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1. 发明授权

US06905757B2 DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN CAPACITOR LAYER OF PRINTED WIRING BOARD AND DOUBLE-SIDED COPPER CLAD LAMINATE WITH DIELECTRIC LAYER FORMED USING THE SAME DIELECTRIC FILLER CONTAINING RESIN, AND PRODUCTION METHOD OF DOUBLE-SIDED COPPER CLAD LAMINATE 有权
标题翻译：包含用于形成印刷电路板的内置电容器层的电介质填料和具有使用含有树脂的相同介电填料形成的介电层的双面铜层压板以及双面铜箔层压板的生产方法
公开(公告)号：US06905757B2
公开(公告)日：2005-06-14
申请号：US10478419
申请日：2003-04-01
申请人： Toshifumi Matsushima , Hideaki Miwa , Akira Ichiryu , Kazuhiro Yamazaki , Tetsuro Sato , Fujio Kuwako
发明人： Toshifumi Matsushima , Hideaki Miwa , Akira Ichiryu , Kazuhiro Yamazaki , Tetsuro Sato , Fujio Kuwako
IPC分类号： B32B15/08 , B32B27/18 , B32B27/34 , B32B27/38 , C08K7/00 , C08K7/16 , C08L63/00 , C08L77/00 , C08L77/10 , H01L23/12 , H05K1/16 , H05K3/38 , B32B3/00
CPC分类号： H05K1/162 , C08K7/00 , C08L63/00 , C08L77/00 , C08L77/10 , H05K3/384 , H05K2201/0209 , H05K2201/0355 , H05K2201/09309 , H05K2203/1476 , Y10T428/24917 , Y10T428/25 , C08L2666/20
摘要： An object is to provide a dielectric layer of a double-sided copper clad laminate, for use in formation of a built-in capacitor layer, which can be formed in an optional thickness without using a skeletal material and is provided with a high strength. For the purpose of achieving the object, “a dielectric filler containing resin for use in formation of the built-in capacitor layer of a printed wiring board obtained by mixing a binder resin comprising 20 to 80 parts by weight of epoxy resin (inclusive of a curing agent), 20 to 80 parts by weight of a solvent soluble aromatic polyamide resin polymer, and a curing accelerator added in an appropriate amount according to need; and a dielectric filler which is a nearly spherical dielectric powder having perovskite structure which is 0.1 to 1.0 μm in the average particle size DIA, 0.2 to 2.0 μm in the weight cumulative particle size D50 based on the laser diffraction scattering particle size distribution measurement method, and 4.5 or less in the coagulation degree represented by D50/DIA where the weight cumulative particle size D50 and the average particle size DIA obtained by the image analysis”; and the like are used.
摘要翻译：本发明的目的是提供一种用于形成内置电容器层的双面覆铜层压板的介电层，其可以在不使用骨架材料的情况下以可选择的厚度形成并且具有高强度。为了实现该目的，“用于形成印刷线路板的内置电容器层的电介质填充剂含有树脂，其通过将包含20至80重量份的环氧树脂（包括固化剂），20〜80重量份溶剂可溶性芳族聚酰胺树脂聚合物和根据需要加入适量的固化促进剂;以及介电填料，其为具有钙钛矿结构的近似球形的电介质粉末，其为0.1〜基于激光衍射散射粒度分布测量方法，平均颗粒尺寸D IA IA为1.0μm，重量累积粒径D <50 <0.2的2.0-2.0μm，4.5 以下的重量累积粒度D 50和平均粒径D IA 通过图像分析获得“; 等等。

2. 发明授权

US06693793B2 Double-sided copper clad laminate for capacitor layer formation and its manufacturing method 有权
标题翻译：用于电容器层形成的双面铜箔层压板及其制造方法
公开(公告)号：US06693793B2
公开(公告)日：2004-02-17
申请号：US09981296
申请日：2001-10-15
申请人： Fujio Kuwako , Kazuhiro Yamazaki , Toshifumi Matsushima
发明人： Fujio Kuwako , Kazuhiro Yamazaki , Toshifumi Matsushima
IPC分类号： H01G408
CPC分类号： H01G4/005 , H01G4/20 , H05K1/162 , H05K3/384 , H05K3/389 , H05K2201/0195 , H05K2201/0209 , H05K2201/0355 , H05K2201/09309 , H05K2203/0307 , Y10T29/435
摘要： The invention concerns multilayered structures useful for forming capacitors, which may be embedded within printed circuit boards or other microelectronic devices. The capacitor comprises a pair of parallel conductive foils separated by a pair of dielectric layers. The dielectric layers are further separated by a heat resistant film layer such that the capacitor exhibits excellent short circuit resistance. The resulting capacitor exhibits excellent void and electrical short resistance.
摘要翻译：本发明涉及可用于形成电容器的多层结构，其可嵌入印刷电路板或其它微电子器件中。电容器包括由一对电介质层分开的一对平行导电箔。电介质层被耐热膜层进一步分离，使得电容器表现出优异的短路电阻。所得到的电容器具有优异的空隙和电阻。

