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1. 发明授权

US07249485B2 Substrate processing apparatus 失效
标题翻译：基板加工装置
公开(公告)号：US07249485B2
公开(公告)日：2007-07-31
申请号：US10935218
申请日：2004-09-08
申请人： Yuji Honda , Katsuhiro Nagasawa
发明人： Yuji Honda , Katsuhiro Nagasawa
IPC分类号： B21J13/10
CPC分类号： B65H23/032
摘要： Substrate processing apparatus for processing holes accurately positioned in an long film, comprising: work supporting devices for supporting the work; clamping devices for clamping the work onto the work supporting devices; first movement devices for moving the work supporting devices in the transferring direction of the work; guiding devices for guiding the work supporting devices; guide supporting devices for supporting these guiding devices; and second movement devices for moving the guide supporting devices in the direction perpendicular to the transferring direction of the work, wherein two pins or holes are disposed on or in each of the guiding devices, holes or pins to engage with the pins or holes are disposed on or in each of the guide supporting devices to combine the guiding devices and guide supporting devices in a grid form, and the holes and pins at four junctions are fitted.
摘要翻译：用于处理准确定位在长胶片中的孔的基板处理装置，包括：用于支撑工件的工件支撑装置; 用于将工件夹紧到工件支撑装置上的夹紧装置; 用于在工件的传送方向上移动工件支撑装置的第一移动装置; 用于引导工作支撑装置的引导装置; 用于支撑这些引导装置的引导支撑装置; 以及第二移动装置，用于沿着与工件的传送方向垂直的方向移动引导支撑装置，其中两个销或孔设置在每个引导装置上或每个引导装置中，设置有与销或孔接合的孔或销在每个导向支撑装置上或其中的每一个中，以引导装置和导向支撑装置为格栅形式组合，并且安装四个接合点处的孔和销。

2. 发明申请

US20050115796A1 Substrate processing apparatus 失效
标题翻译：基板加工装置
公开(公告)号：US20050115796A1
公开(公告)日：2005-06-02
申请号：US10935218
申请日：2004-09-08
申请人： Yuji Honda , Katsuhiro Nagasawa
发明人： Yuji Honda , Katsuhiro Nagasawa
IPC分类号： B26D7/01 , B21D33/00 , B23B47/00 , B23B47/28 , B23K26/10 , B23K37/00 , B23K37/04 , B23Q3/06 , B23Q5/22 , B23Q7/00 , B26F1/16 , B65G49/00 , B65H20/18 , B65H23/032 , B65H23/035 , H01L21/68 , H05K3/00
CPC分类号： B65H23/032
摘要： Substrate processing apparatus for processing holes accurately positioned in an long film, comprising: work supporting devices for supporting the work; clamping devices for clamping the work onto the work supporting devices; first movement devices for moving the work supporting devices in the transferring direction of the work; guiding devices for guiding the work supporting devices; guide supporting devices for supporting these guiding devices; and second movement devices for moving the guide supporting devices in the direction perpendicular to the transferring direction of the work, wherein two pins or holes are disposed on or in each of the guiding devices, holes or pins to engage with the pins or holes are disposed on or in each of the guide supporting devices to combine the guiding devices and guide supporting devices in a grid form, and the holes and pins at four junctions are fitted.
摘要翻译：用于处理准确定位在长胶片中的孔的基板处理装置，包括：用于支撑工件的工件支撑装置; 用于将工件夹紧到工件支撑装置上的夹紧装置; 用于在工件的传送方向上移动工件支撑装置的第一移动装置; 用于引导工作支撑装置的引导装置; 用于支撑这些引导装置的引导支撑装置; 以及第二移动装置，用于沿着与工件的传送方向垂直的方向移动引导支撑装置，其中两个销或孔设置在每个引导装置上或每个引导装置中，设置有与销或孔接合的孔或销在每个导向支撑装置上或其中的每一个中，以引导装置和导向支撑装置为格栅形式组合，并且安装四个接合点处的孔和销。

