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1. 发明授权

US4908409A Polyimide 失效
标题翻译：聚酰亚胺
公开(公告)号：US4908409A
公开(公告)日：1990-03-13
申请号：US119042
申请日：1987-11-10
申请人： Hideaki Oikawa , Katsuaki Liyama , Nobuhito Koga , Saburo Kawashima , Shoji Tamai , Masahiro Ohta , Akihiro Yamaguchi
发明人： Hideaki Oikawa , Katsuaki Liyama , Nobuhito Koga , Saburo Kawashima , Shoji Tamai , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C08G73/10
CPC分类号： C08G73/1071 , C08G73/1046
摘要： Polyimide of this invention is almost colorless and has remarkably high light transmittance as well as excellent processability and adhesive properties at high temperatures in addition to its substantial high-temperature stability.The polyimide is a novel polyimide capable of being used for space and aeronautical materials, electric and electronic members, automotive parts, and furthermore for high-temperature adhesives.The polyimide has recurring units of the following formula ##STR1## wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, sulfonyl radical and thio radical, and each nitrogen atom of imide ring is located simultaneously at meta- or para-position to ether linkage.The polyimide of this invention is prepared by reacting 4,4'-(p-phenylenedioxy)diphthalic dianhydride with an ether diamine having the following general formula (V): ##STR2## and successively imidizing the resultant polyamic acid. Examples of the ether diamine used for preparing the polyamide include,2,2-bis[4-(3-aminophenoxy)phenyl]propane,2,2-bis[4-(4-aminophenoxy)phenyl]propane,2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane,2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane,4,4'-bis(3-aminophenoxy)biphenyl,4,4'-bis(4-aminophenoxy)biphenyl,bis[4-(3-aminophenoxy)phenyl] ketone,bis[4-(4-aminophenoxy)phenyl] ketone,bis[4-(3-aminophenoxy)phenyl] sulfide,bis[4-(4-aminophenoxy)phenyl] sulfide,bis[4-(3-aminophenoxy)phenyl] sulfone andbis[4-(4-aminophenoxy)phenyl] sulfone.
摘要翻译：本发明的聚酰亚胺除了具有显着的高温稳定性外，几乎是无色的，并且具有非常高的透光率以及优异的加工性和高温下的粘合性。该聚酰亚胺是一种能用于空间和航空材料，电气和电子部件，汽车部件以及高温粘合剂的新型聚酰亚胺。聚酰亚胺具有以下结构式的重复单元：其中X是选自键，具有1至10个碳的二价烃基，六氟化异丙叉基，羰基，磺酰基自由基和硫基，并且酰亚胺环的每个氮原子同时位于醚键或对位至醚键。本发明的聚酰亚胺通过使4,4' - （对亚苯基二氧基）二邻苯二甲酸二酐与具有以下通式（V）的醚二胺反应：（V）并依次酰亚胺化得到的聚酰胺酸制备。用于制备聚酰胺的醚二胺的实例包括2,2-双[4-（3-氨基苯氧基）苯基]丙烷，2,2-双[4-（4-氨基苯氧基）苯基]丙烷，双[4-（3-氨基苯氧基）苯基] -1,1,1,3,3,3-六氟丙烷，2,2-双[4-（4-氨基苯氧基）苯基] -1,1,1,3， 3,3'-六氟丙烷，4,4'-双（3-氨基苯氧基）联苯，4,4'-双（4-氨基苯氧基）联苯，双[4-（3-氨基苯氧基）苯基]酮，双[4-（双[4-（3-氨基苯氧基）苯基]硫醚，双[4-（4-氨基苯氧基）苯基]硫醚，双[4-（3-氨基苯氧基）苯基]砜和双[4 - （4-氨基苯氧基）苯基]砜。