3. 发明授权

US08866018B2 Passive electrical devices and methods of fabricating passive electrical devices 有权
标题翻译：无源电器件和无源电器件的制造方法
公开(公告)号：US08866018B2
公开(公告)日：2014-10-21
申请号：US12352411
申请日：2009-01-12
申请人： Pranabes K. Pramanik , Yuji Kageyama , Fujio Kuwako , Jin Hyun Hwang
发明人： Pranabes K. Pramanik , Yuji Kageyama , Fujio Kuwako , Jin Hyun Hwang
IPC分类号： H01B7/08 , H01G4/18 , H01G4/20 , H01G4/33 , H05K1/16
CPC分类号： H01G4/18 , H01G4/203 , H01G4/33 , H05K1/162 , H05K2201/0166 , H05K2201/0195 , H05K2201/0355 , H05K2201/09309 , Y10T156/10
摘要： A thin laminate passive electrical device, such as, a capacitor, and a method of fabricating a thin laminate passive electrical device are provided. The passive electrical device includes two conductors, for example, copper foil conductors, separated by a dielectric having a first layer of a first material having a softening point temperature greater than a first temperature and a first layer of a second material having a softening point temperature less than the first temperature. The first temperature may be at least 150 degrees C. or higher. By providing a first layer having a higher softening point material, shorting across the conductors, that can be promoted by the fabrication process, is prevented. Methods of fabricating passive electrical devices are also disclosed.
摘要翻译：提供了一种诸如电容器的薄层压无源电器件以及制造薄层压无源电器件的方法。无源电器件包括两个导体，例如铜箔导体，由具有软化点温度大于第一温度的第一材料的第一层和第一材料的电介质隔开，第一层的第一材料具有软化点温度小于第一温度。第一温度可以为至少150摄氏度或更高。通过提供具有较高软化点材料的第一层，可以防止通过制造工艺促进导体的短路。还公开了制造无源电器件的方法。

4. 发明授权

US6107003A Method for producing multi-layer printed wiring boards having blind vias 失效
标题翻译：具有盲孔的多层印刷电路板的制造方法
公开(公告)号：US6107003A
公开(公告)日：2000-08-22
申请号：US229225
申请日：1999-01-12
申请人： Fujio Kuwako
发明人： Fujio Kuwako
IPC分类号： H05K3/00 , H05K3/02 , H05K3/06 , H05K3/10 , H05K3/46 , G03C5/00
CPC分类号： H05K3/4652 , H05K3/0038 , H05K3/025 , H05K2203/0376 , H05K2203/0384 , H05K3/0035 , H05K3/064 , H05K3/108
摘要： An alkaline refractory metal which is insoluble in alkaline etching solutions, is electrodeposited on the surface of copper foil, then a thermosetting resin is applied to the surface and semi-cured to obtain a coated copper foil. The coated copper foil is bonded to one or both faces of an inner layer board having wirings on one or both of its faces. Then, the copper foil on a surface of this laminate is removed by alkaline etching, while selectively leaving the alkaline refractory metal layer. A laser beam is used to form via holes in both the alkaline refractory metal layer and the thermosetting resin layer simultaneously. With the above method, via holes of the multi-layered printed wiring board can be easily formed using a laser, and adhesion between the outer wirings made from the plated copper and the insulating resin is improved.
摘要翻译：将不溶于碱性蚀刻溶液的碱性难熔金属电沉积在铜箔的表面上，然后将热固性树脂施加到表面上并半固化以获得涂覆的铜箔。涂覆的铜箔在其一个或两个面上具有布线的内层板的一面或两面粘合。然后，通过碱蚀刻除去该层压体的表面上的铜箔，同时选择性地离开碱性难熔金属层。使用激光束同时在碱性耐火金属层和热固性树脂层中形成通孔。利用上述方法，可以使用激光容易地形成多层印刷电路板的通孔，并且改善了由镀铜和绝缘树脂制成的外部布线之间的粘合性。

