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1. 外观设计

USD644257S1 Autonomous mobile robot 有权
公开(公告)号：USD644257S1
公开(公告)日：2011-08-30
申请号：US29387116
申请日：2011-03-09
申请人： Yukihiko Kitano , Shoichi Kobayashi , Mizuho Sakakibara , Rie Takahashi , Hajime Kawano , Tatsuo Sakai , Hiroyuki Uematsu , Shintaro Kinoshita , Ryosuke Murai
设计人： Yukihiko Kitano , Shoichi Kobayashi , Mizuho Sakakibara , Rie Takahashi , Hajime Kawano , Tatsuo Sakai , Hiroyuki Uematsu , Shintaro Kinoshita , Ryosuke Murai

2. 外观设计

USD663333S1 Autonomous mobile robot 有权
标题翻译：自主移动机器人
公开(公告)号：USD663333S1
公开(公告)日：2012-07-10
申请号：US29413899
申请日：2012-02-22
申请人： Yukihiko Kitano , Shoichi Kobayashi , Mizuho Sakakibara , Hajime Kawano , Tatsuo Sakai , Hiroyuki Uematsu , Shintaro Kinoshita , Ryosuke Murai
设计人： Yukihiko Kitano , Shoichi Kobayashi , Mizuho Sakakibara , Hajime Kawano , Tatsuo Sakai , Hiroyuki Uematsu , Shintaro Kinoshita , Ryosuke Murai

3. 外观设计

USD663334S1 Autonomous mobile robot 有权
公开(公告)号：USD663334S1
公开(公告)日：2012-07-10
申请号：US29413900
申请日：2012-02-22
申请人： Yukihiko Kitano , Shoichi Kobayashi , Mizuho Sakakibara , Hajime Kawano , Tatsuo Sakai , Hiroyuki Uematsu , Shintaro Kinoshita , Ryosuke Murai
设计人： Yukihiko Kitano , Shoichi Kobayashi , Mizuho Sakakibara , Hajime Kawano , Tatsuo Sakai , Hiroyuki Uematsu , Shintaro Kinoshita , Ryosuke Murai

4. 外观设计

USD644256S1 Autonomous mobile robot 有权
标题翻译：自主移动机器人
公开(公告)号：USD644256S1
公开(公告)日：2011-08-30
申请号：US29387115
申请日：2011-03-09
申请人： Yukihiko Kitano , Shoichi Kobayashi , Mizuho Sakakibara , Rie Takahashi , Hajime Kawano , Tatsuo Sakai , Hiroyuki Uematsu , Shintaro Kinoshita , Ryosuke Murai
设计人： Yukihiko Kitano , Shoichi Kobayashi , Mizuho Sakakibara , Rie Takahashi , Hajime Kawano , Tatsuo Sakai , Hiroyuki Uematsu , Shintaro Kinoshita , Ryosuke Murai

