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1. 发明授权

US5321096A Polyimide composition 失效
标题翻译：聚酰亚胺组合物
公开(公告)号：US5321096A
公开(公告)日：1994-06-14
申请号：US35043
申请日：1993-03-22
申请人： Yuichi Okawa , Nobuhito Koga , Hideaki Oikawa , Tadashi Asanuma , Akihiro Yamaguchi
发明人： Yuichi Okawa , Nobuhito Koga , Hideaki Oikawa , Tadashi Asanuma , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C08L71/00 , C08L79/08 , C08L81/06 , C08F283/04 , C08G69/48
CPC分类号： C08L71/00 , C08G73/101 , C08L79/08 , C08L81/06
摘要： A thermoplastic resin composition comprise 99.9.about.50 parts by weight of one or more thermoplastic resin selected from the group consisting of aromatic polyimide, aromatic polyetherimide, aromatic polyamideimide, aromatic polyethersulfone and aromatic polyether ketone and 0.1.about.50 parts by weight of one or more liquid crystal type aromatic polyimide having recurring structural units represented by the formula (1): ##STR1## wherein R.sub.1 .about.R.sub.5 is a hydrogen atom, fluorine atom, trifluoromethyl, methyl, ethyl or cyano and may be the same or different, and R is a tetravalent radical having 6.about.27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed aromatic radical connected each other with a direct bond or a bridge member.The present invention can provide thermoplastic resin compositions which have remarkably good processability and excellent thermal stability in addition to essentially excellent properties of each resin.
摘要翻译：热塑性树脂组合物包含99.9重量份的一种或多种选自芳族聚酰亚胺，芳族聚醚酰亚胺，芳族聚酰胺酰亚胺，芳族聚醚砜和芳族聚醚酮的热塑性树脂和0.1重量份的一种或多种液体具有由式（1）表示的重复结构单元的结晶型芳族聚酰亚胺：（1）n原子，氟原子，三氟甲基，甲基，乙基或氰基，可以相同或不同，R是具有 6个碳原子，并且选自由直链或桥构件相互连接的单芳族基团，缩合多芳族基团和非缩合芳族基团组成的组。本发明可以提供具有非常好的加工性和优异的热稳定性的热塑性树脂组合物，除了每种树脂的基本上优异的性能。

2. 发明授权

US5494996A Polyimide resin composition 失效
标题翻译：聚酰亚胺树脂组合物
公开(公告)号：US5494996A
公开(公告)日：1996-02-27
申请号：US277568
申请日：1994-07-20
申请人： Shoji Tamai , Yuichi Okawa , Wataru Yamashita , Yoshihiro Sakata , Hideaki Oikawa , Keizaburo Yamaguchi , Tadashi Asanuma , Akihiro Yamaguchi , Mitsunori Matsuo
发明人： Shoji Tamai , Yuichi Okawa , Wataru Yamashita , Yoshihiro Sakata , Hideaki Oikawa , Keizaburo Yamaguchi , Tadashi Asanuma , Akihiro Yamaguchi , Mitsunori Matsuo
IPC分类号： C08L71/10 , C08G73/10 , C08L71/08 , C08L79/04 , C08L79/08
CPC分类号： C08L79/08 , C08L79/04
摘要： A polyimide resin composition substantially comprising 1 99.9.about.50 parts by weight of polyimide having recurring structural units of the formula ##STR1## and 2 0.1.about.50 parts by weight of a polyimide which improved melt flowability and is prepared by using 1,3-bis(3-aminophenoxy)benzene or 6,6'-bis(3-aminophenoxy)-3,3,3',3'-tetramethyl-1,1'-spirobiindane as essential diamine component, or polyether pyridine having recurring structural units of the formula: ##STR2## is disclosed. Further, a polyimide based resin composition comprising the polyimide resin composition or a polyimide copolymer obtained by using the above diamines and a fibrous reinforcement is disclosed. These compositions have remarkably good processability, excellent heat stability and repeated fatigue characteristics.
摘要翻译：一种聚酰亚胺树脂组合物，其基本上包含+ E，crc / 1 / 99.9差异50重量份具有式（1）的重复结构单元的聚酰亚胺和+ E，crc / 2 / 0.1差异50重量份的通过使用1,3-双（3-氨基苯氧基）苯或6,6'-双（3-氨基苯氧基）-3,3,3'，3'-四甲基-1,1' - 螺环丁烷作为必需二胺组分，或具有下式重复结构单元的聚醚吡啶：。此外，公开了一种聚酰亚胺系树脂组合物，其包含使用上述二胺和纤维增强剂而得到的聚酰亚胺树脂组合物或聚酰亚胺共聚物。这些组合物具有非常好的加工性能，优异的热稳定性和重复的疲劳特性。

