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1. 发明申请

US20090241996A1 SINGLE WAFER DRYER AND DRYING METHODS 审中-公开
标题翻译：单辊干燥机和干燥方法
公开(公告)号：US20090241996A1
公开(公告)日：2009-10-01
申请号：US12345642
申请日：2008-12-29
申请人： Younes Achkire , Alexander N. Lerner , Boris I. Govzman , Boris Fishkin , Michael N. Sugarman , Rashid A. Mavliev , Haoquan Fang , Shijian Li , Guy E. Shirazi , Jianshe Tang
发明人： Younes Achkire , Alexander N. Lerner , Boris I. Govzman , Boris Fishkin , Michael N. Sugarman , Rashid A. Mavliev , Haoquan Fang , Shijian Li , Guy E. Shirazi , Jianshe Tang
IPC分类号： B08B3/00
CPC分类号： H01L21/67034 , B08B3/10 , H01L21/67751 , H01L21/681 , H01L21/68764 , Y10S414/139
摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.
摘要翻译：在第一方面，提供一种适于处理晶片的模块。模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与卸货港（2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没式流体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

2. 发明申请

US20160086852A1 PROXIMITY CONTACT COVER RING FOR PLASMA DICING 审中-公开
标题翻译：用于等离子体定位的接头盖
公开(公告)号：US20160086852A1
公开(公告)日：2016-03-24
申请号：US14491856
申请日：2014-09-19
申请人： James M. Holden , Alexander N. Lerner , Ajay Kumar , Aparna Iyer , Alan Hiroshi Ouye
发明人： James M. Holden , Alexander N. Lerner , Ajay Kumar , Aparna Iyer , Alan Hiroshi Ouye
IPC分类号： H01L21/78 , H01J37/32 , H01L21/67 , H01L21/683 , H01L21/3065 , H01L21/308
摘要： Methods of and carriers for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a cover ring for protecting a carrier and substrate assembly during an etch process includes an inner opening having a diameter smaller than the diameter of a substrate of the carrier and substrate assembly. An outer frame surrounds the inner opening. The outer frame has a bevel for accommodating an outermost portion of the substrate of the carrier and substrate assembly.
摘要翻译：描述了半导体晶片切割的方法和载体，每个晶片具有多个集成电路。在一个示例中，用于在蚀刻工艺期间保护载体和基底组件的盖环包括直径小于载体和基底组件的基底的直径的内部开口。外框围绕内开口。外框架具有用于容纳载体和基底组件的基底的最外部分的斜面。

3. 发明授权

US08314371B2 Rapid thermal processing chamber with micro-positioning system 有权
标题翻译：具有微型定位系统的快速热处理室
公开(公告)号：US08314371B2
公开(公告)日：2012-11-20
申请号：US12611958
申请日：2009-11-04
申请人： Khurshed Sorabji , Joseph M. Ranish , Wolfgang Aderhold , Aaron M. Hunter , Blake R. Koelmel , Alexander N. Lerner , Nir Merry
发明人： Khurshed Sorabji , Joseph M. Ranish , Wolfgang Aderhold , Aaron M. Hunter , Blake R. Koelmel , Alexander N. Lerner , Nir Merry
IPC分类号： H01B1/00
CPC分类号： H01L21/67259 , C23C16/46 , H01L21/324 , H01L21/67115 , H01L21/68 , H01L21/681 , H01L21/6835 , H01L21/68742
摘要： Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.
摘要翻译：描述了包括将衬底轴向对准衬底支撑件或经验确定的位置的用于快速热处理平面衬底的方法和装置。所述方法和装置包括确定衬底和衬底支撑件的相对取向的传感器系统。

4. 发明申请

US20120070136A1 Transparent Reflector Plate For Rapid Thermal Processing Chamber 有权
标题翻译：用于快速热处理室的透明反射板
公开(公告)号：US20120070136A1
公开(公告)日：2012-03-22
申请号：US13184895
申请日：2011-07-18
申请人： Blake R. Koelmel , Aaron M. Hunter , Alexander N. Lerner
发明人： Blake R. Koelmel , Aaron M. Hunter , Alexander N. Lerner
IPC分类号： F27D11/12
CPC分类号： H01L21/67115 , F27B5/06 , F27B5/14 , F27B5/18 , F27D11/02 , F27D2019/0003 , H01L21/67011 , H01L21/67248
摘要： The present invention generally relates to methods and apparatus for processing substrates. Embodiments of the invention include apparatuses for processing a substrate comprising a ceramic reflector plate, which may be optically transparent. The reflector plate may include a reflective coating and be part of a reflector plate assembly in which the reflector plate is assembled to a baseplate.
摘要翻译：本发明一般涉及用于处理衬底的方法和装置。本发明的实施例包括用于处理包括可以是光学透明的陶瓷反射板的基板的装置。反射板可以包括反射涂层，并且是反射板组件的一部分，其中反射板组装到基板上。