5. 发明授权

US08591750B2 Multilayer wiring board and manufacturing method thereof 失效
标题翻译：多层布线板及其制造方法
公开(公告)号：US08591750B2
公开(公告)日：2013-11-26
申请号：US12659893
申请日：2010-03-24
申请人： Hiroyuki Uematsu , Kenichi Kawabata , Kenji Nagase
发明人： Hiroyuki Uematsu , Kenichi Kawabata , Kenji Nagase
IPC分类号： H01B13/00 , H05K1/11 , H05K1/14
CPC分类号： H05K3/427 , H05K3/002 , H05K3/0035 , H05K3/0038 , H05K3/0041 , H05K3/0044 , H05K3/061 , H05K3/064 , H05K3/382 , H05K3/389 , H05K3/421 , H05K3/4652 , H05K2201/0347 , H05K2201/0355 , H05K2201/0358 , H05K2201/0394 , H05K2203/025 , H05K2203/0353 , H05K2203/054 , H05K2203/0585 , H05K2203/0733
摘要： Provided is a method for manufacturing a multilayer wiring board, whereby even if the multilayer wiring board suffers warping or irregularities, thin-film patterns with great uniformity that are to be used as a mask for forming a wiring layer can be obtained in a simple way. A primer-coated metal foil 20 composed of a primer resin layer 21 and a metal layer 22 is placed on a surface of a double-face CCL 10, which is prepared by applying metal layers 12 and 13 onto the surfaces of a support base 11, and the primer-coated metal foil 20 and the double-face CCL 10 are bonded and the primer resin layer 21 is cured. A via Vb is thereafter formed from the metal layer 22 side, and a metal-plate layer 30 is formed on the resulting metal layer 22. After that, the etched down metal-plate layer 30 and the metal layer 22 are patterned, and using the patterned layers as a mask, the primer resin layer 21 is patterned. Using the patterned primer resin layer 21 as a mask, the metal layer 12 of the double-face CCL 10 and the metal-plate layer 30 are patterned to form a wiring pattern.
摘要翻译：提供一种多层布线板的制造方法，即使多层布线板发生翘曲或不均匀，也可以以简单的方式获得用作形成布线层的掩模的具有均匀性的薄膜图案。将由底漆树脂层21和金属层22构成的底漆涂布金属箔20放置在双面CCL 10的表面上，该双面CCL 10通过将金属层12和13施加到支撑基底11的表面上而制备并且底漆涂覆的金属箔20和双面CCL 10被粘合，底漆树脂层21固化。之后，从金属层22侧形成通孔Vb，在所得到的金属层22上形成金属板层30.之后，对蚀刻后的金属板层30和金属层22进行图案化，使用作为掩模的图案化层，对底漆树脂层21进行图案化。使用图案化底漆树脂层21作为掩模，将双面CCL 10的金属层12和金属板层30图案化以形成布线图案。

6. 发明授权

US08492659B2 Printed wiring board and manufacturing method therefor 有权
公开(公告)号：US08492659B2
公开(公告)日：2013-07-23
申请号：US12379295
申请日：2009-02-18
申请人： Kenji Nagase , Hiroyuki Uematsu , Kenichi Kawabata
发明人： Kenji Nagase , Hiroyuki Uematsu , Kenichi Kawabata
IPC分类号： H05K1/11
CPC分类号： H05K3/0035 , H05K1/115 , H05K3/0055 , H05K3/381 , H05K2201/09509 , H05K2201/09827 , H05K2203/025 , H05K2203/0554 , H05K2203/0557 , Y10T29/49155 , Y10T29/49165
摘要： The present invention provides a printed wiring board which can prevent a plating failure in a connection hole such as a via to be formed in the printed wiring board, thereby can enhance the connection reliability and a manufacturing method therefor. The printed wiring board 100 includes a thermosetting resin sheet 16 (insulation layer) having a via hole 20 (through hole) constituted by inner wall parts having different taper angles from each other, a copper foil 17 (conductor layer) provided on the thermosetting resin sheet 16, and a wiring pattern 13 (wiring layer) which is provided so as to be exposed from the via hole 20 and is electrically connected with the copper foil 17 through the via hole 20.