3. 发明授权

US5354839A Polyimide and preparation process of same 失效
标题翻译：聚酰亚胺及其制备方法相同
公开(公告)号：US5354839A
公开(公告)日：1994-10-11
申请号：US40608
申请日：1993-03-31
申请人： Wataru Yamashita , Yoshihiro Sakata , Toshiyuki Kataoka , Yuichi Okawa , Hideaki Oikawa , Tadashi Asanuma , Mitsunori Matsuo , Tsutomu Ishida , Keizaburo Yamaguchi , Akihiro Yamaguchi
发明人： Wataru Yamashita , Yoshihiro Sakata , Toshiyuki Kataoka , Yuichi Okawa , Hideaki Oikawa , Tadashi Asanuma , Mitsunori Matsuo , Tsutomu Ishida , Keizaburo Yamaguchi , Akihiro Yamaguchi
IPC分类号： C07C217/90 , C08G73/10 , H05K1/00 , H05K1/03 , C08G69/26
CPC分类号： C08G73/105 , C07C217/90 , C08G73/10 , C08G73/1014 , C08G73/1017 , H05K1/0346 , H05K3/4676
摘要： A polyimide comprising a requisite structural unit having one or more recurring structural units of the formula: ##STR1## such as the structural units of the formula ##STR2## The polyimide can have an extremely low dielectric constant and is colorless, transparent and excellent in processability and heat resistance, and also provides an aromatic diamine which is useful as a raw material monomer of the polyimide or a raw material of other various engineering plastics.
摘要翻译：一种聚酰亚胺，其包含具有一个或多个下式的重复结构单元的必需结构单元：例如下式的结构单元：该聚酰亚胺可以具有极低的介电常数，为无色透明且加工性优异和耐热性，并且还提供可用作聚酰亚胺的原料单体或其它各种工程塑料的原料的芳族二胺。

4. 发明授权

US5480965A Readily soluble, amorphous polyimide, and preparation process of same 失效
标题翻译：易溶，无定形聚酰亚胺及其制备方法相同
公开(公告)号：US5480965A
公开(公告)日：1996-01-02
申请号：US280551
申请日：1994-07-26
申请人： Wataru Yamashita , Yuichi Okawa , Hideaki Oikawa , Tadashi Asanuma , Yuko Ishihara , Mitsunori Matsuo , Keizaburo Yamaguchi , Akihiro Yamaguchi , Shoji Tamai
发明人： Wataru Yamashita , Yuichi Okawa , Hideaki Oikawa , Tadashi Asanuma , Yuko Ishihara , Mitsunori Matsuo , Keizaburo Yamaguchi , Akihiro Yamaguchi , Shoji Tamai
IPC分类号： C07C201/12 , C07C205/45 , C07C221/00 , C07C225/22 , C08G73/10 , C08G73/12 , C08J5/18 , C08L79/08 , C08G69/26 , C08L77/00
CPC分类号： C08G73/10 , C08G73/1007 , C08G73/1014 , C08G73/1017 , C08G73/1067 , Y10T428/31504 , Y10T428/31721
摘要： This invention relates to a novel thermoplastic and amorphous polyimide which is readily soluble in organic solvent, a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the thermoplastic polyimide and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition, a polyimide-based composite obtained by molding the above soluble and thermoplastic polyimide in combination with a fibrous reinforcement, and a fibrous reinforcement having a surface modified with the above polyimide.The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein m and n are individually an integer of 0 or 1, and R is ##STR2## The polyimide of the invention is essentially amorphous, excellent in melt flow stability in the decreased temperature as compared with conventionally known polyimide and has greatly improved processability.The polyimide of the invention obtained by using a novel aromatic diamino compound as a monomer can control various properties such as melt flow ability and solubility in solvents by side chains and not by principal chain of polyimide. Thus, excellent melt flow property and solubility in solvents can be obtained while maintaining high heat resistance and adhesive property which are derived from benzophenone structure of the diamino compound of the the invention.
摘要翻译：本发明涉及易溶于有机溶剂的新型热塑性和无定形聚酰亚胺，用于聚酰亚胺的新型芳族二氨基化合物及其制备方法，包含热塑性聚酰亚胺和纤维增强剂的聚酰亚胺基树脂组合物，用于制备树脂组合物的树脂组合物的注塑制品，通过将上述可溶性和热塑性聚酰亚胺与纤维增强剂组合成型而获得的聚酰亚胺类复合材料和具有用上述聚酰亚胺改性的表面的纤维增强剂。聚酰亚胺包含必需的结构单元，其具有一个或多个下式的重复结构单元：其中m和n分别为0或1的整数，R为本发明的聚酰亚胺基本上为与常规已知的聚酰亚胺相比，在降低的温度下的熔体流动稳定性优异并且具有极大的改进的加工性。通过使用新颖的芳族二氨基化合物作为单体获得的本发明的聚酰亚胺可以通过侧链而不是聚酰亚胺的主链来控制各种性能如熔体流动性和在溶剂中的溶解度。因此，在保持由本发明的二氨基化合物的二苯甲酮结构得到的高耐热性和粘合性的同时，可以获得优异的熔体流动性和溶剂中的溶解性。

