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1. 发明授权

US5218708A Videotext communication network with a receiving terminal that automatically preforms operations to network responsive to predetermined schedule 失效
标题翻译：具有接收终端的视频文本通信网络，其响应于预定时间表自动地对网络进行操作
公开(公告)号：US5218708A
公开(公告)日：1993-06-08
申请号：US423966
申请日：1989-10-18
申请人： Yoshiyuki Kanbayashi , Tadahiko Nakao , Yasuo Koiwai , Shigeyuki Shimauchi , Tetsuro Sato , Yasuo Misawa , Youichi Suzuki , Touru Uruno , Masayuki Doi , Shigeru Suzuki , Susumu Miyamoto
发明人： Yoshiyuki Kanbayashi , Tadahiko Nakao , Yasuo Koiwai , Shigeyuki Shimauchi , Tetsuro Sato , Yasuo Misawa , Youichi Suzuki , Touru Uruno , Masayuki Doi , Shigeru Suzuki , Susumu Miyamoto
IPC分类号： H04M11/08
CPC分类号： H04M11/085 , Y10S707/99945 , Y10S707/99948
摘要： An automatic information receiving terminal device in a character/graphic information network system including a videotex communication network or a public communication network (telephone network) is connected to an information center through the videotex or public communication network so that various items of image information from the information center can be received by the terminal device. The terminal device having an internal clock and a time setting unit. The terminal device can automatically receive or reproduce desired information at an each time preset by the time setting means, so that the terminal device can automatically be operated without manual intervention so as to give emergency information or the like timely to a number of people.
摘要翻译：包括视频通信网络或公共通信网络（电话网络）的字符/图形信息网络系统中的自动信息接收终端设备通过视频或公共通信网络连接到信息中心，从而来自信息中心可以由终端设备接收。终端装置具有内部时钟和时间设定单元。终端装置可以在由时间设定装置预先设定的每一时刻自动地接收或再现期望的信息，使得终端装置能够在没有手动干预的情况下自动地进行操作，以便及时向多个人提供紧急信息等。

2. 发明授权

US09216472B2 Friction stir welding apparatus comprising slide plates 有权
标题翻译：包括滑板的摩擦搅拌焊接设备
公开(公告)号：US09216472B2
公开(公告)日：2015-12-22
申请号：US13806022
申请日：2011-10-14
申请人： Tetsuro Sato , Yasuhiro Sakamoto , Tomonori Miyamichi , Toshiyuki Suda
发明人： Tetsuro Sato , Yasuhiro Sakamoto , Tomonori Miyamichi , Toshiyuki Suda
IPC分类号： B23K20/12
CPC分类号： B23K20/123 , B23K20/1225 , B23K20/126
摘要： A friction stir welding apparatus includes a rotating tool provided with an upper rotating body arranged to be axially adjustable in position by an upper actuator, a lower rotating body integral with a rotating main rod extending through the upper rotating body and arranged to be axially adjustable in position by a lower actuator, and a stirring part formed in the rod. The upper rotating body and the lower rotating body clamp therebetween a joint of members to be joined placed with their end faces butting each other. The stirring part is rotated to stir the joint by frictional heat to join them. The rotating tool includes a slide plate attached, through a thrust bearing, to one or both of end portions of the upper rotating body and the lower rotating body facing each other to provide good finished surfaces of the joint.
摘要翻译：摩擦搅拌焊接装置包括旋转工具，该旋转工具设置有上部旋转体，该上部旋转体被布置成通过上部致动器在位置上可轴向调节;下部旋转体，与旋转的主杆一体地延伸穿过上部旋转体并布置成可轴向调节通过下致动器的位置，以及形成在杆中的搅拌部。上部旋转体和下部旋转体夹持在其间的待接合构件的接头与它们的端面彼此对接放置。旋转搅拌部分以通过摩擦热来搅拌接头以使其接合。旋转工具包括通过推力轴承连接到上部旋转体的一个或两个端部和相对于彼此相对的下部旋转体的滑动板，以提供良好的接头的完成表面。