7. 发明授权

US06872251B2 Method for manufacturing single crystal ceramic powder, and single crystal ceramic powder, composite material, and electronic element 有权
标题翻译：单晶陶瓷粉末，单晶陶瓷粉末，复合材料和电子元件的制造方法
公开(公告)号：US06872251B2
公开(公告)日：2005-03-29
申请号：US10158570
申请日：2002-05-29
申请人： Minoru Takaya , Yoshiaki Akachi , Hiroyuki Uematsu , Hisashi Kobuke
发明人： Minoru Takaya , Yoshiaki Akachi , Hiroyuki Uematsu , Hisashi Kobuke
IPC分类号： C30B13/16 , C01B13/14 , C01G23/00 , C01G49/00 , C04B35/26 , C30B11/00 , H01F1/34 , H01F1/37 , H01F5/00 , H01G4/12 , C30B29/22
CPC分类号： H01G4/1227 , B32B18/00 , C01B13/145 , C01G23/002 , C01G23/006 , C01G49/0063 , C01G49/009 , C01P2002/72 , C01P2004/03 , C01P2004/32 , C01P2004/61 , C01P2004/62 , C04B35/265 , C04B35/465 , C04B35/6261 , C04B35/6262 , C04B35/62625 , C04B35/6263 , C04B35/6264 , C04B35/62645 , C04B35/62655 , C04B35/6268 , C04B35/63 , C04B35/632 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3224 , C04B2235/3232 , C04B2235/3234 , C04B2235/3236 , C04B2235/3255 , C04B2235/326 , C04B2235/3272 , C04B2235/3274 , C04B2235/3279 , C04B2235/3281 , C04B2235/3284 , C04B2235/3293 , C04B2235/3296 , C04B2235/3298 , C04B2235/36 , C04B2235/3817 , C04B2235/3852 , C04B2235/5436 , C04B2235/5445 , C04B2235/549 , C04B2235/6025 , C04B2237/704 , C30B11/00 , C30B29/22 , C30B29/30 , C30B29/32 , H01F1/34 , H01F1/37 , H01F5/003 , H01L2924/0002 , Y10S117/901 , Y10S428/90 , Y10T428/24926 , Y10T428/325 , H01L2924/00
摘要： A method for manufacturing single crystal ceramic powder is provided. The method includes a powder supply step for supplying powder consisting essentially of ceramic ingredients to a heat treatment area with a carrier gas, a heat treatment step for heating the powder supplied to the heat treatment area at temperatures required for single-crystallization of the powder to form a product, and a cooling step for cooling the product obtained in the heat treatment step to form single crystal ceramic powder. The method provides single crystal ceramic powder consisting of particles with a very small particle size and a sphericity being 0.9 or higher.
摘要翻译：提供了制造单晶陶瓷粉末的方法。该方法包括：粉末供给步骤，用于将主要由陶瓷成分组成的粉末供给到具有载气的热处理区域;热处理步骤，用于将粉末单次结晶所需的温度加热到加热处理区域中的粉末，形成产品，以及冷却步骤，用于冷却在热处理步骤中获得的产物以形成单晶陶瓷粉末。该方法提供由粒子非常小且球形度为0.9或更高的颗粒组成的单晶陶瓷粉末。

8. 发明申请

US20100065194A1 Method for manufacturing printed wiring board 审中-公开
标题翻译：印刷电路板制造方法
公开(公告)号：US20100065194A1
公开(公告)日：2010-03-18
申请号：US12461245
申请日：2009-08-05
申请人： Kenji Nagase , Hiroyuki Uematsu , Kenichi Kawabata
发明人： Kenji Nagase , Hiroyuki Uematsu , Kenichi Kawabata
IPC分类号： H05K3/06
CPC分类号： H05K3/427 , H05K3/025 , H05K3/4007 , H05K3/421 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481 , H05K2201/09563 , H05K2203/0554
摘要： To provide a method for manufacturing a printed wiring board which can easily and surely form a fine wiring pattern having a small layer thickness while enhancing the productivity by simplifying a process, when forming a wiring structure having a filled via. The method for manufacturing a printed wiring board according to the present invention includes: bonding a metal foil 20 provided with a carrier foil having a carrier foil layer 22 and a metal foil layer 21 onto a resin substrate 11 (insulator) so that the metal foil layer 21 can contact one surface of the resin substrate 11; subsequently forming a via hole V (connection hole); filling the via with a film 32 formed by plating; then peeling the carrier foil layer 22 of the metal foil 20 provided with the carrier foil from the metal foil layer 21; and patterning the metal foil layer 21 which remains on the resin substrate 11 in a bonded state to form a wiring pattern 23.
摘要翻译：提供一种制造印刷电路板的方法，其可以容易且可靠地形成具有小层厚度的精细布线图案，同时通过简化工艺来提高生产率，当形成具有填充通孔的布线结构时。根据本发明的制造印刷电路板的方法包括：将具有载体箔层22和金属箔层21的载体箔的金属箔20接合到树脂基板11（绝缘体）上，使得金属箔层21可以接触树脂基板11的一个表面; 随后形成通孔V（连接孔）; 用通过电镀形成的膜32填充通孔; 然后从金属箔层21剥离设置有载体箔的金属箔20的载体箔层22; 并且在接合状态下图案化保留在树脂基板11上的金属箔层21，以形成布线图案23。

