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    • 1. 发明授权
    • Solution processing apparatus and method
    • 解决方案处理装置和方法
    • US06533864B1
    • 2003-03-18
    • US09639172
    • 2000-08-16
    • Yuji MatsuyamaShuichi Nagamine
    • Yuji MatsuyamaShuichi Nagamine
    • B05C1110
    • H01L21/6715B05C11/08
    • An upper side of a cup provided around a wafer is formed in a rectangular shape and a lower side thereof is formed in a cylindrical shape. The cup is formed such that, when seen from above, the portion forming the cylindrical shape is positioned within the portion forming the rectangular shape. The cup has a raising and lowering mechanism and is controlled by a control section. The upper side of the cup is placed by the side of the wafer during a scan by a supply nozzle. The lower side of the cup is placed over an upper level and a lower level of the wafer while a rinse liquid and a developing solution are shaken off. The scan by the supply nozzle is performed with the supply nozzle positioned in the upper cup portion.
    • 设置在晶片周围的杯的上侧形成为矩形,其下侧形成为圆筒状。 杯形成为从上方观察,形成圆筒形状的部分位于形成矩形形状的部分内。 杯具有升降机构,由控制部控制。 杯子的上侧在扫描期间被供给喷嘴放置在晶片的侧面。 将杯的下侧放置在晶片的上层和下层上,同时冲洗液体和显影液被摇动。 由供给喷嘴进行的扫描由位于上杯部的供给喷嘴进行。
    • 2. 发明授权
    • Solution processing apparatus and method
    • 解决方案处理装置和方法
    • US06514570B1
    • 2003-02-04
    • US09678705
    • 2000-10-03
    • Yuji MatsuyamaShuichi Nagamine
    • Yuji MatsuyamaShuichi Nagamine
    • B05D102
    • H01L21/6715B05D1/005G03F7/162G03F7/3021
    • A solution separation ring made of a material with adhesion to a processing solution stronger than that of a rear face of a wafer is provided to surround the periphery of a substrate horizontally held by a spin chuck with a slight clearance therebetween. A supply nozzle is moved from one end side to the other end side of the substrate while supplying the processing solution, and discharge ports of the supply nozzle are allowed to get closer to a summit portion of the solution separation ring near the other end side of the substrate. At this time, the processing solutions on the discharge ports and the front face of the substrate which are contiguous with each other by surface tension are separated caused so as to flow toward the solution separation ring side, thereby preventing an excessive processing solution from returning onto the front face of the substrate.
    • 提供一种由粘合到比晶片背面强度更高的处理液的材料制成的溶液分离环,以围绕由旋转卡盘水平保持的基板的周边,其间具有微小的间隙。 在供给处理液的同时,供给喷嘴从基板的一端侧向另一端侧移动,允许供给喷嘴的排出口靠近靠近另一端侧的溶液分离环的顶端部 底物。 此时,通过表面张力彼此邻接的排出口和基板的前表面上的处理溶液被分离,以便朝向溶液分离环侧流动,从而防止过量的处理溶液返回到 基板的正面。
    • 3. 发明授权
    • Solution processing apparatus
    • 解决方案处理设备
    • US06602382B1
    • 2003-08-05
    • US09694888
    • 2000-10-25
    • Yuji MatsuyamaShuichi Nagamine
    • Yuji MatsuyamaShuichi Nagamine
    • C23F100
    • H01L21/6715G03F7/3021Y10S118/04
    • A developing processing apparatus for supplying a developing solution to a wafer on which a photoresist film has been formed to thereby perform developing processing includes a wafer holding portion for horizontally holding the wafer, a linear nozzle held above the wafer holding portion for supplying the developing solution onto the wafer while moving in a predetermined horizontal direction, and a resistance bar for imparting discharge resistance to the developing solution discharged from the linear nozzle. This allows all discharge ports to discharge the developing solution uniformly, especially even when discharge pressure for the developing solution to be supplied is low in development of a scan method using a linear nozzle or a slit nozzle.