3. 发明申请

US20080174016A1 Flexible Printed Wiring Board and Semiconductor Device 审中-公开
标题翻译：柔性印刷线路板和半导体器件
公开(公告)号：US20080174016A1
公开(公告)日：2008-07-24
申请号：US11965404
申请日：2007-12-27
申请人： Tetsuro Sato , Makoto Yamagata , Noriaki Iwata
发明人： Tetsuro Sato , Makoto Yamagata , Noriaki Iwata
IPC分类号： H01L23/48 , B32B3/00
CPC分类号： H05K1/0346 , H01L2924/0002 , H05K2201/0154 , H05K2201/0355 , Y10T428/24917 , H01L2924/00
摘要： A flexible printed wiring board is characterized by a laminate formed by directly laminating an electrodeposited copper foil having S side and M side, each of S side and M side having a different surface roughness, the surface roughness (Rzjis) of the deposition plain side being 1.0 μm or less, and the glossiness of the M side [Gs(60°)] being 400 or more, on a surface of an insulating layer being a substrate layer made of a resin having both of an imide structure and an amide structure in the molecule; and forming a wiring pattern by etching the electrodeposited copper foil. By using a resin having both of an imide structure and an amide structure in the molecule as the insulating layer, a flexible printed wiring board having excellent properties such as mechanical properties, heat resistance, alkali resistance and the like, especially a COF substrate is provided.
摘要翻译：柔性印刷电路板的特征在于，通过直接层叠具有S侧和M侧的电解铜箔，S面和M侧的每一面具有不同的表面粗糙度，沉积平面的表面粗糙度（Rzjis）为 1.0μm或更小，并且在作为由具有酰亚胺结构和酰胺结构的树脂制成的基材层的绝缘层的表面上，M侧[Gs（60°）]的光泽度为400以上分子; 以及通过蚀刻所述电沉积铜箔形成布线图案。通过在分子中使用具有酰亚胺结构和酰胺结构的树脂作为绝缘层，提供了具有优异性能如机械性能，耐热性，耐碱性等的柔性印刷线路板，特别是COF基材。

4. 发明申请

US20070102804A1 Multilayered printed wiring board and manufacturing method thereof 失效
标题翻译：多层印刷电路板及其制造方法
公开(公告)号：US20070102804A1
公开(公告)日：2007-05-10
申请号：US10580198
申请日：2004-12-09
申请人： Kensuke Nakamura , Tetsuro Sato
发明人： Kensuke Nakamura , Tetsuro Sato
IPC分类号： B05D5/12
CPC分类号： H05K3/4655 , H05K3/386 , H05K3/4652 , H05K2201/0195 , H05K2203/066 , Y10T428/12556 , Y10T428/12569 , Y10T428/12708 , Y10T428/24917
摘要： An object of the present invention is to provide a multi-layered printed wiring board which does not require roughening such as black oxide treatment and the like on inner layer circuits. For the purpose of achieving this object, there is adopted a multi-layered printed wiring board characterized by comprising a primer resin layer P comprising exclusively a resin between each inner layer circuit Ci formed without roughening and an insulating resin layer 5 of the multi-layered printed wiring board. The multi-layered printed wiring board is manufactured by taking the steps such as (a) a steps for producing a primer resin sheet with a carrier film including a 2 micron m to 12 micron m thick primer resin layer; (b) a steps for placing the primer resin sheet on the inner-layer circuit board in which the primer resin layer of the primer resin sheet with a carrier film is placed on the inner layer circuit board and then the carrier film is removed; (c) a steps for pressing in which a pre-preg and a metal foil for forming a conductive layer are superposed on the primer resin sheet, and pressed to form the multi-layered metal clad laminate; and (d) a steps for forming an outer layer circuit wherein the outer layer circuit is formed by etching the outer layer metal foil of the multi-layered metal clad laminate to make the multi-layered printed wiring board.
摘要翻译：本发明的目的是提供一种在内层电路上不需要诸如黑色氧化物处理等的粗糙化的多层印刷线路板。为了实现该目的，采用了一种多层印刷电路板，其特征在于包括仅在不粗化形成的每个内层电路Ci和多层绝缘树脂层5之间仅包含树脂的底漆树脂层P 印刷线路板。通过以下步骤制造多层印刷线路板：（a）用包含2微米至12微米厚的底漆树脂层的载体膜制备底漆树脂片的步骤; （b）将底漆树脂片放置在内层电路基板上的步骤，在该内层电路板上，将具有载体膜的底漆树脂片的底漆树脂层放置在内层电路板上，然后除去载体膜; （c）用于压制的步骤，其中用于形成导电层的预浸料和金属箔叠加在底漆树脂片上，并压制以形成多层金属包覆层压板; 以及（d）形成外层电路的步骤，其中通过蚀刻多层金属包覆层压板的外层金属箔形成外层电路以制造多层印刷电路板。