3. 发明授权

US07476065B2 Printed board drilling method and printed board machining apparatus 失效
标题翻译：印刷板钻孔方法和印刷板加工装置
公开(公告)号：US07476065B2
公开(公告)日：2009-01-13
申请号：US11139588
申请日：2005-05-31
申请人： Nobuhiko Suzuki , Katsuhiro Nagasawa
发明人： Nobuhiko Suzuki , Katsuhiro Nagasawa
IPC分类号： B23B35/00
CPC分类号： H05K3/0047 , B23Q17/2233 , H05K2203/0207 , Y10T408/03 , Y10T408/175 , Y10T408/36 , Y10T408/50 , Y10T408/5623
摘要： A printed board drilling method and a printed board machining apparatus capable of improving machining quality, such as improving positional accuracy of holes and true roundness of machined holes, and improving work efficiency by minimizing a runout of the tip of a drill. An extension of the drill extending out of a spindle when the drill is held by the spindle is defined in advance per type or mode of use of each drill. One drill is selected among a plurality of drills corresponding to a shape of holes to be drilled in the printed board and the spindle holds the drill so that the selected drill extends out of the spindle by the extension corresponding to the selected drill. Then, the move of the spindle with respect to the printed board is controlled and the selected drill is rotationally driven by the spindle to drill the printed board.
摘要翻译：一种能够改善加工质量的印刷板钻孔方法和印刷板加工装置，例如提高孔的位置精度和加工孔的真实圆度，并且通过最小化钻头尖端的跳动来提高加工效率。当钻头由主轴保持时，从主轴延伸出来的钻头的延伸部分是根据每个钻头的类型或使用方式进行预先确定的。在对应于在印刷板中要钻孔的孔的形状的多个钻孔中选择一个钻头，并且主轴保持钻头，使得所选择的钻头通过对应于所选钻头的延伸而从主轴延伸出轴。然后，控制主轴相对于印刷电路板的移动，所选择的钻头由主轴旋转驱动以钻出印刷电路板。

4. 发明授权

US07637702B2 Drilling method 有权
标题翻译：钻孔方法
公开(公告)号：US07637702B2
公开(公告)日：2009-12-29
申请号：US11489491
申请日：2006-07-20
申请人： Takao Furukawa , Hiroshi Kawasaki , Toshiyuki Iwata , Katsuhiro Nagasawa , Takahiko Yamashita
发明人： Takao Furukawa , Hiroshi Kawasaki , Toshiyuki Iwata , Katsuhiro Nagasawa , Takahiko Yamashita
IPC分类号： B23B35/00
CPC分类号： B23B35/00 , B23B39/161 , B23B39/24 , B23B2228/36 , B23B2270/486 , B23B2270/54 , H05K3/0008 , H05K3/0047 , H05K3/0097 , Y10T408/03 , Y10T408/175
摘要： There is provided a drilling method capable of improving machining accuracy of a printed board drilling apparatus as a whole by decreasing dispersion of the machining accuracy even if it is a multi-spindle printed board drilling apparatus. A misalignment of an axial center of a drill with respect to a designed axial center in X and Y directions is detected in advance per a certain number of revolutions of each spindle that rotates the drill. Holes of two or more types of diameter are made on a printed board by making holes of at least one diameter, e.g., an exposure master hole, per each spindle and by making holes of all other diameters almost simultaneously by all of the spindles.
摘要翻译：提供了一种能够通过降低加工精度的分散来提高印刷板钻孔设备的加工精度的钻孔方法，即使它是多轴印刷板钻孔设备。在旋转钻头的每个主轴的一定转数中，预先检测钻头的轴心在X和Y方向上相对于设计的轴向中心的偏移。通过为每个主轴制造至少一个直径的孔，例如曝光主孔，并且通过所有其他直径的孔几乎同时由所有主轴制成两个或更多种直径的孔。

5. 发明申请

US20060082076A1 Tool positioning device and machining tool 有权
标题翻译：刀具定位装置和加工工具
公开(公告)号：US20060082076A1
公开(公告)日：2006-04-20
申请号：US11252616
申请日：2005-10-19
申请人： Takayuki Hashimoto , Katsuhiro Nagasawa , Shintarou Takahashi
发明人： Takayuki Hashimoto , Katsuhiro Nagasawa , Shintarou Takahashi
IPC分类号： B23B31/02
CPC分类号： B23C5/28 , B23B49/005 , B23B51/06 , B23C2210/52 , B23C2250/12 , B23C2255/12 , H05K3/0047 , Y10T279/3487 , Y10T408/8925 , Y10T408/907 , Y10T408/99 , Y10T409/308624
摘要： There is provided a tool positioning device and a machining element whose structures are simple and which can reduce a running cost. In addition to a hole that engages with a shank of an end mill, a channel is provided so that it penetrates through the device such that one end thereof communicates with an upper face of the device and the other end communicates with a lower end of the device. In this case, it is more effective to provide a concave portion that is opened to the upper face and communicates with the hole. The same effect may be obtained by making a cylindrical hole for example instead of the channel.
摘要翻译：提供了一种结构简单并且可以降低运行成本的刀具定位装置和加工元件。除了与端铣刀的柄接合的孔之外，设置通道，使得其穿过该装置，使得其一端与装置的上表面连通，另一端与下端连通设备。在这种情况下，提供对上表面开口并与孔连通的凹部更为有效。通过制造例如代替通道的圆柱形孔可以获得相同的效果。

