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    • 5. 发明申请
    • Electrostatic Chuck with Multi-Zone Control
    • 带多区域控制的静电卡盘
    • US20130201596A1
    • 2013-08-08
    • US13364463
    • 2012-02-02
    • Chia-Ho ChenMing Huei LienShu-Fen WuChih-Tsung LeeYou-Hua Chou
    • Chia-Ho ChenMing Huei LienShu-Fen WuChih-Tsung LeeYou-Hua Chou
    • H01L21/683
    • H01L21/6833H01L21/6831H02N13/00
    • An electrostatic chuck for clamping a warped workpiece has a clamping surface comprising a dielectric layer. The dielectric layer has a field and one or more zones formed of differing dielectric materials. One or more electrodes are coupled to a power supply, and a controller controls a clamping voltage supplied to the one or more electrodes via the power supply. An electrostatic attraction force associated with each of the field and one or more zones of the dielectric layer of the electrostatic chuck is induced, wherein the electrostatic attraction force varies based on the dielectric material of each of the field and one or more zones. The electrostatic attraction force is greater in the one or more zones than in the field, therein attracting warped regions of the workpiece to the clamping surface and clamping the warped workpiece to the clamping surface across a surface of the warped workpiece.
    • 用于夹紧翘曲工件的静电卡盘具有包括电介质层的夹紧表面。 电介质层具有由不同介电材料形成的场和一个或多个区域。 一个或多个电极耦合到电源,并且控制器经由电源控制提供给一个或多个电极的钳位电压。 诱发与静电卡盘的电介质层的场和一个或多个区域中的每一个相关联的静电吸引力,其中静电吸引力基于场和一个或多个区域中的每一个的介电材料而变化。 在一个或多个区域中的静电吸引力比现场更大,其中将工件的翘曲区域吸引到夹紧表面,并将经弯曲的工件夹紧到穿过弯曲的工件的表面的夹紧表面。
    • 6. 发明授权
    • Electrostatic chuck with multi-zone control
    • 静电吸盘多区控制
    • US08902561B2
    • 2014-12-02
    • US13364463
    • 2012-02-02
    • Chia-Ho ChenMing Huei LienShu-Fen WuChih-Tsung LeeYou-Hua Chou
    • Chia-Ho ChenMing Huei LienShu-Fen WuChih-Tsung LeeYou-Hua Chou
    • H01L21/683
    • H01L21/6833H01L21/6831H02N13/00
    • An electrostatic chuck for clamping a warped workpiece has a clamping surface comprising a dielectric layer. The dielectric layer has a field and one or more zones formed of differing dielectric materials. One or more electrodes are coupled to a power supply, and a controller controls a clamping voltage supplied to the one or more electrodes via the power supply. An electrostatic attraction force associated with each of the field and one or more zones of the dielectric layer of the electrostatic chuck is induced, wherein the electrostatic attraction force varies based on the dielectric material of each of the field and one or more zones. The electrostatic attraction force is greater in the one or more zones than in the field, therein attracting warped regions of the workpiece to the clamping surface and clamping the warped workpiece to the clamping surface across a surface of the warped workpiece.
    • 用于夹紧翘曲工件的静电卡盘具有包括电介质层的夹紧表面。 电介质层具有由不同介电材料形成的场和一个或多个区域。 一个或多个电极耦合到电源,并且控制器经由电源控制提供给一个或多个电极的钳位电压。 诱发与静电卡盘的电介质层的场和一个或多个区域中的每一个相关联的静电吸引力,其中静电吸引力基于场和一个或多个区域中的每一个的介电材料而变化。 在一个或多个区域中的静电吸引力比现场更大,其中将工件的翘曲区域吸引到夹紧表面,并将经弯曲的工件夹紧到穿过弯曲的工件的表面的夹紧表面。
    • 7. 发明授权
    • UV curing system for semiconductors
    • 半导体UV固化系统
    • US09287154B2
    • 2016-03-15
    • US13486025
    • 2012-06-01
    • Ming Huei LienChia-Ho ChenShu-Fen WuChih-Tsung LeeYou-Hua Chou
    • Ming Huei LienChia-Ho ChenShu-Fen WuChih-Tsung LeeYou-Hua Chou
    • H01L21/677H01L21/68H01L21/67H01L21/3105
    • H01L21/6776H01L21/3105H01L21/67115
    • Embodiments of an ultraviolet (UV) curing system for treating a semiconductor substrate such as a wafer are disclosed. The curing system generally includes a processing chamber, a wafer support for holding a wafer in the chamber, a UV radiation source disposed above the chamber, and a UV transparent window interspersed between the radiation source and wafer support. In one embodiment, the wafer support is provided by a belt conveyor operable to transport wafers through the chamber during UV curing. In another embodiment, the UV radiation source is a movable lamp unit that travels across the top of the chamber for irradiating the wafer. In another embodiment, the UV transparent window includes a UV radiation modifier that reduces the intensity of UV radiation on portions of the wafer positioned below the modifier. Various embodiments enhance wafer curing uniformity by normalizing UV intensity levels on the wafer.