5. 发明授权

US06884944B1 Multi-layer printed wiring boards having blind vias 失效
标题翻译：具有盲孔的多层印刷电路板
公开(公告)号：US06884944B1
公开(公告)日：2005-04-26
申请号：US09591523
申请日：2000-06-09
申请人： Fujio Kuwako
发明人： Fujio Kuwako
IPC分类号： H05K3/00 , H05K3/02 , H05K3/06 , H05K3/10 , H05K3/46 , H01R12/04 , H05K1/11
CPC分类号： H05K3/025 , H05K3/0035 , H05K3/0038 , H05K3/064 , H05K3/108 , H05K3/4652 , H05K2203/0376 , H05K2203/0384
摘要： A multi-layer printed wiring board having via holes is characterized by having the outer copper wifing circuit lines on a layer of an alkaline refractory metal which is adjacent to a thermosetting resin layer. An alkaline refractory metal which is insoluble is alkaline etching solutions, is electrodeposited on the surface of copper foil, then a thermosetting resin is applied to the surface and semi-cured to obtain a coated copper foil. The coated copper foil is bonded to one or both faces of an inner layer board having wirings on one or both of its faces. Then, the copper foil on a surface of this laminate is removed by alkaline etching, while selectively leaving the alkaline refractor metal layer. A laser beam is used to form via holes in both the alkaline refractory metal layer and the thermosetting resin layer simultaneously. Via holes of the multi-layered printed wiring board can be easily formed using a laser, and adhesion between the outer wirings made from the plated copper and the insulating resin is improved.
摘要翻译：具有通孔的多层印刷线路板的特征在于，在与热固性树脂层相邻的碱性难熔金属层上具有外部铜波纹线路。将不溶解的碱性难熔金属为碱性蚀刻溶液，电沉积在铜箔表面上，然后将热固性树脂涂覆在表面上并半固化，得到涂覆的铜箔。涂覆的铜箔在其一个或两个面上具有布线的内层板的一面或两面粘合。然后，通过碱蚀刻除去该层压体的表面上的铜箔，同时选择性地离开碱性折射金属层。使用激光束同时在碱性耐火金属层和热固性树脂层中形成通孔。可以使用激光容易地形成多层印刷线路板的通孔，并且提高由镀铜和绝缘树脂制成的外部布线之间的粘合性。

6. 发明授权

US06551433B2 Method for producing copper-clad laminate 失效
公开(公告)号：US06551433B2
公开(公告)日：2003-04-22
申请号：US09904386
申请日：2001-07-12
申请人： Fujio Kuwako , Tomohiro Ishino
发明人： Fujio Kuwako , Tomohiro Ishino
IPC分类号： B32B3100
CPC分类号： B32B15/08 , B32B15/20 , B32B37/0023 , B32B2311/12 , B32B2457/08 , H05K1/09 , H05K3/025 , H05K3/4602 , H05K3/4652 , H05K2201/0355 , H05K2201/0358 , H05K2201/09509 , Y10S428/914 , Y10T428/1438 , Y10T428/24843 , Y10T428/24917 , Y10T428/2804
摘要： An object of the invention is to prevent dent faults generated during bonding of an outer copper foil layer onto an inner layer substrate having a through hole or a cavity serving as an interlayer electrical connection means such as an interstitial via hole (IVH) or a blind via hole (BVH). In order to attain the object, there is provided a method for producing a copper-clad laminate employing the following copper foil serving as an outer layer: (1) a resin-coated copper foil being formed of copper foil having a thickness of 15 &mgr;m or more and a rupture strength of 275 kN/m2 or more as measured through a bulge test performed after the foil is heated, wherein the resin-coated copper foil has a resin layer on one side of the copper foil; (2) a copper foil with etchable carrier, wherein the total thickness of the carrier layer and the copper foil layer is 20 &mgr;m or more; or (3) a copper foil with peelable carrier, wherein the total thickness of the carrier layer and the copper foil layer is 20 &mgr;m or more, the releasing layer formed between the carrier layer and the copper foil layer having a peel strength of 5 gf/cm to 300 gf/cm as measured after heating.

7. 发明授权

US06240636B1 Method for producing vias in the manufacture of printed circuit boards 有权
标题翻译：制造印刷电路板的通孔的制造方法
公开(公告)号：US06240636B1
公开(公告)日：2001-06-05
申请号：US09281331
申请日：1999-03-30
申请人： Tsutomu Asai , Fujio Kuwako , Shinichi Obata
发明人： Tsutomu Asai , Fujio Kuwako , Shinichi Obata
IPC分类号： H01K310
CPC分类号： H05K3/4652 , B23K26/389 , H05K3/0035 , H05K3/0038 , H05K3/025 , H05K3/064 , H05K3/108 , H05K2203/0353 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： In a process producing a multi-layer printed wiring board, an inner core having at least one wiring pattern on its surface and an outer layer of copper foil are laminated with an organic insulating layer interposed therebetween, a via hole is formed using a laser beam, and the outer copper foil and the inner wiring patterns are electrically connected to each other by depositing copper. The process is characterized in that the outer layer of copper foil has a thickness of no more than one-fifth of the thickness of the inner wiring pattern, but will not exceed 7 &mgr;m, preferably 4 &mgr;m. The hole is formed in both the copper foil and the insulating layer simultaneously by irradiating with a laser beam on the outer layer of copper foil.
摘要翻译：在制造多层印刷电路板的工艺中，在其表面上具有至少一个布线图案的内芯和铜箔的外层层叠有介于其间的有机绝缘层，使用激光束形成通孔，并且外部铜箔和内部布线图案通过沉积铜彼此电连接。该方法的特征在于，铜箔的外层的厚度不超过内部布线图案厚度的五分之一，但不超过7μm，优选4μm。通过在铜箔的外层上照射激光，同时在铜箔和绝缘层中形成孔。

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