6. 发明授权

US08356961B2 Machining apparatus and machining method 有权
标题翻译：加工设备及加工方法
公开(公告)号：US08356961B2
公开(公告)日：2013-01-22
申请号：US12590198
申请日：2009-11-04
申请人： Norishige Kumagai , Tamio Otani , Katsuhiro Nagasawa , Jun Wakamatsu , Hiroyuki Kamata , Tomoaki Ozaki
发明人： Norishige Kumagai , Tamio Otani , Katsuhiro Nagasawa , Jun Wakamatsu , Hiroyuki Kamata , Tomoaki Ozaki
IPC分类号： B23B41/00
CPC分类号： B23Q1/032 , B23Q39/04 , H05K3/0008 , H05K3/0047 , Y10T408/03 , Y10T408/3806 , Y10T408/3833 , Y10T408/3839 , Y10T408/385 , Y10T408/44 , Y10T408/50 , Y10T408/5612 , Y10T408/5617 , Y10T408/91
摘要： The invention provides a machining apparatus, and its machining method, having machining tables whose weight do not increase so much even if a number of machining sections such as spindles is increased. One of the machining tables is a rectangular stationary table having a groove in the direction perpendicular to the longitudinal direction on its surface and the other is a rectangular movable table engaged with the groove. The machining apparatus machines a printed circuit board, whose area is larger than that of the movable table, on a mounting surface of the stationary table by changing position of the printed circuit board by moving the movable table and by determining machining position by moving a spindle at position facing the mounting surface of the stationary table.
摘要翻译：本发明提供了一种加工装置及其加工方法，其具有即使增加诸如锭子的多个加工部分的重量也不会增加的加工台。其中一个加工台是在其表面上沿垂直于纵向的方向具有凹槽的矩形静止台，另一个是与凹槽啮合的矩形可移动台。该加工装置通过移动可移动工作台来改变印刷电路板的位置，并通过移动主轴来确定加工位置，将其面积大于可移动工作台面积的印刷电路板加工到固定台的安装表面上在朝向固定台的安装表面的位置。

7. 发明申请

US20100119317A1 Machining apparatus and machining method 有权
标题翻译：加工设备及加工方法
公开(公告)号：US20100119317A1
公开(公告)日：2010-05-13
申请号：US12590198
申请日：2009-11-04
申请人： Norishige Kumagai , Tamio Otani , Katsuhiro Nagasawa , Jun Wakamatsu , Hiroyuki Kamata , Tomoaki Ozaki
发明人： Norishige Kumagai , Tamio Otani , Katsuhiro Nagasawa , Jun Wakamatsu , Hiroyuki Kamata , Tomoaki Ozaki
IPC分类号： B23B39/16 , B23Q3/02 , B23B47/18 , B23Q11/10
CPC分类号： B23Q1/032 , B23Q39/04 , H05K3/0008 , H05K3/0047 , Y10T408/03 , Y10T408/3806 , Y10T408/3833 , Y10T408/3839 , Y10T408/385 , Y10T408/44 , Y10T408/50 , Y10T408/5612 , Y10T408/5617 , Y10T408/91
摘要： The invention provides a machining apparatus, and its machining method, having machining tables whose weight do not increase so much even if a number of machining sections such as spindles is increased. One of the machining tables is a rectangular stationary table having a groove in the direction perpendicular to the longitudinal direction on its surface and the other is a rectangular movable table engaged with the groove. The machining apparatus machines a printed circuit board, whose area is larger than that of the movable table, on a mounting surface of the stationary table by changing position of the printed circuit board by moving the movable table and by determining machining position by moving a spindle at position facing the mounting surface of the stationary table.
摘要翻译：本发明提供了一种加工装置及其加工方法，其具有即使增加诸如锭子的多个加工部分的重量也不会增加的加工台。其中一个加工台是在其表面上沿垂直于纵向的方向具有凹槽的矩形静止台，另一个是与凹槽啮合的矩形可移动台。该加工装置通过移动可移动工作台来改变印刷电路板的位置，并通过移动主轴来确定加工位置，将其面积大于可移动工作台面积的印刷电路板加工到固定台的安装表面上在朝向固定台的安装表面的位置。