2. 发明授权

US5286840A Thermally stable polyimide and preparation process of polyimide 失效
标题翻译：聚酰亚胺热稳定剂及其制备方法
公开(公告)号：US5286840A
公开(公告)日：1994-02-15
申请号：US795750
申请日：1991-11-21
申请人： Hideaki Oikawa , Nobuhito Koga , Akihiro Yamaguchi , Shoji Tamai
发明人： Hideaki Oikawa , Nobuhito Koga , Akihiro Yamaguchi , Shoji Tamai
IPC分类号： C08G73/10 , C08G69/26
CPC分类号： C08G73/1071 , C08G73/1014
摘要： A thermally stable polyimide which is blocked at the polymer terminal with a dicarboxylic acid anhydride represented by the formula (III): ##STR1## wherein Z is a divalent radical selected from the group consisting of a monoaromatic radical which is substantially unsubstituted or substituted with a radical having no reactivity with amine or dicarboxylic acid anhydride and has from 6 to 15 carbon atoms, a condensed polyaromatic radical or a noncondensed aromatic radical connected each other with a direct bond or a bridge member, and has a fundamental skeleton represented by recurring structural units of the formula (IV): ##STR2## and a process of preparing the polyimide.
摘要翻译：在聚合物末端用由式（III）表示的二羧酸酐封闭的热稳定聚酰亚胺：（*化学结构*）（III）其中Z是选自以下的二价基团：单芳族基团，其为基本上未被取代或被不与胺或二羧酸酐反应的基团或具有6至15个碳原子的基团取代，稠合的多芳族基团或非缩合的芳族基团彼此直接连接或桥接，并具有基本的由式（IV）的重复结构单元表示的骨架：（*化学结构*）（IV）和制备聚酰亚胺的方法。

3. 发明授权

US5708128A Linear polyamic acid, linear polyimide and thermoset polyimide 失效
标题翻译：线性聚酰胺酸，线性聚酰亚胺和热固性聚酰亚胺
公开(公告)号：US5708128A
公开(公告)日：1998-01-13
申请号：US668836
申请日：1996-06-24
申请人： Hideaki Oikawa , Shoji Tamai , Masahiro Ohta , Akihiro Yamaguchi
发明人： Hideaki Oikawa , Shoji Tamai , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C08G69/26
CPC分类号： C08G73/101 , C08G73/1071 , Y10T428/31504
摘要： Novel thermoset polyimide and composite materials comprising the thermoset polyimides and a fibrous reinforcement are prepared according to this invention. The thermoset polyimides are obtained by heat-treating a linear polyamic acid or a linear polyimide prepared by using 4,4'-bis(3-aminophenoxy)biphenyl and pyromellitic dianhydride as essential monomers or by adding 4,4'-diaminodiphenyl ether or 3,3',4,4'-biphenyltetracarboxylic dianhydride to the essential monomers and by end-capping the molecular chain end with an aromatic dicarboxylic anhydride having a carbon-carbon triple bond. The thermoset polyimides have essential excellent properties of thermoplastic polyimide and additionally has enhanced heat resistance and improved mechanical properties. The thermoset polyimide can be used to provide various kinds of composite materials for aircraft matrices, electric and electronic appliances and others.
摘要翻译：根据本发明制备了新型热固性聚酰亚胺和包含热固性聚酰亚胺和纤维增强材料的复合材料。热固性聚酰亚胺通过热处理线性聚酰胺酸或通过使用4,4'-双（3-氨基苯氧基）联苯和均苯四酸二酐作为必需单体制备的线性聚酰亚胺或通过加入4,4'-二氨基二苯醚或3 ，3'，4,4'-联苯四羧酸二酐加入到基本单体中，并通过用具有碳 - 碳三键的芳族二羧酸酐封端分子链末端。热固性聚酰亚胺具有热塑性聚酰亚胺的基本优异性能，并且还具有增强的耐热性和改善的机械性能。热固性聚酰亚胺可用于为飞机基体，电气和电子设备等提供各种复合材料。