5. 发明授权

US07163600B2 Method for preparing copper foil with insulating layer and copper foil with insulating layer prepared by the method, and printed wiring board using the copper foil with insulating layer 有权
标题翻译：通过该方法制备具有绝缘层的铜箔和具有绝缘层的铜箔的方法和使用具有绝缘层的铜箔的印刷线路板
公开(公告)号：US07163600B2
公开(公告)日：2007-01-16
申请号：US10250649
申请日：2002-11-22
申请人： Tetsuro Sato , Noriyuki Nagashima
发明人： Tetsuro Sato , Noriyuki Nagashima
IPC分类号： B32B37/00
CPC分类号： H05K3/4655 , H05K1/0366 , H05K3/384 , H05K3/4652 , H05K2201/0195 , H05K2201/0358 , H05K2203/0307 , Y10T428/31678 , Y10T428/31681
摘要： To provide a method of manufacturing a material which can make a skeletal component as thin as possible to be contained in an insulating layer in a manufactured copper clad laminate and can securely prevent the direct contact between the nodular treatment surface of the attached copper foil and a skeletal component. In order to attain the object, here is adopted “a method of manufacturing a copper foil with an insulating layer 1 which method is a method of manufacturing a copper foil provided with a semi-cured insulating resin layer containing a skeletal component on one side surface of the copper foil, and is characterized in that: a first thermosetting resin layer 3 in an uncured or semi-cured state is provided on one side surface of a copper foil 2; a nonwoven fabric 5 or a woven cloth 5 to be a skeletal component is press-bonded onto a first thermosetting resin layer 3; a second thermosetting resin layer 7 is formed on a surface of a press-bonded nonwoven fabric 5 or woven cloth 5; and a semi-cured insulating layer containing the nonwoven fabric 5 or the woven cloth 5 is formed on one side surface of the copper foil 2 by drying into a semi-cured state.”
摘要翻译：为了提供一种能够使制造的覆铜层压板的绝缘层中含有尽可能薄的骨架成分的材料的制造方法，能够可靠地防止附着的铜箔的结节处理面与骨骼成分。为了达到此目的，这里采用“一种具有绝缘层1的铜箔的制造方法”，该方法是在一个侧面上设置有含有骨架成分的半固化绝缘树脂层的铜箔的制造方法的特征在于：在铜箔2的一个侧面上设置有未固化或半固化状态的第一热固性树脂层3，作为骨架的无纺布5或编织布5 将组分压合在第一热固性树脂层3上;第二热固性树脂层7形成在压合无纺布5或织布5的表面上;以及半固化绝缘层，其包含无纺织物5或通过干燥成半固化状态，在铜箔2的一个侧面上形成编织布5。

6. 发明申请

US20060166005A1 Resin layer-coated copper foil and multilayer printed wiring board obtained with the resin layered-coated copper foil 审中-公开
标题翻译：树脂层涂铜箔和多层印刷布线板，用树脂层压铜箔制成
公开(公告)号：US20060166005A1
公开(公告)日：2006-07-27
申请号：US10523698
申请日：2003-08-14
申请人： Tetsuro Sato , Noriyuki Nagashima
发明人： Tetsuro Sato , Noriyuki Nagashima
IPC分类号： B32B15/08 , B32B27/38
CPC分类号： H05K3/4655 , B32B15/08 , B32B27/38 , H05K3/4652 , H05K2201/0358 , H05K2201/0959 , Y10T428/31529
摘要： The present invention provides a resin-coated copper foil, which does not form a crack in the filled resin layer due to thermal shock in a soldering step or the like, when the resin of the resin-coated copper foil has filled via holes. The present invention provides a resin-coated copper foil having the resin layer on one side of the copper foil, wherein the resin composition of the resin layer comprises (1) 20 to 70 parts by weight of an epoxy resin, (2) 5 to 30 parts by weight of a high polymer having a crosslinkable functional group in the molecule and a crosslinking agent therefor in combination, and (3) 10 to 60 parts by weight of a compound having a structure shown in Formula 1. wherein n is an integer of one or more.
摘要翻译：本发明提供一种树脂被覆铜箔，当树脂被覆铜箔的树脂填充通孔时，在焊接步骤等中由于热冲击而不会在填充的树脂层中形成裂纹。本发明提供一种在铜箔一侧具有树脂层的树脂被覆铜箔，其中树脂层的树脂组合物包含（1）20〜70重量份的环氧树脂，（2）5〜 30重量份在分子中具有交联性官能团的高分子和其交联剂组合，和（3）10〜60重量份具有式1所示结构的化合物，其中n为整数一个或多个。

