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    • 2. 发明授权
    • Multiplate clutch
    • 多板离合器
    • US08448770B2
    • 2013-05-28
    • US12826152
    • 2010-06-29
    • Yoshitsugu GokanYoshinobu ShiomiHirotaka KawatsuKatsumi SatoTaito Kobayashi
    • Yoshitsugu GokanYoshinobu ShiomiHirotaka KawatsuKatsumi SatoTaito Kobayashi
    • F16D43/21F16D13/04
    • F16D13/56F16D2013/565
    • A multiplate clutch has an assistive cam mechanism comprising a first cam member having a first recess and a second cam member having a first tooth inserted in the first recess, wherein at least one of abutment surfaces of the first recess and the first tooth in a power transmitting state for transmitting power from an input member to an output member comprises a slanted surface for increasing an urging force of a clutch spring upon acceleration in the power transmitting state. The multiplate clutch is prevented from being connected abruptly while sufficiently reducing a load with which to operate the clutch. The angle of intersection between the slanted surfaces and a plane perpendicular to a clutch central axis is set to a range from 80 degrees to 85 degrees.
    • 多重离合器具有辅助凸轮机构,其包括具有第一凹部的第一凸轮构件和插入第一凹部中的第一齿的第二凸轮构件,其中第一凹部和第一齿的抵靠表面中的至少一个处于功率 从输入构件向输出构件传递动力的传递状态包括用于在动力传递状态下加速时增加离合器弹簧的作用力的倾斜表面。 防止多片离合器突然连接,同时充分减少用于操作离合器的负载。 倾斜面与垂直于离合器中心轴的平面之间的交叉角设定在80度至85度的范围内。
    • 5. 发明申请
    • Die pickup method and die pickup device
    • 芯片拾取方法和芯片拾取装置
    • US20050036884A1
    • 2005-02-17
    • US10916348
    • 2004-08-11
    • Takashi TakeuchiTaito Kobayashi
    • Takashi TakeuchiTaito Kobayashi
    • H01L21/67H01L21/00H01L21/52H01L21/68B65G65/04
    • H01L21/67132
    • A die pickup method and device including a collet 4 that vacuum-chucks dies 1A, 1B, IC . . . , which are on a wafer sheet 2, and a suction stage 6, which vacuum-sucks this wafer sheet 2. A protruding surface 21 is formed on the upper surface of the suction stage 6 so that it is located on the feeding (upstream) side in the direction in which dies are fed to the die pickup center 5 of the suction stage 6. The wafer sheet 2 being vacuum-sucked by the suction stage 6 is fed so that a die 1A that is to be picked up is moved toward the die pickup center 5, thus allowing the die 1A to be separated from the wafer sheet 2 as the die 1A passes the protruding surface 21, and then the die 1A is vacuum-chucked and picked up by the collet 4.
    • 一种模具拾取方法和装置,其包括真空吸盘模具1A,1B,IC的夹头4。 。 。 和在真空吸附该晶片2的吸附台6.在吸入台6的上表面形成突出面21,使其位于供给(上游) 在模具被馈送到吸入级6的模具拾取中心5的方向上。供给由吸引级6真空吸附的晶片2,使得被拾取的模具1A向 芯片拾取中心5,因此当模具1A通过突出表面21时,允许模具1A与晶片2分离,然后模具1A被夹头4吸取并拾取。