4. 发明授权

US5288843A Polyimides, process for the preparation thereof and polyimide resin compositions 失效
标题翻译：聚酰亚胺，其制备方法和聚酰亚胺树脂组合物
公开(公告)号：US5288843A
公开(公告)日：1994-02-22
申请号：US608727
申请日：1990-11-05
申请人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi , Kouji Ohkoshi , Masao Yoshikawa
发明人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi , Kouji Ohkoshi , Masao Yoshikawa
IPC分类号： C08G73/10 , C08L79/08 , C08G69/26 , C08G8/02
CPC分类号： C08G73/1042 , C08G73/105 , C08G73/1071 , C08L79/08
摘要： In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.
摘要翻译：一方面，本发明涉及具有优异耐热性的聚酰亚胺及其制备方法，包括在不同的二胺化合物和任选地存在下进行4,4'-双（3-氨基苯氧基）联苯与均苯四酸二酐的缩合与不同的四羧酸二酐。在第二方面，本发明涉及一种主要由芳族聚醚酰亚胺和所定义的聚酰亚胺组成的耐热树脂组合物。在第三方面，本发明涉及包含在限定的聚酰亚胺和单独的高温工程聚合物上的聚酰亚胺树脂组合物。在第四方面，本发明涉及由限定的聚酰亚胺和芳族聚酰胺酰亚胺组成的树脂组合物。

5. 发明授权

US5210174A Preparation process of polyimide 失效
标题翻译：聚酰亚胺的制备方法
公开(公告)号：US5210174A
公开(公告)日：1993-05-11
申请号：US612461
申请日：1990-11-14
申请人： Shoji Tamai , Hideaki Oikawa , Masahiro Ohta , Akihiro Yamaguchi
发明人： Shoji Tamai , Hideaki Oikawa , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C08G73/10
CPC分类号： C08G73/1067 , C08G73/1007 , C08G73/1028 , C08G73/1071
摘要： In a process for the preparation of polyimide by reacting a diamine compound with tetracarboxylic dianhydride in a phenol based solvent, an improved process for reacting the diamine compound with tetracarboxylic dianhydride in a solution by forming separate solutions of the tetracarboxylic dianhydride and the diamine compound and mixing the solutions and/or by dissolving tetracarboxylic dianhydride in the phenol-based solvent containing an organic base.

6. 发明授权

US5157085A Polyimide resin composition 失效
标题翻译：聚酰亚胺树脂组合物
公开(公告)号：US5157085A
公开(公告)日：1992-10-20
申请号：US321107
申请日：1989-03-09
申请人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： C08L79/08
CPC分类号： C08L79/08 , Y10S525/906 , Y10S525/928
摘要： This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength.The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of polyphenylene sulfide and/or aromatic polysulfone and/or aromatic polyetherimide high-temperature engineering polymer. The polyimide consists essentially of recurring units of the following formula: ##STR1##

7. 发明授权

US5041520A Process for preparing polyimide having excellent high temperature stability 失效
标题翻译：制备具有优异的高温稳定性的聚酰亚胺的方法
公开(公告)号：US5041520A
公开(公告)日：1991-08-20
申请号：US371072
申请日：1989-06-26
申请人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C08G73/14
CPC分类号： C08G73/14 , C08G73/1003 , C08G73/1014 , C08G73/1042 , C08G73/1078
摘要： Disclosed is a process for preparing a polyimide by reacting certain reactants. The reactants include an aromatic diamine which is 3,3'-diaminobenzophenone and/or bis(3-aminophenyl)sulfone, a tetrocarboxylic dianhydride and a dicarboxylic anhydride. A thermally stable polyimide can be obtained which displays excellent processability.

8. 发明授权

US4987197A Polyimide/polyamideimide resin composition 失效
标题翻译：聚酰亚胺/聚酰胺酰亚胺树脂组合物
公开(公告)号：US4987197A
公开(公告)日：1991-01-22
申请号：US341810
申请日：1989-04-24
申请人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： C08L79/08
CPC分类号： C08L79/08
摘要： This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength.The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of aromatic polyamideimide. The polyimide consists essentially of recurring units of the following formula: ##STR1## wherein X is ##STR2## and R is, for example, ##STR3##