5. 发明授权

US5286840A Thermally stable polyimide and preparation process of polyimide 失效
标题翻译：聚酰亚胺热稳定剂及其制备方法
公开(公告)号：US5286840A
公开(公告)日：1994-02-15
申请号：US795750
申请日：1991-11-21
申请人： Hideaki Oikawa , Nobuhito Koga , Akihiro Yamaguchi , Shoji Tamai
发明人： Hideaki Oikawa , Nobuhito Koga , Akihiro Yamaguchi , Shoji Tamai
IPC分类号： C08G73/10 , C08G69/26
CPC分类号： C08G73/1071 , C08G73/1014
摘要： A thermally stable polyimide which is blocked at the polymer terminal with a dicarboxylic acid anhydride represented by the formula (III): ##STR1## wherein Z is a divalent radical selected from the group consisting of a monoaromatic radical which is substantially unsubstituted or substituted with a radical having no reactivity with amine or dicarboxylic acid anhydride and has from 6 to 15 carbon atoms, a condensed polyaromatic radical or a noncondensed aromatic radical connected each other with a direct bond or a bridge member, and has a fundamental skeleton represented by recurring structural units of the formula (IV): ##STR2## and a process of preparing the polyimide.
摘要翻译：在聚合物末端用由式（III）表示的二羧酸酐封闭的热稳定聚酰亚胺：（*化学结构*）（III）其中Z是选自以下的二价基团：单芳族基团，其为基本上未被取代或被不与胺或二羧酸酐反应的基团或具有6至15个碳原子的基团取代，稠合的多芳族基团或非缩合的芳族基团彼此直接连接或桥接，并具有基本的由式（IV）的重复结构单元表示的骨架：（*化学结构*）（IV）和制备聚酰亚胺的方法。

