently represent a hydrogen atom or a methyl group, m represents an integer of 1 to 3, and n represents an integer of 2 to 8.)
    • 提供一种包含酸酐(A)和环氧树脂(B))的环氧树脂组合物,其中:(a)环己烷-1,2,4-三羧酸-1,2-酐占50〜90质量% 酸酐(A); (b)环氧树脂(B)的脂环族环氧树脂化合物占30〜90质量%,由通式(1)表示的环氧树脂化合物占环氧树脂(B)的10〜50质量% ; 和(c)酸酐(A)和环氧树脂(B)的含量使得酸酐与环氧树脂的混合当量比为0.4〜0.7,组合物的固化物和光 发光二极管。 环氧树脂组合物具有以下特征。 也就是说,(1)组合物在混合后具有低粘度,在室温下的静置粘度增加低,加工性优异,(2)即使不加入固化促进剂,组合物也具有令人满意的固化性,( 3)固化产物无色透明,具有抗裂性,并在长时间的光照射和加热下颜色变化很小。 该组合物适用于诸如蓝色LED或白色LED的光电转换元件的密封剂。 (式中,R 3各自独立地表示氢原子或甲基,m表示1〜3的整数,n表示2〜8的整数。)
    • 8. 发明申请
    • MAGNETIC MEMORY DEVICE
    • 磁记忆装置
    • US20090237989A1
    • 2009-09-24
    • US12476536
    • 2009-06-02
    • Yoshinori OKUMURAShuichi UenoHaruo Furuta
    • Yoshinori OKUMURAShuichi UenoHaruo Furuta
    • G11C11/14
    • H01L43/08B82Y10/00G11C11/15G11C11/1659G11C11/1675H01L27/228
    • A width and a thickness of a bit line are represented as W1 and T1, respectively, a thickness of a digit line is represented as T2, and a distance from a center of the digit line in a thickness direction to a center of a free layer of an MTJ element in the thickness direction is represented as L1. A width of the digit line is represented as W2, and a distance from a center of the bit line in the thickness direction to the center of the free layer of the MTJ element in the thickness direction is represented as L2. The distances L1 and L2 and the cross-sectional areas S1 and S2 are set in such a manner that when L1/L2≧1, a relation of (1/3)·(L1/L2)≦S2/S1≦1 is satisfied and when L1/L2≦1, a relation of 1≦S2/S1≦3(L1/L2) is satisfied.
    • 位线的宽度和厚度分别表示为W1和T1,数字线的厚度表示为T2,从数字线的中心到厚度方向的中心到自由层的中心的距离 的厚度方向上的MTJ元件表示为L1。 数字线的宽度表示为W2,从厚度方向的位线的中心到厚度方向的MTJ元件的自由层的中心的距离表示为L2。 距离L1和L2以及横截面积S1和S2以如下方式设定:当L1 / L2> = 1时,(1/3)(L1 / L2)<= S2 / S1 <= 1,并且当L1 / L2 <= 1时,满足1 <= S2 / S1 <= 3(L1 / L2)的关系。
    • 9. 发明申请
    • Magnetic memory device
    • 磁存储器件
    • US20080266939A1
    • 2008-10-30
    • US12213505
    • 2008-06-20
    • Yoshinori OkumuraShuichi UenoHaruo Furuta
    • Yoshinori OkumuraShuichi UenoHaruo Furuta
    • G11C11/02
    • H01L43/08B82Y10/00G11C11/15G11C11/1659G11C11/1675H01L27/228
    • A width and a thickness of a bit line are represented as W1 and T1, respectively, a thickness of a digit line is represented as T2, and a distance from a center of the digit line in a thickness direction to a center of a free layer of an MTJ element in the thickness direction is represented as L1. A width of the digit line is represented as W2, and a distance from a center of the bit line in the thickness direction to the center of the free layer of the MTJ element in the thickness direction is represented as L2. The distances L1 and L2 and the cross-sectional areas S1 and S2 are set in such a manner that when L1/L2≧1, a relation of (⅓)·(L1/L2)≦S2/S1≦1 is satisfied and when L1/L2≦1, a relation of 1≦S2/S1≦3(L1/L2) is satisfied.
    • 位线的宽度和厚度分别表示为W 1和T 1,数字线的厚度表示为T 2,并且从数字线的中心到厚度方向的中心的距离 在厚度方向上的MTJ元件的自由层表示为L 1。 数字线的宽度表示为W 2,并且从厚度方向的位线的中心到厚度方向上的MTJ元件的自由层的中心的距离表示为L 2。 距离L 1和L 2以及横截面积S 1和S 2被设定为当L 1 / L 2> = 1时,关于(1/3)(L 1 / L 2 )满足<= S 2 / S 1 <= 1,并且当L 1 / L 2 <= 1时,满足1 <= S 2 / S 1 <= 3(L 1 / L 2)的关系。