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1. 发明申请

US20120031656A1 SUBSTRATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHODS FOR PRODUCING SAME 审中-公开
标题翻译：印刷线路基板，印刷电路板及其制造方法
公开(公告)号：US20120031656A1
公开(公告)日：2012-02-09
申请号：US13265108
申请日：2010-04-13
申请人： Yoshio Oka , Takashi Kasuga , Issei Okada , Katsunari Mikage , Naota Uenishi , Yasuhiro Okuda
发明人： Yoshio Oka , Takashi Kasuga , Issei Okada , Katsunari Mikage , Naota Uenishi , Yasuhiro Okuda
IPC分类号： H05K1/09 , C25D7/00 , C25D5/02 , H05K1/00 , H05K3/00
CPC分类号： H05K3/424 , C23C28/00 , C23C28/023 , C23C28/027 , H05K1/09 , H05K3/022 , H05K3/025 , H05K3/06 , H05K3/064 , H05K3/108 , H05K3/1241 , H05K3/1283 , H05K3/188 , H05K3/246 , H05K3/38 , H05K3/4038 , H05K3/4069 , H05K3/422 , H05K3/426 , H05K2201/0154
摘要： Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil layer) having a sufficiently small thickness. Also provided are a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. A substrate 1 for a printed wiring board includes an insulating base 11, a first conductive layer 12 that is stacked on the insulating base 11, and a second conductive layer 13 that is stacked on the first conductive layer 12, in which the first conductive layer 12 is a coating layer composed of a conductive ink containing metal particles, and the second conductive layer 13 is a plating layer.
摘要翻译：提供一种用于印刷线路板的基板和印刷线路板，其尺寸不受限制，因为不需要使用有机粘合剂的真空设备，并且可以包括导电层（铜箔层）具有足够小的厚度。还提供了一种用于制造印刷线路板用基板的方法及其制造方法。用于印刷电路板的基板1包括绝缘基底11，堆叠在绝缘基底11上的第一导电层12和层叠在第一导电层12上的第二导电层13，其中第一导电层 12是由含有金属颗粒的导电油墨构成的涂层，第二导电层13是镀层。

2. 发明申请

US20070089565A1 Method of producing metal powder 有权
标题翻译：金属粉末生产方法
公开(公告)号：US20070089565A1
公开(公告)日：2007-04-26
申请号：US10559021
申请日：2004-12-08
申请人： Masatoshi Majima , Kohei Shimoda , Issei Okada , Masahiro Yamakawa , Takashi Kasuga
发明人： Masatoshi Majima , Kohei Shimoda , Issei Okada , Masahiro Yamakawa , Takashi Kasuga
IPC分类号： B22F9/24
CPC分类号： B22F9/24 , B22F1/0022 , B22F1/0096 , B82Y30/00 , H05K1/097 , H05K3/125
摘要： A method of producing metal powder by reducing ions of a metal for precipitation by performance of a reducing agent in a liquid-phase reaction system, wherein the metal is precipitated as metal powder particles by being reduced under conditions in which the exchange-current density of an oxidation-reduction reaction between the metal ions and the reducing agent is 100 μA/cm2 or less, the exchange-current density being determined by the mixed potential theory.
摘要翻译：一种通过在液相反应体系中还原剂的还原剂将金属离子还原析出而制造金属粉末的方法，其中金属通过在金属粉末颗粒的交换电流密度金属离子和还原剂之间的氧化还原反应为100μA/ cm 2以下，交换电流密度由混合势理论决定。

3. 发明授权

US07510592B2 Method of producing metal powder 有权
标题翻译：金属粉末生产方法
公开(公告)号：US07510592B2
公开(公告)日：2009-03-31
申请号：US10559021
申请日：2004-12-08
申请人： Masatoshi Majima , Kohei Shimoda , Issei Okada , Masahiro Yamakawa , Takashi Kasuga
发明人： Masatoshi Majima , Kohei Shimoda , Issei Okada , Masahiro Yamakawa , Takashi Kasuga
IPC分类号： B22F9/24
CPC分类号： B22F9/24 , B22F1/0022 , B22F1/0096 , B82Y30/00 , H05K1/097 , H05K3/125
摘要： A method of producing metal powder by reducing ions of a metal for precipitation by performance of a reducing agent in a liquid-phase reaction system, wherein the metal is precipitated as metal powder particles by being reduced under conditions in which the exchange-current density of an oxidation-reduction reaction between the metal ions and the reducing agent is 100 μA/cm2 or less, the exchange-current density being determined by the mixed potential theory.
摘要翻译：一种通过在液相反应体系中还原剂的还原剂将金属离子还原析出而制造金属粉末的方法，其中金属通过在金属粉末颗粒的交换电流密度金属离子和还原剂之间的氧化还原反应为100μA/ cm 2以下，交换电流密度由混合电位理论决定。