5. 发明申请

US20080141556A1 RAPID CONDUCTIVE COOLING USING A SECONDARY PROCESS PLANE 有权
公开(公告)号：US20080141556A1
公开(公告)日：2008-06-19
申请号：US11925600
申请日：2007-10-26
申请人： KHURSHED SORABJI , Alexander N. Lerner
发明人： KHURSHED SORABJI , Alexander N. Lerner
IPC分类号： H01L21/02
CPC分类号： H01L21/67098 , C30B31/14 , H01L21/30 , H01L21/67109 , H01L21/67115 , H01L22/10 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for thermally processing a substrate is described. The apparatus includes a substrate support configured to move linearly and/or rotationally by a magnetic drive. The substrate support is also configured to receive a radiant heat source to provide heating region in a portion of the chamber. An active cooling region comprising a cooling plate is disposed opposite the heating region. The substrate may move between the two regions to facilitate rapidly controlled heating and cooling of the substrate.

6. 发明授权

US08490660B2 Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber 有权
标题翻译：用于在处理室中支撑，定位和旋转衬底的装置和方法
公开(公告)号：US08490660B2
公开(公告)日：2013-07-23
申请号：US13294709
申请日：2011-11-11
申请人： Blake Koelmel , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
发明人： Blake Koelmel , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
IPC分类号： B65B31/04
CPC分类号： H01L21/6838 , H01L21/67115
摘要： An apparatus and method for supporting, positioning and rotating a substrate are provided. In one embodiment, a support assembly for supporting a substrate includes an upper base plate and a lower base plate. The substrate is floated on a thin layer of air over the upper base plate. A positioning assembly includes a plurality of air bearing edge rollers or air flow pockets used to position the substrate in a desired orientation inside above the upper base plate. A plurality of slanted apertures or air flow pockets are configured in the upper base plate for flowing gas therethrough to rotate the substrate to ensure uniform heating during processing.
摘要翻译：提供了用于支撑，定位和旋转衬底的装置和方法。在一个实施例中，用于支撑衬底的支撑组件包括上基板和下基板。衬底浮在上层底板上的薄层空气上。定位组件包括多个空气轴承边缘辊或气流袋，其用于将衬底定位在上部基板的上方所期望的取向。多个倾斜的孔或气流袋被配置在上基板中，用于使气体流过其中以旋转基板以确保在加工期间的均匀加热。

7. 发明授权

US08309475B2 Apparatus and method of aligning and positioning a cold substrate on a hot surface 有权
标题翻译：将冷基板对准和定位在热表面上的装置和方法
公开(公告)号：US08309475B2
公开(公告)日：2012-11-13
申请号：US13343523
申请日：2012-01-04
申请人： Blake Koelmel , Abhilash J. Mayur , Kai Ma , Alexander N. Lerner
发明人： Blake Koelmel , Abhilash J. Mayur , Kai Ma , Alexander N. Lerner
IPC分类号： H01L21/26
CPC分类号： H01L21/67248 , C23C16/4586 , H01L21/68742
摘要： Embodiments of the invention contemplate a method, apparatus and system that are used to support and position a substrate on a surface that is at a different temperature than the initial, or incoming, substrate temperature. Embodiments of the invention may also include a method of controlling the transfer of heat between a substrate and substrate support positioned in a processing chamber. The apparatus and methods described herein generally may also provide an inexpensive and simple way of accurately positioning a substrate on a substrate support that is positioned in a semiconductor processing chamber. Substrate processing chambers that can benefit from the various embodiments described herein include, but are not limited to RTP, CVD, PVD, ALD, plasma etching, and/or laser annealing chambers.
摘要翻译：本发明的实施方案考虑了一种方法，装置和系统，其用于将衬底支撑并定位在与初始或进入衬底温度不同的温度的表面上。本发明的实施例还可以包括控制位于处理室中的衬底和衬底支撑件之间的热传递的方法。本文所述的装置和方法通常还可以提供将衬底精确地定位在位于半导体处理室中的衬底支撑件上的便宜且简单的方法。可受益于本文描述的各种实施方案的衬底处理室包括但不限于RTP，CVD，PVD，ALD，等离子体蚀刻和/或激光退火室。

