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1. 发明申请

US20090317591A1 Metal Composite Laminate for Producing Flexible Wiring Board and Flexible Wiring Board 审中-公开
标题翻译：用于生产柔性布线板和柔性布线板的金属复合层压板
公开(公告)号：US20090317591A1
公开(公告)日：2009-12-24
申请号：US12441110
申请日：2007-09-13
申请人： Tetsuro Sato , Makoto Yamagata , Noriaki Iwata , Toshiaki Ono , Yasuo Komoda , Tatsuo Kataoka , Shuji Chikujo , Naoaki Ogawa
发明人： Tetsuro Sato , Makoto Yamagata , Noriaki Iwata , Toshiaki Ono , Yasuo Komoda , Tatsuo Kataoka , Shuji Chikujo , Naoaki Ogawa
IPC分类号： B32B7/00 , B32B15/08
CPC分类号： H05K1/056 , B32B3/266 , B32B15/08 , B32B15/092 , B32B15/095 , B32B15/18 , B32B15/20 , B32B27/28 , B32B27/281 , B32B27/285 , B32B27/286 , B32B27/306 , B32B27/38 , B32B27/40 , B32B2307/206 , B32B2457/00 , H05K1/0393 , H05K3/382 , H05K2201/0191 , Y10T428/24355 , Y10T428/24917 , Y10T428/24942 , Y10T428/2495
摘要： A metal composite laminate for producing a flexible wiring board a wiring-forming metal layer for forming a wiring pattern that is laminated on the front surface of a flexible insulating resin layer, a support metal layer that serves as a support is laminated on the back surface of the insulating resin layer. The total thickness (Wt) of the metal composite laminate; the thickness (W0) of the insulating resin layer; the mean surface roughness (Rz-1) of the wiring-forming metal layer facing the front surface of the insulating resin layer; and the mean surface roughness (Rz-2) of the support metal layer facing the back surface of the insulating resin layer are controlled.
摘要翻译：一种用于制造柔性布线板的金属复合层压板，用于形成叠层在柔性绝缘树脂层的前表面上的布线图案的布线形成金属层，用作支撑体的支撑金属层层压在背面上的绝缘树脂层。金属复合层压板的总厚度（Wt）绝缘树脂层的厚度（W0）; 面对绝缘树脂层前表面的布线形成金属层的平均表面粗糙度（Rz-1）并且控制与绝缘树脂层的背面相对的支撑金属层的平均表面粗糙度（Rz-2）。

2. 发明申请

US20080174016A1 Flexible Printed Wiring Board and Semiconductor Device 审中-公开
标题翻译：柔性印刷线路板和半导体器件
公开(公告)号：US20080174016A1
公开(公告)日：2008-07-24
申请号：US11965404
申请日：2007-12-27
申请人： Tetsuro Sato , Makoto Yamagata , Noriaki Iwata
发明人： Tetsuro Sato , Makoto Yamagata , Noriaki Iwata
IPC分类号： H01L23/48 , B32B3/00
CPC分类号： H05K1/0346 , H01L2924/0002 , H05K2201/0154 , H05K2201/0355 , Y10T428/24917 , H01L2924/00
摘要： A flexible printed wiring board is characterized by a laminate formed by directly laminating an electrodeposited copper foil having S side and M side, each of S side and M side having a different surface roughness, the surface roughness (Rzjis) of the deposition plain side being 1.0 μm or less, and the glossiness of the M side [Gs(60°)] being 400 or more, on a surface of an insulating layer being a substrate layer made of a resin having both of an imide structure and an amide structure in the molecule; and forming a wiring pattern by etching the electrodeposited copper foil. By using a resin having both of an imide structure and an amide structure in the molecule as the insulating layer, a flexible printed wiring board having excellent properties such as mechanical properties, heat resistance, alkali resistance and the like, especially a COF substrate is provided.
摘要翻译：柔性印刷电路板的特征在于，通过直接层叠具有S侧和M侧的电解铜箔，S面和M侧的每一面具有不同的表面粗糙度，沉积平面的表面粗糙度（Rzjis）为 1.0μm或更小，并且在作为由具有酰亚胺结构和酰胺结构的树脂制成的基材层的绝缘层的表面上，M侧[Gs（60°）]的光泽度为400以上分子; 以及通过蚀刻所述电沉积铜箔形成布线图案。通过在分子中使用具有酰亚胺结构和酰胺结构的树脂作为绝缘层，提供了具有优异性能如机械性能，耐热性，耐碱性等的柔性印刷线路板，特别是COF基材。