    • 将显影液供给到已经形成有光致抗蚀剂膜的晶片从而进行显影处理的显影处理装置包括用于水平保持晶片的晶片保持部分,保持在晶片保持部分上方的用于供应显影液的线性喷嘴 在沿预定水平方向移动的同时在晶片上,以及用于对从线性喷嘴排出的显影液赋予放电电阻的电阻棒。 这使得所有排出口均匀地排出显影溶液,特别是即使在使用线性喷嘴或狭缝喷嘴的扫描方法的显影中,供给显影液的排出压力低的情况下也是如此。
    • 4. 发明授权
    • Developing method and developing unit
    • 开发方法和开发单位
    • US06384894B2
    • 2002-05-07
    • US09761741
    • 2001-01-18
    • Yuji MatsuyamaShuichi Nagamine
    • Yuji MatsuyamaShuichi Nagamine
    • G03B2732
    • G03F7/3021
    • The present invention is a method for developing a substrate by supplying a developing solution from a developing solution supply nozzle onto a surface of the substrate mounted on a predetermined position, and comprises the steps of moving the developing solution supply nozzle from a standby position of the developing solution supply nozzle outside one end of the substrate to at least the other end of the substrate without supplying the developing solution, and thereafter, moving the developing solution supply nozzle from the other end to at least the one end while supplying the developing solution. Therefore, the developing solution supply nozzle which is used once and has a possibility of a drip of the developing solution does not pass above the substrate, so that the developing solution never drips from the developing solution supply nozzle onto the substrate before and after supplying the developing solution for some reason or other. Therefore, developing defect due to the drip of the developing solution can be prevented.
    • 本发明是一种通过从显影液供给喷嘴将显影液供给到安装在预定位置上的基板的表面来显影基板的方法,包括以下步骤:使显影液供给喷嘴从待机位置移动 将显影液供给喷嘴从衬底的一端向基材的至少另一端喷射而不供给显影液,然后在显影液供给的同时将显影液供给喷嘴从另一端移动到至少一端。 因此,使用一次并具有显影液滴下的可能性的显影液供给喷嘴不会通过基板的上方,因此显影液在供给前后不会从显影液供给喷嘴向基板上滴落 由于某种原因或其他原因开发解决方案。 因此,可以防止由于显影液的滴落引起的显影缺陷。
    • 6. 发明授权
    • Substrate processing apparatus and method
    • 基板加工装置及方法
    • US06332723B1
    • 2001-12-25
    • US09627113
    • 2000-07-27
    • Yuji MatsuyamaShuichi NagamineKoichi Asaka
    • Yuji MatsuyamaShuichi NagamineKoichi Asaka
    • G03F730
    • H01L21/6715G03F7/3021H01L21/67103Y10S134/902
    • In a state where a wafer is held by a wafer holding section and a temperature controlled liquid is discharged to a rim area on a rear face of the wafer from flow channels, a developing solution is heaped on a front face of the wafer. Thereafter, the wafer is rotated for a predetermined period of time in a state where the temperature controlled liquid is discharged to the rim area on the rear face of the wafer from the flow channels, whereby developing is performed. The wafer is heated by the wafer holding section with a large heat capacity in an area close to a center of the wafer, and a liquid film of the temperature controlled liquid is formed in the rim area of the wafer, whereby the wafer is heated. At this time, the wafer is rotated, so that the developing solution is stirred.
    • 在晶片由晶片保持部保持并且温度控制液体从流路向晶片背面的边缘区域排出的状态下,在晶片的正面上堆积显影液。 此后,在温度受控液体从流路向晶片背面的边缘区域排出的状态下,将晶片旋转预定时间,由此进行显影。 在靠近晶片的中心的区域中,晶片被晶片保持部分加热,并且在晶片的边缘区域形成温度控制液体的液膜,由此加热晶片。 此时,晶片旋转,从而搅拌显影液。
    • 8. 发明授权
    • Developing apparatus and method thereof
    • 显影装置及其制造方法
    • US06312171B1
    • 2001-11-06
    • US09635196
    • 2000-08-09
    • Yuji MatsuyamaMasahito Hamada
    • Yuji MatsuyamaMasahito Hamada
    • G03D500
    • G03F7/3021
    • A current member is disposed above a wafer holding section for holding a wafer and a top plate and a bottom plate of the current member are positioned so that respective air holes are overlapped each other in a vertical direction, and a developing solution is heaped on a front face of the wafer. Thereafter, the developing is performed with the bottom plate of the current member slid in a lateral direction so that the air holes are not overlapped each other in the vertical direction. In this configuration, air streams to the wafer are obstructed during the developing because the air holes in the current member are obstructed in the vertical direction, whereby occurrence of temperature distribution of the developing solution within the plane of the wafer caused by flows of air currents to the wafer is prevented and uniform developing processing can be performed.
    • 电流部件设置在用于保持晶片的晶片保持部分上方,并且当前部件的顶板和底板被定位成使得相应的气孔在垂直方向上彼此重叠,并且显影液堆积在 晶片前面。 此后,当前构件的底板沿横向方向滑动,使得气孔在垂直方向上不重叠时进行显影。 在这种构造中,由于当前构件中的空气孔在垂直方向上被阻塞,所以在显影期间阻挡了流到晶片的空气流,从而由于气流的流动而导致显影液在晶片平面内的温度分布的发生 防止了晶片,并且可以进行均匀的显影处理。