6. 发明授权

US4908409A Polyimide 失效
标题翻译：聚酰亚胺
公开(公告)号：US4908409A
公开(公告)日：1990-03-13
申请号：US119042
申请日：1987-11-10
申请人： Hideaki Oikawa , Katsuaki Liyama , Nobuhito Koga , Saburo Kawashima , Shoji Tamai , Masahiro Ohta , Akihiro Yamaguchi
发明人： Hideaki Oikawa , Katsuaki Liyama , Nobuhito Koga , Saburo Kawashima , Shoji Tamai , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C08G73/10
CPC分类号： C08G73/1071 , C08G73/1046
摘要： Polyimide of this invention is almost colorless and has remarkably high light transmittance as well as excellent processability and adhesive properties at high temperatures in addition to its substantial high-temperature stability.The polyimide is a novel polyimide capable of being used for space and aeronautical materials, electric and electronic members, automotive parts, and furthermore for high-temperature adhesives.The polyimide has recurring units of the following formula ##STR1## wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, sulfonyl radical and thio radical, and each nitrogen atom of imide ring is located simultaneously at meta- or para-position to ether linkage.The polyimide of this invention is prepared by reacting 4,4'-(p-phenylenedioxy)diphthalic dianhydride with an ether diamine having the following general formula (V): ##STR2## and successively imidizing the resultant polyamic acid. Examples of the ether diamine used for preparing the polyamide include,2,2-bis[4-(3-aminophenoxy)phenyl]propane,2,2-bis[4-(4-aminophenoxy)phenyl]propane,2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane,2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane,4,4'-bis(3-aminophenoxy)biphenyl,4,4'-bis(4-aminophenoxy)biphenyl,bis[4-(3-aminophenoxy)phenyl] ketone,bis[4-(4-aminophenoxy)phenyl] ketone,bis[4-(3-aminophenoxy)phenyl] sulfide,bis[4-(4-aminophenoxy)phenyl] sulfide,bis[4-(3-aminophenoxy)phenyl] sulfone andbis[4-(4-aminophenoxy)phenyl] sulfone.
摘要翻译：本发明的聚酰亚胺除了具有显着的高温稳定性外，几乎是无色的，并且具有非常高的透光率以及优异的加工性和高温下的粘合性。该聚酰亚胺是一种能用于空间和航空材料，电气和电子部件，汽车部件以及高温粘合剂的新型聚酰亚胺。聚酰亚胺具有以下结构式的重复单元：其中X是选自键，具有1至10个碳的二价烃基，六氟化异丙叉基，羰基，磺酰基自由基和硫基，并且酰亚胺环的每个氮原子同时位于醚键或对位至醚键。本发明的聚酰亚胺通过使4,4' - （对亚苯基二氧基）二邻苯二甲酸二酐与具有以下通式（V）的醚二胺反应：（V）并依次酰亚胺化得到的聚酰胺酸制备。用于制备聚酰胺的醚二胺的实例包括2,2-双[4-（3-氨基苯氧基）苯基]丙烷，2,2-双[4-（4-氨基苯氧基）苯基]丙烷，双[4-（3-氨基苯氧基）苯基] -1,1,1,3,3,3-六氟丙烷，2,2-双[4-（4-氨基苯氧基）苯基] -1,1,1,3， 3,3'-六氟丙烷，4,4'-双（3-氨基苯氧基）联苯，4,4'-双（4-氨基苯氧基）联苯，双[4-（3-氨基苯氧基）苯基]酮，双[4-（双[4-（3-氨基苯氧基）苯基]硫醚，双[4-（4-氨基苯氧基）苯基]硫醚，双[4-（3-氨基苯氧基）苯基]砜和双[4 - （4-氨基苯氧基）苯基]砜。

7. 发明授权

US4960852A Thermosetting resin compostion from bis, maleimide and bis (meta-amino phenoxy) compound 失效
标题翻译：来自双，马来酰亚胺和双（间 - 氨基苯氧基）化合物的热固性树脂组合物
公开(公告)号：US4960852A
公开(公告)日：1990-10-02
申请号：US304558
申请日：1989-02-01
申请人： Norimasa Yamaya , Nobuhito Koga , Masahiro Ohta , Akihiro Yamaguchi
发明人： Norimasa Yamaya , Nobuhito Koga , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C08G73/12
CPC分类号： C08G73/121
摘要： Thermosetting resin compositions are provided which comprise aromatic bismaleimide derivatives, for example, 2,2-bis[4(3-maleimidephenoxy)phenyl]propane and diamine derivatives, for example, 4,4'-bis(3-aminophenoxy)biphenyl. Prepolymers are also prepared by conducting heat-treatment of said compositions. The compositions of this invention are used for thermoforming such as compression molding etc. as well as raw materials of adhesives and coatings. The compositions provide molded articles which are excellent, for example, impact strength, flexibility and high-temperature stability.