9. 发明申请

US20090211799A1 Printed wiring board and manufacturing method therefor 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20090211799A1
公开(公告)日：2009-08-27
申请号：US12379295
申请日：2009-02-18
申请人： Kenji Nagase , Hiroyuki Uematsu , Kenichi Kawabata
发明人： Kenji Nagase , Hiroyuki Uematsu , Kenichi Kawabata
IPC分类号： H05K1/11 , B44C1/22 , H05K3/42 , H01K3/10
CPC分类号： H05K3/0035 , H05K1/115 , H05K3/0055 , H05K3/381 , H05K2201/09509 , H05K2201/09827 , H05K2203/025 , H05K2203/0554 , H05K2203/0557 , Y10T29/49155 , Y10T29/49165
摘要： The present invention provides a printed wiring board which can prevent a plating failure in a connection hole such as a via to be formed in the printed wiring board, thereby can enhance the connection reliability and a manufacturing method therefor. The printed wiring board 100 includes a thermosetting resin sheet 16 (insulation layer) having a via hole 20 (through hole) constituted by inner wall parts having different taper angles from each other, a copper foil 17 (conductor layer) provided on the thermosetting resin sheet 16, and a wiring pattern 13 (wiring layer) which is provided so as to be exposed from the via hole 20 and is electrically connected with the copper foil 17 through the via hole 20.
摘要翻译：本发明提供一种能够防止在印刷电路板中形成的通孔等的连接孔中的电镀失败的印刷电路板，从而能够提高连接可靠性及其制造方法。印刷布线板100包括具有由具有不同锥角的内壁部构成的通孔20（通孔）的热固性树脂片16（绝缘层），设置在热固性树脂上的铜箔17（导体层）布线图案13（布线层），其设置成从通孔20露出，并通过通孔20与铜箔17电连接。

10. 发明授权

US07233477B2 Data erasing device using permanent magnet 失效
标题翻译：使用永磁体的数据擦除装置
公开(公告)号：US07233477B2
公开(公告)日：2007-06-19
申请号：US10656113
申请日：2003-09-08
申请人： Hiroshi Hasegawa , Hisato Suzuki , Hiroyuki Uematsu
发明人： Hiroshi Hasegawa , Hisato Suzuki , Hiroyuki Uematsu
IPC分类号： H01F13/00
CPC分类号： G11B5/0245
摘要： In a portable data erasing device, to prevent data leaks from magnetic disk devices to be disposed, data is erased by a simple operation. The data erasing device using a magnetic field generated by permanent magnets to erase data comprises a sliding tray, a main body and a swinging tray. The sliding tray is movable into and out from the main body, two permanent magnets, adjacently arranged so that the north and south poles thereof have mutually attracting polarities, are attached to the front end of the sliding tray. One end of the swinging tray is fixed to the upper surface of the main body by a shaft, so that a magnetic disk device can be mounted and swung on top of the main body. While the sliding tray is extracted stepwise from the main body, the magnetic disk device can be swung, and data on the magnetic disks erased.
摘要翻译：在便携式数据擦除装置中，为了防止数据从磁盘装置泄漏出来，通过简单的操作来擦除数据。使用由永磁体产生的磁场来擦除数据的数据擦除装置包括滑动托盘，主体和摆动托盘。滑动托盘可移动进入主体和从主体移出，两个永磁体相邻地布置成使得其南极和南极具有相互吸引的极性，附接到滑动托盘的前端。摆动托盘的一端通过轴固定在主体的上表面，从而可以在主体的顶部上安装和摆动磁盘装置。当滑动托盘从主体逐步抽出时，磁盘装置可以摆动，并且磁盘上的数据被擦除。

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