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1. 发明申请

US20130236738A1 LAMINATE AND METHOD FOR PRODUCING LAMINATE 审中-公开
标题翻译：层压板和生产层压板的方法
公开(公告)号：US20130236738A1
公开(公告)日：2013-09-12
申请号：US13885862
申请日：2011-11-17
申请人： Yuichiro Yamauchi , Shinji Saito , Masaru Akabayashi , Satoshi Hirano
发明人： Yuichiro Yamauchi , Shinji Saito , Masaru Akabayashi , Satoshi Hirano
IPC分类号： H05K1/11
CPC分类号： H05K1/11 , B23K35/001 , C04B41/009 , C04B41/52 , C04B41/90 , C04B2111/00844 , C23C24/04 , C23C28/322 , C23C28/34 , H01L23/15 , H01L23/3735 , H01L2924/0002 , H05K1/0306 , H05K3/0061 , H05K3/388 , Y10T428/12611 , C04B35/00 , C04B35/10 , C04B41/4545 , C04B41/50 , C04B41/5116 , C04B41/5127 , C04B41/5094 , C04B41/515 , C04B41/522 , C04B41/5155 , H01L2924/00
摘要： It is possible to obtain a laminate having high adhesion strength between ceramic and a metal coating by providing the following: an insulating ceramic substrate; an intermediate layer formed on the surface of the ceramic substrate and having a metal-containing principal component metal layer and an active ingredient layer including metal, a metal oxide, or a metal hydride; and a metal coating formed on the surface of the intermediate layer by accelerating a metal-containing powder with gas, and depositing the same on the surface thereof by spraying while in a solid state.
摘要翻译：可以通过提供以下方式获得陶瓷和金属涂层之间具有高粘合强度的层压体：绝缘陶瓷基板; 形成在陶瓷基板的表面上并具有含金属的主要成分金属层的中间层和包含金属，金属氧化物或金属氢化物的活性成分层; 以及通过用气体加速含金属的粉末而在中间层的表面上形成的金属涂层，并且在固态下通过喷涂将其沉积在其表面上。

2. 发明申请

US20140134448A1 LAMINATED BODY AND METHOD OF MANUFACTURING LAMINATED BODY 审中-公开
标题翻译：层压体和制造层压体的方法
公开(公告)号：US20140134448A1
公开(公告)日：2014-05-15
申请号：US14130566
申请日：2012-07-11
申请人： Yuichiro Yamauchi , Satoshi Hirano , Shinji Saito , Toshihiko Hanamachi
发明人： Yuichiro Yamauchi , Satoshi Hirano , Shinji Saito , Toshihiko Hanamachi
IPC分类号： B32B15/04 , B05D1/12 , C23C28/02
CPC分类号： B32B15/04 , B05D1/12 , C04B37/026 , C04B2237/121 , C04B2237/126 , C04B2237/128 , C04B2237/34 , C04B2237/341 , C04B2237/343 , C04B2237/346 , C04B2237/348 , C04B2237/366 , C04B2237/368 , C04B2237/402 , C04B2237/706 , C23C24/04 , C23C28/02 , C23C28/30 , H01L21/4846 , H01L23/3735 , H01L23/498 , H01L2224/291 , H01L2224/32225 , H01L2224/83447 , H01L2924/1305 , H01L2924/13055 , H05K1/0306 , H05K3/14 , H05K3/38 , H05K2201/0341 , H05K2201/0355 , H05K2203/1344 , Y10T428/12056 , H01L2924/014 , H01L2924/00
摘要： The laminated body includes a ceramic base member having an insulating property, an intermediate layer including metal or alloy as a main component formed on a surface of the ceramic base member, and a metal film layer (a circuit layer and a cooling fin) formed on a surface of the intermediate layer by accelerating a powder of metal or alloy with a gas and spraying and depositing the powder on the surface of the intermediate layer as the powder is in a solid state.
摘要翻译：层叠体包括具有绝缘性的陶瓷基材，在陶瓷基材的表面形成有作为主要成分的金属或合金的中间层和形成在陶瓷基材的表面上的金属膜层（电路层和冷却片）通过用气体加速金属或合金粉末的中间层的表面，并且当粉末处于固体状态时将粉末喷涂并沉积在中间层的表面上。