3. 发明申请

US20070098910A1 Flexible copper clad laminate, flexible printed wiring board obtained by using flexible copper clad laminate thereof, film carrier tape obtained by using flexible copper clad laminate thereof, semiconductor device obtained by using flexible copper clad laminate thereof, method of manufacturing flexible copper clad laminate and method of manufacturing film carrier tape 审中-公开
标题翻译：柔性覆铜层压板，通过使用柔性覆铜层压板获得的柔性印刷布线板，使用柔性覆铜层压板获得的薄膜载带，使用柔性覆铜层压板获得的半导体器件，柔性覆铜层压板的制造方法制造薄膜载带
公开(公告)号：US20070098910A1
公开(公告)日：2007-05-03
申请号：US11580683
申请日：2006-10-13
申请人： Makoto Yamagata , Hiroaki Kurihara , Naoya Yasui , Noriaki Iwata
发明人： Makoto Yamagata , Hiroaki Kurihara , Naoya Yasui , Noriaki Iwata
IPC分类号： B05D7/00 , B05D1/36 , B32B3/00 , B32B7/00 , B32B15/00
CPC分类号： H05K1/09 , C25D1/04 , H05K1/0393 , H05K3/384 , H05K2201/0355 , H05K2201/10477 , H05K2203/0307 , Y10T428/24917
摘要： An object of the invention is to provide a flexible copper clad laminate and the like in use of electro-deposited copper foil having lower profile and higher mechanical strength compared with conventional low profile electro-deposited copper foil having been supplied in the market. For attaining the object, a flexible copper clad laminate manufactured by laminating the electro-deposited copper foil to resin film, which is characterized in that a deposition surface of the electro-deposited copper foil comprises a low profile glossy surface having surface roughness (Rzjis) of not more than 1.5 μm and brightness (Gs (60°)) of not less than 400 and the deposition surface and the resin film are bonded together is adopted. And, using the flexible copper clad laminate, it may ease manufacture of a flexible printed wiring board as a film carrier tape, such as a COF tape and the like, wherein the formed wiring has a fine pitch wiring with pitch being not more than 35 μm.
摘要翻译：本发明的目的是提供一种使用电镀铜箔的柔性覆铜层压板等，其具有比市面上提供的常规小型电沉积铜箔更低的轮廓和更高的机械强度。为了实现该目的，通过将电解铜箔层压到树脂膜上制造的柔性覆铜层压板，其特征在于，电沉积铜箔的沉积表面包括具有表面粗糙度（Rzjis）的低轮廓光泽表面，采用不大于1.5μm，亮度（Gs（60°））不小于400，沉积表面和树脂膜粘合在一起。并且，使用柔性覆铜层叠体，可以容易地制造作为COF带等的薄膜载带的柔性印刷布线板，其中所形成的布线具有间距不大于35的细间距布线妈妈