7. 发明授权

US07927453B2 Method of manufacturing copper foil with insulating layer, copper foil with insulating layer obtained with the same method, and printed circuit board using the same copper foil with insulating layer 有权
标题翻译：制造具有绝缘层的铜箔的方法，用相同方法得到的具有绝缘层的铜箔以及使用与绝缘层相同的铜箔的印刷电路板
公开(公告)号：US07927453B2
公开(公告)日：2011-04-19
申请号：US11603201
申请日：2006-11-22
申请人： Tetsuro Sato , Noriyuki Nagashima
发明人： Tetsuro Sato , Noriyuki Nagashima
IPC分类号： B32B37/00
CPC分类号： H05K3/4655 , H05K1/0366 , H05K3/384 , H05K3/4652 , H05K2201/0195 , H05K2201/0358 , H05K2203/0307 , Y10T428/31678 , Y10T428/31681
摘要： To provide a method of manufacturing a material which can make a skeletal component as thin as possible to be contained in an insulating layer in a manufactured copper clad laminate and can securely prevent the direct contact between the nodular treatment surface of the attached copper foil and a skeletal component. In order to attain the object, here is adopted “a method of manufacturing a copper foil with an insulating layer 1 which method is a method of manufacturing a copper foil provided with a semi-cured insulating resin layer containing a skeletal component on one side surface of the copper foil, and is characterized in that: a first thermosetting resin layer 3 in an uncured or semi-cured state.
摘要翻译：为了提供一种能够使制造的覆铜层压板的绝缘层中含有尽可能薄的骨架成分的材料的制造方法，能够可靠地防止附着的铜箔的结节处理面与骨骼成分。为了达到此目的，这里采用“一种具有绝缘层1的铜箔的制造方法”，该方法是在一个侧面上设置有含有骨架成分的半固化绝缘树脂层的铜箔的制造方法的铜箔，其特征在于：具有未固化或半固化状态的第一热固性树脂层3。

8. 发明授权

US06905757B2 DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN CAPACITOR LAYER OF PRINTED WIRING BOARD AND DOUBLE-SIDED COPPER CLAD LAMINATE WITH DIELECTRIC LAYER FORMED USING THE SAME DIELECTRIC FILLER CONTAINING RESIN, AND PRODUCTION METHOD OF DOUBLE-SIDED COPPER CLAD LAMINATE 有权
标题翻译：包含用于形成印刷电路板的内置电容器层的电介质填料和具有使用含有树脂的相同介电填料形成的介电层的双面铜层压板以及双面铜箔层压板的生产方法
公开(公告)号：US06905757B2
公开(公告)日：2005-06-14
申请号：US10478419
申请日：2003-04-01
申请人： Toshifumi Matsushima , Hideaki Miwa , Akira Ichiryu , Kazuhiro Yamazaki , Tetsuro Sato , Fujio Kuwako
发明人： Toshifumi Matsushima , Hideaki Miwa , Akira Ichiryu , Kazuhiro Yamazaki , Tetsuro Sato , Fujio Kuwako
IPC分类号： B32B15/08 , B32B27/18 , B32B27/34 , B32B27/38 , C08K7/00 , C08K7/16 , C08L63/00 , C08L77/00 , C08L77/10 , H01L23/12 , H05K1/16 , H05K3/38 , B32B3/00
CPC分类号： H05K1/162 , C08K7/00 , C08L63/00 , C08L77/00 , C08L77/10 , H05K3/384 , H05K2201/0209 , H05K2201/0355 , H05K2201/09309 , H05K2203/1476 , Y10T428/24917 , Y10T428/25 , C08L2666/20
摘要： An object is to provide a dielectric layer of a double-sided copper clad laminate, for use in formation of a built-in capacitor layer, which can be formed in an optional thickness without using a skeletal material and is provided with a high strength. For the purpose of achieving the object, “a dielectric filler containing resin for use in formation of the built-in capacitor layer of a printed wiring board obtained by mixing a binder resin comprising 20 to 80 parts by weight of epoxy resin (inclusive of a curing agent), 20 to 80 parts by weight of a solvent soluble aromatic polyamide resin polymer, and a curing accelerator added in an appropriate amount according to need; and a dielectric filler which is a nearly spherical dielectric powder having perovskite structure which is 0.1 to 1.0 μm in the average particle size DIA, 0.2 to 2.0 μm in the weight cumulative particle size D50 based on the laser diffraction scattering particle size distribution measurement method, and 4.5 or less in the coagulation degree represented by D50/DIA where the weight cumulative particle size D50 and the average particle size DIA obtained by the image analysis”; and the like are used.
摘要翻译：本发明的目的是提供一种用于形成内置电容器层的双面覆铜层压板的介电层，其可以在不使用骨架材料的情况下以可选择的厚度形成并且具有高强度。为了实现该目的，“用于形成印刷线路板的内置电容器层的电介质填充剂含有树脂，其通过将包含20至80重量份的环氧树脂（包括固化剂），20〜80重量份溶剂可溶性芳族聚酰胺树脂聚合物和根据需要加入适量的固化促进剂;以及介电填料，其为具有钙钛矿结构的近似球形的电介质粉末，其为0.1〜基于激光衍射散射粒度分布测量方法，平均颗粒尺寸D IA IA为1.0μm，重量累积粒径D <50 <0.2的2.0-2.0μm，4.5 以下的重量累积粒度D 50和平均粒径D IA 通过图像分析获得“; 等等。