8. 发明授权

US4831102A Thermosetting resin composition from poly-arylene-oxy-bis-maleimide and polyarylene diamine 失效
标题翻译：聚亚芳基 - 氧 - 双 - 马来酰亚胺和聚亚芳基二胺的热固性树脂组合物
公开(公告)号：US4831102A
公开(公告)日：1989-05-16
申请号：US71161
申请日：1987-07-08
申请人： Norimasa Yamaya , Nobuhito Koga , Masahiro Ohta , Akihiro Yamaguchi
发明人： Norimasa Yamaya , Nobuhito Koga , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C08G73/12
CPC分类号： C08G73/121
摘要： Thermosetting resin compositions are provided which comprise aromatic bismaleimide derivatives, for example, 2,2-bis[4(3-maleimidephenoxy)phenyl]propane and diamine derivatives, for example, 4,4'-bis(3-aminophenoxy)biphenyl. Prepolymers are also prepared by conducting heat-treatment of said compositions. The compositions of this invention are used for thermoforming such as compression molding etc. as well as raw materials of adhesives and coatings. The compositions provide molded articles which are excellent, for example, in impact strength, flexibility and high-temperature stability.

9. 发明授权

US5514748A Polyimide based resin composition comprising cured phenolic resins and liquid crystal polymers 失效
标题翻译：聚酰亚胺基树脂组合物，其包含固化的酚醛树脂和液晶聚合物
公开(公告)号：US5514748A
公开(公告)日：1996-05-07
申请号：US474380
申请日：1995-06-07
申请人： Toshihiko Isutsumi , Toshiyuki Nakakura , Shuichi Morikawa , Katsunori Shimamura , Toshiaki Takahashi , Atsushi Morita , Nobuhito Koga , Akihiro Yamaguchi , Masahiro Ohta , Yoshihisa Gotoh , Masaki Amano , Hiroyasu Oochi , Kayako Ito
发明人： Toshihiko Isutsumi , Toshiyuki Nakakura , Shuichi Morikawa , Katsunori Shimamura , Toshiaki Takahashi , Atsushi Morita , Nobuhito Koga , Akihiro Yamaguchi , Masahiro Ohta , Yoshihisa Gotoh , Masaki Amano , Hiroyasu Oochi , Kayako Ito
IPC分类号： C08L67/00 , C08L71/00 , C08L79/08 , C08L67/02 , C08L61/10
CPC分类号： C08L67/00 , C08L71/00 , C08L79/08 , Y10S525/928
摘要： A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.
摘要翻译：一种模塑树脂组合物，其包含99.9至50重量％的由下式表示的聚酰亚胺：（I）和0.1-50重量％的聚醚酮树脂和/或聚酯树脂，更具体地包括能够在420℃以下的温度下形成各向异性热熔融相，以及包含所述树脂和酚醛树脂，氟树脂，石墨，碳纤维，芳香族聚酰胺纤维，钛酸钾等其他添加剂的聚酰亚胺系成型树脂组合物纤维和结晶促进剂，耐热性，耐化学性，机械强度和加工性优异。

10. 发明授权

US5312866A Polyimide based resin composition 失效
标题翻译：聚酰亚胺基树脂组合物
公开(公告)号：US5312866A
公开(公告)日：1994-05-17
申请号：US883267
申请日：1992-05-14
申请人： Toshihiko Tsutsumi , Toshiyuki Nakakura , Shuichi Morikawa , Katsunori Shimamura , Toshiaki Takahashi , Atsushi Morita , Nobuhito Koga , Akihiro Yamaguchi , Masahiro Ohta , Yoshihisa Gotoh , Masaki Amano , Hiroyasu Oochi , Kayako Ito
发明人： Toshihiko Tsutsumi , Toshiyuki Nakakura , Shuichi Morikawa , Katsunori Shimamura , Toshiaki Takahashi , Atsushi Morita , Nobuhito Koga , Akihiro Yamaguchi , Masahiro Ohta , Yoshihisa Gotoh , Masaki Amano , Hiroyasu Oochi , Kayako Ito
IPC分类号： C08L67/00 , C08L71/00 , C08L79/08 , C08L67/02
CPC分类号： C08L67/00 , C08L71/00 , C08L79/08 , Y10S525/928
摘要： A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.
摘要翻译：一种模塑树脂组合物，其包含99.9至50重量％的由下式表示的聚酰亚胺：（I）和0.1-50重量％的聚醚酮树脂和/或聚酯树脂，更具体地包括能够在420℃以下的温度下形成各向异性热熔融相，以及包含所述树脂和酚醛树脂，氟树脂，石墨，碳纤维，芳香族聚酰胺纤维，钛酸钾等其他添加剂的聚酰亚胺系成型树脂组合物纤维和结晶促进剂，耐热性，耐化学性，机械强度和加工性优异。

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