4. 发明申请

US20080006441A1 Wiring board and semiconductor device excellent in folding endurance 审中-公开
标题翻译：接线板和半导体器件耐折性优异
公开(公告)号：US20080006441A1
公开(公告)日：2008-01-10
申请号：US11825039
申请日：2007-07-03
申请人： Makoto Yamagata , Hiroaki Kurihara , Naoya Yasui , Noriaki Iwata
发明人： Makoto Yamagata , Hiroaki Kurihara , Naoya Yasui , Noriaki Iwata
IPC分类号： H05K1/16
CPC分类号： H05K3/28 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/09701 , H05K1/032 , H05K1/09 , H05K2201/0154 , H05K2201/0191 , H05K2201/0355 , H05K2201/10674 , H01L2224/0401
摘要： A wiring board with folding endurance includes an insulating film and a copper-containing wiring pattern on a surface of the insulating film, and includes an insulating resin coating layer formed on the wiring pattern such that terminals are exposed. The wiring board has any of the constitutions (A), (B), (C) and (D) below. (A) The wiring pattern includes copper particles having a mean crystal particle diameter in the range of from 0.65 to 0.85 μm as determined by EBSP; not more than 1% of the volume of the wiring pattern is accounted for by copper crystal particles having a particle diameter of less than 1.0 μm as determined by EBSP; and copper crystal particles that are [100] oriented in the longitudinal direction of a lead of the wiring pattern account for from 10 to 20% of the volume of the wiring pattern as determined by EBSP. (B) The insulating film is formed of a polyimide film having a tensile strength within the range of from 450 to 600 MPa and a Young's modulus within the range of from 8500 to 9500 MPa. (C) The insulating film is formed of a polyimide film having a thickness of from 10 to 30 μm. (D) The insulating resin coating layer has a thickness of from 50 to 150% relative to the thickness of the insulating film.
摘要翻译：具有耐折性的布线板在绝缘膜的表面上包括绝缘膜和含铜布线图案，并且包括形成在布线图案上以使端子露出的绝缘树脂涂层。布线板具有下述（A），（B），（C）和（D）中的任何一个。（A）布线图案包括通过EBSP测定的平均结晶粒径在0.65至0.85μm范围内的铜颗粒; 通过EBSP测定，不超过1％的布线图案的体积由具有小于1.0μm的粒径的铜结晶粒子占据; 并且沿着布线图案的引线的纵向取向的铜结晶粒子占由EBSP确定的布线图案的体积的10至20％。（B）绝缘膜由拉伸强度为450〜600MPa，杨氏模量为8500〜9500MPa的聚酰亚胺膜形成。（C）绝缘膜由厚度为10〜30μm的聚酰亚胺膜形成。（D）绝缘树脂被覆层的厚度相对于绝缘膜的厚度为50〜150％。

5. 发明申请

US20070090086A1 Two-layer flexible printed wiring board and method for manufacturing the two-layer flexible printed wiring board 审中-公开
标题翻译：双层柔性印刷线路板及制造双层柔性印刷线路板的方法
公开(公告)号：US20070090086A1
公开(公告)日：2007-04-26
申请号：US11585679
申请日：2006-10-24
申请人： Makoto Yamagata , Hiroaki Kurihara , Naoya Yasui , Noriaki Iwata
发明人： Makoto Yamagata , Hiroaki Kurihara , Naoya Yasui , Noriaki Iwata
IPC分类号： H01B13/00 , B32B3/00 , B32B7/00
CPC分类号： H05K1/028 , B32B15/08 , B32B15/20 , H05K1/09 , H05K3/06 , H05K2201/0355 , H05K2203/0353 , H05K2203/0369 , Y10T428/24917
摘要： An object of the present invention is to provide a flexible printed wiring board, excellent in folding ability, obtained from a flexible copper-clad laminate using an electro-deposited copper foil. In order to achieve the object, there is provided a two-layer flexible printed wiring board having a wiring, formed by etching an electro-deposited copper foil, on a surface of a resin film layer, the wiring including only a steady-deposition crystal layer 2 formed by removing an initial-deposition crystal layer 1 formed at the time of the electro-deposited copper foil preparation. When the two-layer flexible printed wiring board has a cover film layer, preferably the deviation between the neutral line of the sectional thickness of the two-layer flexible printed wiring board and the central line of the wiring thickness of the two-layer flexible printed wiring board falls within 5% of the total thickness of the two-layer flexible printed wiring board.
摘要翻译：本发明的目的是提供一种使用电沉积铜箔的柔性覆铜层压板获得的折叠能力优异的柔性印刷线路板。为了实现该目的，提供了一种双层柔性印刷布线板，其具有在树脂膜层的表面上蚀刻电解铜箔而形成的布线，该布线仅包括稳定沉积晶体通过去除在电沉积铜箔制备时形成的初始沉积晶体层1形成的层2。当双层柔性印刷电路板具有覆盖膜层时，优选地，两层柔性印刷电路板的截面厚度的中性线与两层柔性印刷电路板的布线厚度的中心线之间的偏差接线板落在两层柔性印刷电路板总厚度的5％以内。

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