3. 发明申请

US20140069700A1 LAMINATION, CONDUCTIVE MATERIAL, AND METHOD FOR MANUFACTURING LAMINATION 审中-公开
标题翻译：层压，导电材料和制造层压方法
公开(公告)号：US20140069700A1
公开(公告)日：2014-03-13
申请号：US14006425
申请日：2012-03-22
申请人： Satoshi Hirano , Yuichiro Yamauchi , Masaru Akabayashi , Shinji Saito , Toshihiko Hanamachi
发明人： Satoshi Hirano , Yuichiro Yamauchi , Masaru Akabayashi , Shinji Saito , Toshihiko Hanamachi
IPC分类号： H05K1/09 , H01B13/30
CPC分类号： H05K1/092 , B32B15/017 , B32B15/018 , C23C24/04 , C23C28/021 , C23C28/023 , C23C28/321 , C23C28/322 , H01B13/30
摘要： A lamination includes: a substrate formed of aluminum or aluminum alloy; an intermediate layer formed of any one metal or nonmetal selected from the group consisting of silver, gold, chromium, iron, germanium, manganese, nickel, silicon, and zinc, or an alloy containing the any one metal, on a surface of the substrate; and a film layer formed by accelerating powder material of copper or copper alloy together with gas heated to a temperature lower than a melting point of the powder material and spraying and depositing a solid-phase powder material onto a surface of the intermediate layer.
摘要翻译：叠层包括：由铝或铝合金形成的基底; 由选自银，金，铬，铁，锗，锰，镍，硅和锌的任何一种金属或非金属或含有任何一种金属的合金形成的中间层在基材的表面上 ; 以及通过加热铜或铜合金的粉末材料以及加热到低于粉末材料的熔点的温度的气体形成的膜层，并将固相粉末材料喷涂并沉积到中间层的表面上。

4. 发明授权

US09070487B2 Conductive member 有权
标题翻译：导电部件
公开(公告)号：US09070487B2
公开(公告)日：2015-06-30
申请号：US13977968
申请日：2011-12-26
申请人： Takashi Kayamoto , Shinji Saito , Yuichiro Yamauchi
发明人： Takashi Kayamoto , Shinji Saito , Yuichiro Yamauchi
IPC分类号： B32B15/00 , H01B5/02 , C23C24/04 , H01B1/02
CPC分类号： H01B5/02 , C23C24/04 , H01B1/02
摘要： A conductive member disposed as a power supply line and the like includes: a first conductive material and a second conductive material, at least one of which includes a conductive material having electrical resistance lower than that of aluminum; and a metal film formed by depositing powder including a metal, which is accelerated together with a gas and sprayed, in a sold state, onto a surface of a butting part, where the first conductive material and the second conductive material are butted against each other.
摘要翻译：设置为电源线等的导电部件包括：第一导电材料和第二导电材料，其至少一个包括具有比铝的电阻低的导电材料; 以及金属膜，其通过沉积包括金属的粉末形成，所述金属与气体一起被加速并以销售状态喷射到对接部分的表面上，其中所述第一导电材料和所述第二导电材料彼此抵接。

5. 发明申请

US20130292152A1 CONDUCTIVE MEMBER 有权
标题翻译：导电会员
公开(公告)号：US20130292152A1
公开(公告)日：2013-11-07
申请号：US13977968
申请日：2011-12-26
申请人： Takashi Kayamoto , Shinji Saito , Yuichiro Yamauchi
发明人： Takashi Kayamoto , Shinji Saito , Yuichiro Yamauchi
IPC分类号： H01B5/02
CPC分类号： H01B5/02 , C23C24/04 , H01B1/02
摘要： A conductive member disposed as a power supply line and the like includes: a first conductive material and a second conductive material, at least one of which includes a conductive material having electrical resistance lower than that of aluminum; and a metal film formed by depositing powder including a metal, which is accelerated together with a gas and sprayed, in a sold state, onto a surface of a butting part, where the first conductive material and the second conductive material are butted against each other.
摘要翻译：设置为电源线等的导电部件包括：第一导电材料和第二导电材料，其至少一个包括具有比铝的电阻低的导电材料; 以及金属膜，其通过沉积包括金属的粉末形成，所述金属与气体一起被加速并以销售状态喷射到对接部分的表面上，其中所述第一导电材料和所述第二导电材料彼此抵接。