8. 发明授权

US07130715B2 Machining method and machining apparatus 有权
标题翻译：加工方法和加工装置
公开(公告)号：US07130715B2
公开(公告)日：2006-10-31
申请号：US10679408
申请日：2003-10-07
申请人： Kazuo Watanabe , Takahiko Yamashita , Yasushi Ito , Katsuhiro Nagasawa
发明人： Kazuo Watanabe , Takahiko Yamashita , Yasushi Ito , Katsuhiro Nagasawa
IPC分类号： G06F19/00
CPC分类号： G05B19/402 , B23Q17/2233 , G05B2219/41192 , G05B2219/45035 , H05K3/0008 , H05K3/0047 , H05K2203/163 , Y10T29/49778
摘要： In a machining method and a machining apparatus, prior to machining, an NC control unit makes an X-axis drive unit move a table based on examination conditions specified in advance. Thus, the NC control unit obtains a stabilization time required from the command-reach time of a poisoning command and till the stabilization of position response of the table within a predetermined allowable range. Likewise, for moving a drill in a Y-axis direction, the NC control unit obtains a stabilization time required till the stabilization of position response within a predetermined allowable range. At the time of machining, the drill is moved in a Z-axis direction to cut into a printed wiring board as soon as the obtained stabilization time has passed.
摘要翻译：在加工方法和加工装置中，在加工之前，NC控制单元使X轴驱动单元基于预先规定的检查条件移动台。因此，NC控制单元获得从中毒命令的命令到达时间所需的稳定时间，并且获得在预定允许范围内使表的位置响应稳定。类似地，为了在Y轴方向上移动钻头，NC控制单元在预定的允许范围内获得稳定位置响应所需的稳定时间。在加工时，一旦获得的稳定时间过去，钻头就沿Z轴方向移动，从而切割成印刷线路板。

9. 发明授权

US07507058B2 Tool positioning device and machining tool 有权
标题翻译：刀具定位装置和加工工具
公开(公告)号：US07507058B2
公开(公告)日：2009-03-24
申请号：US11252616
申请日：2005-10-19
申请人： Takayuki Hashimoto , Katsuhiro Nagasawa , Shintarou Takahashi
发明人： Takayuki Hashimoto , Katsuhiro Nagasawa , Shintarou Takahashi
IPC分类号： B23B51/02
CPC分类号： B23C5/28 , B23B49/005 , B23B51/06 , B23C2210/52 , B23C2250/12 , B23C2255/12 , H05K3/0047 , Y10T279/3487 , Y10T408/8925 , Y10T408/907 , Y10T408/99 , Y10T409/308624
摘要： A tool positioning device and a machining element have simple structures which can reduce running cost. In addition to a hole that engages with a shank of an end mill, a channel is provided so that it penetrates through the device such that one end thereof communicates with an upper face of the device and the other end communicates with a lower end of the device. In this case, it is more effective to provide a concave portion that is opened to the upper face and communicates with the hole. The same effect may be obtained by making a cylindrical hole, for example, instead of the channel.
摘要翻译：刀具定位装置和加工元件结构简单，可以降低运行成本。除了与端铣刀的柄接合的孔之外，还设置有通道，使得其通过装置，使得其一端与装置的上表面连通，另一端与设备。在这种情况下，提供对上表面开口并与孔连通的凹部更为有效。例如通过制造圆柱形孔而不是通道可以获得相同的效果。

10. 发明申请

US20060127652A1 Multi-layered circuit board and manufacturing method of multi-layered circuit board 有权
标题翻译：多层电路板及多层电路板的制造方法
公开(公告)号：US20060127652A1
公开(公告)日：2006-06-15
申请号：US11297358
申请日：2005-12-09
申请人： Yasuhiko Kanaya , Akira Irie , Katsuhiro Nagasawa , Toru Yuki
发明人： Yasuhiko Kanaya , Akira Irie , Katsuhiro Nagasawa , Toru Yuki
IPC分类号： B32B3/10 , B32B3/00 , B32B18/00 , C04B35/64
CPC分类号： H05K3/429 , H05K1/0268 , H05K3/0047 , H05K2201/092 , H05K2201/09718 , H05K2201/09845 , H05K2203/0207 , H05K2203/0242 , H05K2203/163 , H05K2203/175 , Y10T428/24322 , Y10T428/24917 , Y10T428/24926
摘要： There is provided a multi-layered circuit board and a manufacturing method of the multi-layered circuit board that allows electronic parts to be mounted adequately and that will not hamper performance of the electronic parts. A power terminal (pin) of an electronic part to be mounted on a surface of the multi-layered circuit board is inserted into a plated through hole to connect with a first conductive layer. A detecting section having a detecting hole which is formed coaxially with the through hole and whose diameter is larger than the through hole is provided on a second conductive layer on the back of the first conductive layer. A hole having a large diameter is formed by a tool along the through hole from the back while applying voltage between the second conductive layer and the tool. A depth of the hole is set based on that the tool electrically conducts with the detecting hole. Unnecessary plate of the through hole may be removed by the large hole.
摘要翻译：提供了一种多层电路板和多层电路板的制造方法，其允许电子部件被适当地安装，并且不会妨碍电子部件的性能。要安装在多层电路板的表面上的电子部件的电源端子（销）插入到电镀通孔中以与第一导电层连接。在第一导电层的背面的第二导电层上设置有具有与通孔同轴并且其直径大于通孔的检测孔的检测部。在第二导电层和工具之间施加电压时，具有大直径的孔由工具沿着通孔从背面形成。基于工具与检测孔电导通，设定孔的深度。通孔的不必要的板可以被大孔除去。

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