8. 发明申请

US20120270166A1 RAPID CONDUCTIVE COOLING USING A SECONDARY PROCESS PLANE 有权
标题翻译：使用二次过程平面快速导电冷却
公开(公告)号：US20120270166A1
公开(公告)日：2012-10-25
申请号：US13538124
申请日：2012-06-29
申请人： KHURSHED SORABJI , Alexander N. Lerner
发明人： KHURSHED SORABJI , Alexander N. Lerner
IPC分类号： F27D9/00
CPC分类号： H01L21/67098 , C30B31/14 , H01L21/30 , H01L21/67109 , H01L21/67115 , H01L22/10 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for thermally processing a substrate is provided. In one embodiment, a method for thermally treating a substrate is provided. The method includes transferring a substrate at a first temperature to a substrate support in a chamber, the chamber having a heating source and a cooling source disposed in opposing portions of the chamber, heating the substrate to a second temperature during a first time period while the substrate is disposed on the substrate support, heating the substrate to a third temperature during a second time period while the substrate is disposed on the substrate support, and cooling the substrate in the chamber to a fourth temperature that is substantially equal to the second temperature during the second time period.
摘要翻译：提供了一种用于热处理衬底的方法和装置。在一个实施例中，提供了一种用于热处理衬底的方法。该方法包括将第一温度的衬底转移到腔室中的衬底支撑件，该腔室具有设置在室的相对部分中的加热源和冷却源，在第一时间段内将衬底加热到第二温度，同时衬底设置在衬底支撑件上，在第二时间段期间将衬底加热至第三温度，同时将衬底设置在衬底支撑件上，并将腔室中的衬底冷却至基本等于第二温度的第四温度第二个时期。

9. 发明申请

US20120205878A1 HIGH TEMPERATURE VACUUM CHUCK ASSEMBLY 有权
标题翻译：高温真空泵组件
公开(公告)号：US20120205878A1
公开(公告)日：2012-08-16
申请号：US13456455
申请日：2012-04-26
申请人： Alexander N. Lerner , Blake Koelmel , Mehran Behdjat
发明人： Alexander N. Lerner , Blake Koelmel , Mehran Behdjat
IPC分类号： H01L21/683 , B23B31/30
CPC分类号： B25B11/005 , H01L21/67109 , H01L21/6838 , H01L21/6875 , H01L21/68785 , H01L21/68792 , Y10T279/11
摘要： A vacuum chuck and a process chamber equipped with the same are provided. The vacuum chuck assembly comprises a support body, a plurality of protrusions, a plurality of channels, at least one support member supporting the support body, at least one resilient member coupled with the support member, a hollow shaft supporting the support body, at least one electrical connector disposed through the hollow shaft, and an air-cooling apparatus. The support body has a support surface for holding a substrate (such as a wafer) thereon. The protrusions are formed on and project from the support surface for creating a gap between the substrate and the support surface. The channels are formed on the support surface for generating reduced pressure in the gap. The air-cooling apparatus is used for providing air cooling in the vicinity of the electrical connector.
摘要翻译：提供了一个真空吸盘和一个装有它的处理室。真空吸盘组件包括支撑体，多个突起，多个通道，支撑支撑体的至少一个支撑构件，与支撑构件联接的至少一个弹性构件，至少支撑支撑体的中空轴通过中空轴设置的一个电连接器和空气冷却装置。支撑体具有用于在其上保持基板（例如晶片）的支撑表面。突起形成在支撑表面上并从支撑表面突出，以在基板和支撑表面之间形成间隙。通道形成在支撑表面上，用于在间隙中产生减压。空气冷却装置用于在电连接器附近提供空气冷却。

10. 发明授权

US08097543B2 Apparatus and method of aligning and positioning a cold substrate on a hot surface 有权
公开(公告)号：US08097543B2
公开(公告)日：2012-01-17
申请号：US12839282
申请日：2010-07-19
申请人： Blake Koelmel , Abhilash J. Mayur , Kai Ma , Alexander N. Lerner
发明人： Blake Koelmel , Abhilash J. Mayur , Kai Ma , Alexander N. Lerner
IPC分类号： H01L21/26
CPC分类号： H01L21/67248 , C23C16/4586 , H01L21/68742
摘要： Embodiments of the invention contemplate a method, apparatus and system that are used to support and position a substrate on a surface that is at a different temperature than the initial, or incoming, substrate temperature. Embodiments of the invention may also include a method of controlling the transfer of heat between a substrate and substrate support positioned in a processing chamber. The apparatus and methods described herein generally may also provide an inexpensive and simple way of accurately positioning a substrate on a substrate support that is positioned in a semiconductor processing chamber. Substrate processing chambers that can benefit from the various embodiments described herein include, but are not limited to RTP, CVD, PVD, ALD, plasma etching, and/or laser annealing chambers.

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