6. 发明申请

US20130260285A1 BRAZING MATERIAL FOR BONDING IN ATMOSPHERE, BONDED ARTICLE, AND CURRENT COLLECTING MATERIAL 审中-公开
标题翻译：用于在大气中粘合的粘合材料，粘结物品和电流收集材料
公开(公告)号：US20130260285A1
公开(公告)日：2013-10-03
申请号：US13991504
申请日：2011-12-01
申请人： Yuichiro Yamauchi , Shinji Saito
发明人： Yuichiro Yamauchi , Shinji Saito
IPC分类号： B23K35/30 , H01M8/02
CPC分类号： B23K35/3006 , B23K35/00 , B23K35/28 , B23K35/30 , B23K2101/36 , B23K2103/04 , B23K2103/05 , B23K2103/16 , B23K2103/18 , B23K2103/26 , B23K2103/52 , C04B37/026 , C04B2237/125 , C04B2237/34 , C04B2237/341 , C04B2237/343 , C04B2237/348 , C04B2237/368 , C04B2237/406 , C22C5/06 , C22C30/00 , H01M8/0202 , H01M8/0215 , H01M8/0228 , H01M8/0271 , H01M8/0297 , H01M2008/1293
摘要： A brazing alloy for bonding in air contains Ag, B, and Si, as essential components, in which the total of constituent elements except for Ag is set to more than 50% by volume and not more than 90% by volume, Si content in the constituent elements except for Ag is set to more than 22% by volume, and B content in the constituent elements except for Ag is set to more than 14% by volume. In a bonded layer of a bonded specimen of the present invention, after holding at high temperature, no void as observed in a bonded specimen after holding at high temperature of a Comparative Sample is observed, the brazing alloy is sufficiently melted, and superior gas sealing characteristics are maintained even after holding at high temperature for a long time.
摘要翻译：用于在空气中粘合的钎焊合金含有Ag，B和Si作为必要成分，其中Ag除外的组成元素的总量设定为大于50体积％且不大于90体积％，Si含量除了Ag以外的构成元素被设定为大于22体积％，除Ag以外的构成元素的B含量设定为大于14体积％。在本发明的接合试样的接合层中，在高温保持后，观察到在比较样品的高温下保持后的接合试样中没有观察到的空隙，钎焊合金充分熔融，气密性优异即使在长时间保持高温后也保持特性。

7. 发明申请

US20130040226A1 BRAZING MATERIAL FOR BONDING IN ATMOSPHERE, BONDED ARTICLE, AND CURRENT COLLECTING MATERIAL 审中-公开
标题翻译：用于在大气中粘合的粘合材料，粘结物品和电流收集材料
公开(公告)号：US20130040226A1
公开(公告)日：2013-02-14
申请号：US13642770
申请日：2011-04-27
申请人： Yuichiro Yamauchi , Shinji Saito
发明人： Yuichiro Yamauchi , Shinji Saito
IPC分类号： C22C5/06 , C22C30/00 , B32B15/01 , B32B18/00 , H01M8/04 , H01M4/86
CPC分类号： C22C5/06 , B23K35/0244 , B23K35/26 , B23K35/3006 , B23K35/3602 , H01M8/0206 , H01M8/0208 , H01M2008/1293 , Y10T428/12896
摘要： A brazing alloy for bonding in air, in which the melting point is reduced so as to perform brazing at a low temperature without using flux even in air, is provided. In addition, a bonded article and a current collecting material, each of which is bonded with the brazing alloy and has preferable gas sealing characteristics and superior bonding strength, are provided. The brazing alloy for bonding in air includes Ag and B as essential components. The amount of Ag is not less than 50 vol. % and less than 92 vol. %, and the amount of B is greater than 8 vol. % and not more than 50% vol. %. The amounts of Ag and B are adjusted so that the total of the amounts of Ag and B is 100% including inevitable impurities.
摘要翻译：提供了一种用于在空气中粘合的钎焊合金，其中熔点降低，以便在低温下进行钎焊，而不使用甚至在空气中的焊剂。此外，提供了与钎焊合金结合并具有优选的气体密封特性和优异的接合强度的接合体和集电材料。用于在空气中粘合的钎焊合金包括Ag和B作为必要组分。 Ag的量不小于50体积％。％且小于92体积％，B量大于8体积％。％且不超过50％体积。％。调整Ag和B的量，使得Ag和B的量的总量为100％，包括不可避免的杂质。