9. 发明授权

US06716530B2 RESIN COMPOUND FOR FABRICATING INTERLAYER DIELECTRIC OF PRINTED WIRING BOARD, RESIN SHEET AND RESIN APPLIED-COPPER FOIL FOR FORMING INSULATION LAYER USING THE RESIN COMPOUND, AND COPPER-CLAD LAMINATE USING THEM 失效
标题翻译：用于印刷印刷板，树脂片和树脂的中间层电介质的树脂化合物使用树脂化合物形成绝缘层的铜箔和使用它们的铜箔层压板
公开(公告)号：US06716530B2
公开(公告)日：2004-04-06
申请号：US09996802
申请日：2001-11-30
申请人： Tetsuro Sato , Tsutomu Asai
发明人： Tetsuro Sato , Tsutomu Asai
IPC分类号： B32B2738
CPC分类号： H05K3/4655 , C08G59/4042 , C08L63/00 , H05K3/4652 , H05K2201/0358 , Y10S428/901 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31529 , C08L2666/16
摘要： The present invention provides a resin applied-copper foil, which is free of halogen elements, having high flame retardancy, excellent water resistance, heat resistance, and good peeling strength between a base material and copper foil. To provide the a resin compound used for fabricating an interlayer dielectric of a printed wiring board, the resin compound comprises an epoxy-based resin which includes: an epoxy resin curing agent having 5 to 25% by weight of nitrogen; and maleimide compounds having thermosetting properties, and the resin compound further has composition which is free of halogen elements.
摘要翻译：本发明提供一种不含卤素元素，具有高阻燃性，优异的耐水性，耐热性以及基材和铜箔之间良好剥离强度的树脂涂布铜箔。为了提供用于制造印刷电路板的层间电介质的树脂化合物，树脂化合物包括环氧树脂，其包括：具有5至25重量％的氮的环氧树脂固化剂; 和具有热固性的马来酰亚胺化合物，并且该树脂化合物还具有不含卤素元素的组成。

10. 发明授权

US4384993A Method of the production of immunoglobulin having high content of monomer 失效
标题翻译：生产具有高含量单体的免疫球蛋白的方法
公开(公告)号：US4384993A
公开(公告)日：1983-05-24
申请号：US176689
申请日：1980-08-08
申请人： Tetsuro Sato , Akinobu Funatsu , Komei Ohashi , Shoji Ono , Tsunemasa Yoshida
发明人： Tetsuro Sato , Akinobu Funatsu , Komei Ohashi , Shoji Ono , Tsunemasa Yoshida
IPC分类号： C07K16/00 , A61K39/395 , C07K14/435 , C07K16/06 , C07G7/00
CPC分类号： C07K16/065 , Y10S530/83 , Y10S530/831
摘要： A method of the production of immunoglobulin having a high content of monr from immunoglobulin-containing materials by a fractionation method, which comprises carrying out the fractionation in the presence of a water-soluble, basic nitrogen-containing organic compound having a dissociation constant (pKb) of 7 or less or an acid addition salt thereof, and thereby inhibiting by-production of undesirable aggregated molecules. The immunoglobulin has a high content of monomer and contains no or little aggregated molecules and hence can be used as a medicine in immune prophylaxis and immunotherapy without undesirable side effects and can be administered by intraveneous route, and further, is useful for the preparation of chemically treated immunoglobulin having a high content of monomer.
摘要翻译：一种通过分级方法生产具有高含量含免疫球蛋白的材料的免疫球蛋白的方法，其包括在具有解离常数（pKb）的水溶性碱性含氮有机化合物的存在下进行分级分离）为7以下或其酸加成盐，从而抑制副产物不合格聚集的分子。免疫球蛋白具有高含量的单体并且不含或少量聚集的分子，因此可用作免疫预防和免疫治疗中的药物而没有不希望的副作用，并且可以通过侵入途径施用，并且还可用于制备化学处理的具有高含量单体的免疫球蛋白。

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