    • 公开了用于处理诸如晶片的半导体衬底的紫外(UV)固化系统的实施例。 固化系统通常包括处理室,用于在室中保持晶片的晶片支撑件,设置在室上方的UV辐射源,以及散布在辐射源和晶片支撑件之间的UV透明窗口。 在一个实施例中,晶片支撑件由带式输送机提供,其可操作以在UV固化期间将晶片传送通过室。 在另一个实施例中,UV辐射源是可移动的灯单元,其移动穿过室的顶部以照射晶片。 在另一个实施方案中,UV透明窗口包括UV辐射调节剂,其降低位于调节剂下方的晶片部分上的UV辐射强度。 各种实施例通过使晶片上的UV强度水平归一化来增强晶片固化均匀性。
    • 9. 发明申请
    • BACKGROUND IMAGE UPDATING METHOD AND TOUCH SCREEN
    • 背景图像更新方法和触摸屏
    • US20110234540A1
    • 2011-09-29
    • US12979287
    • 2010-12-27
    • Chiou-Tzung LIOUTing-Hsuan ChangRu-Yi TsaiTang-Wei HsuChia-Ho Chen
    • Chiou-Tzung LIOUTing-Hsuan ChangRu-Yi TsaiTang-Wei HsuChia-Ho Chen
    • G06F3/042
    • G06F3/0428
    • A background image updating method is adapted to a touch screen including a first and a second image modules. A first and a second images are captured by the first and the second image modules as a first and a second background images, respectively. (a) Whether an absolute value of a brightness difference between a third image captured by the first image module and the first background image is greater than a predetermine value is compared. (b) If the result of the step(a) is yes, whether an absolute value of a brightness difference between a fourth image captured by the second image module and the second background image is greater than another predetermine value is compared. (c) If the result of the step(b) is yes, a fifth and a sixth images are captured by the first and the second image modules as the first and the second background images, respectively.
    • 背景图像更新方法适用于包括第一和第二图像模块的触摸屏。 第一和第二图像分别被第一和第二图像模块捕获为第一和第二背景图像。 (a)比较由第一图像模块拍摄的第三图像与第一背景图像之间的亮度差的绝对值是否大于预定值。 (b)如果步骤(a)的结果为是,则比较由第二图像模块捕获的第四图像与第二背景图像之间的亮度差的绝对值是否大于另一个预定值。 (c)如果步骤(b)的结果为是,则分别由第一和第二图像模块捕获第五和第六图像作为第一和第二背景图像。
    • 10. 发明授权
    • Coherent multiple side electromagnets
    • 相干多面电磁铁
    • US08884526B2
    • 2014-11-11
    • US13354604
    • 2012-01-20
    • Bo-Hung LinMing-Chih TsaiChia-Ho ChenChung-En Kao
    • Bo-Hung LinMing-Chih TsaiChia-Ho ChenChung-En Kao
    • H01J7/24
    • H01J37/32669
    • In some embodiments, the present disclosure relates to a plasma processing system that generates a magnetic field having a maximum strength that is independent of workpiece size. The plasma processing system has a plurality of side electromagnets that have a size which is independent of the workpiece size. The side electromagnets are located around a perimeter of a processing chamber configured to house a semiconductor workpiece. When a current is provided to the side electromagnets, separate magnetic fields emanate from separate positions around the workpiece. The separate magnetic fields contribute to the formation of an overall magnetic field that controls the distribution of plasma within the processing chamber. Because the size of the plurality of separate side magnets is independent of the workpiece size, the plurality of side magnets can generate a magnetic field having a maximum field strength that is independent of workpiece size.
    • 在一些实施例中,本公开涉及一种产生具有与工件尺寸无关的最大强度的磁场的等离子体处理系统。 等离子体处理系统具有多个侧面电磁体,其尺寸独立于工件尺寸。 侧面电磁体位于被配置为容纳半导体工件的处理室的周边周围。 当向侧面电磁铁提供电流时,分离的磁场从工件周围的分离位置发出。 单独的磁场有助于形成控制处理室内等离子体分布的整个磁场。 由于多个分离侧磁体的尺寸与工件尺寸无关,所以多个侧磁体可产生具有独立于工件尺寸的最大磁场强度的磁场。