8. 发明申请

US20140209202A1 MEMBER WITH FLOW PASSAGE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有流动通道的构件及其制造方法
公开(公告)号：US20140209202A1
公开(公告)日：2014-07-31
申请号：US14237224
申请日：2012-08-06
申请人： Yuichiro Yamauchi , Hidemitsu Hideshima , Satoshi Hirano
发明人： Yuichiro Yamauchi , Hidemitsu Hideshima , Satoshi Hirano
IPC分类号： F16L9/02 , C23C24/04
CPC分类号： F16L9/02 , C23C24/04 , F28F3/12 , F28F7/02
摘要： A member with flow passage includes: a base member; a plate-like member including two flat plate portions that are positioned at both widthwise ends and have main surfaces passing over one and the same plane, and a convex portion that is provided between the two flat plate portions and has a cross section shaped in a thickness direction so as to protrude with respect to the flat plate portions, and forming the flow passage; and a metal deposit layer that is formed by, while main surfaces of the flat plate portions opposite to a top of the convex portion are facing the base member, accelerating powder of metal or alloy together with a gas, and spraying and depositing the powder in a solid-phase state on a surface of the plate-like member at the top side of the convex portion and a surface of the base member.
摘要翻译：具有流动通道的构件包括：基座构件; 包括两个平板部分的板状构件，所述两个平板部分位于两个宽度方向的两端并且具有穿过同一平面的主表面;以及凸部，其设置在所述两个平板部之间，并且具有成形为厚度方向相对于平板部突出，形成流路; 以及金属沉积层，所述金属沉积层通过与所述凸部的顶部相对的所述平板部的主面朝向所述基材而形成，与气体一起加速金属或合金的粉末，并且将所述粉末喷雾并沉积在在凸部的上侧的板状部件的表面和基体部件的表面的固相状态。

9. 发明申请

US20140023875A1 LAMINATION AND METHOD FOR MANUFACTURING LAMINATION 有权
标题翻译：层压和制造层压方法
公开(公告)号：US20140023875A1
公开(公告)日：2014-01-23
申请号：US14009420
申请日：2012-04-06
申请人： Satoshi Hirano , Yuichiro Yamauchi , Masaru Akabayashi , Toshihiko Hanamachi
发明人： Satoshi Hirano , Yuichiro Yamauchi , Masaru Akabayashi , Toshihiko Hanamachi
IPC分类号： B05D1/12 , B32B15/01 , B05D1/36 , B32B15/16
CPC分类号： B05D1/12 , B05B7/1486 , B05D1/36 , B22F2007/042 , B32B15/01 , B32B15/16 , C23C14/025 , C23C14/16 , C23C24/04 , C23C28/021 , C23C28/023 , C23C28/42 , Y10T428/12076
摘要： A lamination includes a substrate formed of a metal or alloy, an intermediate layer formed on a surface of the substrate and is formed of a metal or alloy that is softer than the substrate, and a metal film deposited by accelerating a powder material of a metal or alloy together with a gas heated to a temperature lower than the melting point of the powder material and spraying it onto the intermediate layer while keeping it in a solid phase.
摘要翻译：叠层包括由金属或合金形成的基板，形成在基板的表面上并由比基板更软的金属或合金形成的中间层，以及通过加速金属的粉末材料而沉积的金属膜或合金以及加热到低于粉末材料的熔点的温度的气体，并将其喷在中间层上同时保持固相。

10. 发明授权

US09162251B2 Lamination and method for manufacturing lamination 有权
标题翻译：叠层和层压制造方法
公开(公告)号：US09162251B2
公开(公告)日：2015-10-20
申请号：US14009420
申请日：2012-04-06
申请人： Satoshi Hirano , Yuichiro Yamauchi , Masaru Akabayashi , Toshihiko Hanamachi
发明人： Satoshi Hirano , Yuichiro Yamauchi , Masaru Akabayashi , Toshihiko Hanamachi
IPC分类号： B05D1/12 , C23C24/04 , C23C28/02 , B32B15/01 , B05B7/14 , B05D1/36 , B32B15/16 , C23C14/02 , C23C14/16 , C23C28/00 , B22F7/04
CPC分类号： B05D1/12 , B05B7/1486 , B05D1/36 , B22F2007/042 , B32B15/01 , B32B15/16 , C23C14/025 , C23C14/16 , C23C24/04 , C23C28/021 , C23C28/023 , C23C28/42 , Y10T428/12076
摘要： A lamination includes a substrate formed of a metal or alloy, an intermediate layer formed on a surface of the substrate and is formed of a metal or alloy that is softer than the substrate, and a metal film deposited by accelerating a powder material of a metal or alloy together with a gas heated to a temperature lower than the melting point of the powder material and spraying it onto the intermediate layer while keeping it in a solid phase.
摘要翻译：叠层包括由金属或合金形成的基板，形成在基板的表面上并由比基板更软的金属或合金形成的中间层，以及通过加速金属的粉末材料而沉积的金属膜或合金以及加热到低于粉末材料的熔点的温度的气体，并将其喷在中间层上同时保持固相。

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