9. 发明授权

US4937316A Process for preparing polyimides 失效
标题翻译：聚酰亚胺的制备方法
公开(公告)号：US4937316A
公开(公告)日：1990-06-26
申请号：US313732
申请日：1989-02-22
申请人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C08G73/14
CPC分类号： C08G73/1014 , C08G73/14
摘要： A process for preparing a polyimide by reaction of a diamine and a tetracarboxylic dianhydride to obtain a polyamide acid and subjecting the polyamide acid to conversion into a polyimide thermally or chemically. The reaction in the process is carried out in the presence of at least one dicarboxylic anhydride selected from the group consisting of aliphatic dicarboxylic anhydrides and aromatic dicarboxylic anhydrides, and the amount of the tetracarboxylic dianhydride is in the range of from 0.9 to 1.0 mole per mole of the diamine and the amount of the dicarboxylic anhydride is in the range of from 0.001 to 1.0 mole per mole of the diamine. The resultant polyimides exhibit good thermal stability at high temperatures and good forming processability even at low temperatures.

10. 发明授权

US5480965A Readily soluble, amorphous polyimide, and preparation process of same 失效
标题翻译：易溶，无定形聚酰亚胺及其制备方法相同
公开(公告)号：US5480965A
公开(公告)日：1996-01-02
申请号：US280551
申请日：1994-07-26
申请人： Wataru Yamashita , Yuichi Okawa , Hideaki Oikawa , Tadashi Asanuma , Yuko Ishihara , Mitsunori Matsuo , Keizaburo Yamaguchi , Akihiro Yamaguchi , Shoji Tamai
发明人： Wataru Yamashita , Yuichi Okawa , Hideaki Oikawa , Tadashi Asanuma , Yuko Ishihara , Mitsunori Matsuo , Keizaburo Yamaguchi , Akihiro Yamaguchi , Shoji Tamai
IPC分类号： C07C201/12 , C07C205/45 , C07C221/00 , C07C225/22 , C08G73/10 , C08G73/12 , C08J5/18 , C08L79/08 , C08G69/26 , C08L77/00
CPC分类号： C08G73/10 , C08G73/1007 , C08G73/1014 , C08G73/1017 , C08G73/1067 , Y10T428/31504 , Y10T428/31721
摘要： This invention relates to a novel thermoplastic and amorphous polyimide which is readily soluble in organic solvent, a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the thermoplastic polyimide and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition, a polyimide-based composite obtained by molding the above soluble and thermoplastic polyimide in combination with a fibrous reinforcement, and a fibrous reinforcement having a surface modified with the above polyimide.The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein m and n are individually an integer of 0 or 1, and R is ##STR2## The polyimide of the invention is essentially amorphous, excellent in melt flow stability in the decreased temperature as compared with conventionally known polyimide and has greatly improved processability.The polyimide of the invention obtained by using a novel aromatic diamino compound as a monomer can control various properties such as melt flow ability and solubility in solvents by side chains and not by principal chain of polyimide. Thus, excellent melt flow property and solubility in solvents can be obtained while maintaining high heat resistance and adhesive property which are derived from benzophenone structure of the diamino compound of the the invention.
摘要翻译：本发明涉及易溶于有机溶剂的新型热塑性和无定形聚酰亚胺，用于聚酰亚胺的新型芳族二氨基化合物及其制备方法，包含热塑性聚酰亚胺和纤维增强剂的聚酰亚胺基树脂组合物，用于制备树脂组合物的树脂组合物的注塑制品，通过将上述可溶性和热塑性聚酰亚胺与纤维增强剂组合成型而获得的聚酰亚胺类复合材料和具有用上述聚酰亚胺改性的表面的纤维增强剂。聚酰亚胺包含必需的结构单元，其具有一个或多个下式的重复结构单元：其中m和n分别为0或1的整数，R为本发明的聚酰亚胺基本上为与常规已知的聚酰亚胺相比，在降低的温度下的熔体流动稳定性优异并且具有极大的改进的加工性。通过使用新颖的芳族二氨基化合物作为单体获得的本发明的聚酰亚胺可以通过侧链而不是聚酰亚胺的主链来控制各种性能如熔体流动性和在溶剂中的溶解度。因此，在保持由本发明的二氨基化合物的二苯甲酮结构得到的高耐热性和粘合性的同时，可以获得优异的熔体流动性和溶剂中的溶解性。

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