4. 发明授权

US08026185B2 Method for manufacturing electronic circuit component 失效
标题翻译：电子电路部件的制造方法
公开(公告)号：US08026185B2
公开(公告)日：2011-09-27
申请号：US12376334
申请日：2007-08-03
申请人： Shinichi Maeda , Go Ono , Issei Okada , Kohei Shimoda
发明人： Shinichi Maeda , Go Ono , Issei Okada , Kohei Shimoda
IPC分类号： H01L21/00
CPC分类号： H01L51/052 , H01L51/0022 , H01L51/0545
摘要： An object of the present invention is to provide a method for manufacturing an electronic circuit component such as an organic TFT 1, which can manufacture an electronic circuit component excellent in reliability and having quality on a practical level, because an insulating layer and a conductive layer which have more excellent characteristics can be formed, particularly, on a general-purpose plastic substrate or the like by treatment at a process temperature of 200° C. or lower which has no influence on the above-mentioned plastic substrate.The method for manufacturing an electronic circuit component according to the invention includes heating a layer containing at least one of a polyimide and a precursor thereof at a temperature of 200° C. or lower to form an insulating layer 4 having a contact angle with water of 80° or more, forming a coating film including a dispersion containing metal nanoparticles on the above-mentioned insulating layer 4 and heating the above-mentioned coating film at a temperature of 200° C. or lower to form a conductive layer such as a source layer 5 or a drain layer 6.
摘要翻译：本发明的目的是提供一种用于制造诸如有机TFT 1的电子电路部件的方法，其可以制造可靠性优异并且具有实用水平的质量的电子电路部件，因为绝缘层和导电层特别是通过在200℃以下的处理温度下对上述塑料基板没有影响的通用塑料基板等形成更优异的特性。根据本发明的电子电路部件的制造方法包括在200℃以下的温度下加热含有聚酰亚胺及其前体中的至少一种的层，形成与水的接触角的绝缘层4 80°以上，在上述绝缘层4上形成包含含有金属纳米颗粒的分散体的涂膜，并在200℃以下的温度下加热上述涂膜，形成导电层层5或漏层6。

5. 发明申请

US20090197045A1 Metal coating, forming method thereof, and metal wiring 失效
标题翻译：金属涂层，其形成方法和金属布线
公开(公告)号：US20090197045A1
公开(公告)日：2009-08-06
申请号：US11662975
申请日：2006-05-17
申请人： Issei Okada , Kohei Shimoda
发明人： Issei Okada , Kohei Shimoda
IPC分类号： C23C26/00 , C22C5/06 , H01B13/00 , H01B1/22 , C09D5/24
CPC分类号： C23C24/08 , C22C5/06 , C23C24/00 , C23C26/00 , H01B1/02 , H01B1/22 , H05K1/097 , Y10T428/12 , Y10T428/12014 , Y10T428/24355 , Y10T428/24917
摘要： The present invention provides a metal coating formed by baking after applying a metal-nanoparticles-dispersed liquid onto a surface of a base material, the metal-nanoparticles-dispersed liquid being composed of metal nanoparticles, water, and a dispersant having a molecular weight of 2000-30000 and having a solid form at room temperature, wherein the metal coating comprises an alloy including (1) Ag and (2) at least one kind of metal selected from the group consisting of Au, Pt, Pd, Ru, Ir, Sn, Cu, Ni, Fe, Co, Ti and In, the content ratio of Ag being 80-99.9% by atomic percent in the total quantity of the alloy, and wherein the metal coating has an average grain size of 0.2-5 μm. The metal coating has small surface roughness, and superior smoothness and denseness, and has excellent properties for etching and adhesion to a base material. Also, the invention provides a method of forming such metal coating as well as a metal wiring formed by pattern formation of the metal coating.
摘要翻译：本发明提供一种金属涂层，其通过在将金属纳米粒子分散的液体涂敷在基材的表面上后进行烘烤而形成，金属纳米粒子分散液由金属纳米粒子，水和分子量为 2000-30000，并且在室温下具有固体形式，其中金属涂层包括合金，其包括（1）Ag和（2）选自Au，Pt，Pd，Ru，Ir中的至少一种金属， Sn，Cu，Ni，Fe，Co，Ti和In中，Ag的含量比例为合金总量中原子百分数为80-99.9％，其中金属涂层的平均粒径为0.2-5μm 。金属涂层具有小的表面粗糙度，优异的平滑度和致密性，并且具有优异的蚀刻和与基材的粘合性能。此外，本发明提供了形成这种金属涂层的方法以及通过金属涂层的图案形成形成的金属布线。

6. 发明申请

US20060057502A1 Method of forming a conductive wiring pattern by laser irradiation and a conductive wiring pattern 审中-公开
标题翻译：通过激光照射形成导电布线图案的方法和导电布线图案
公开(公告)号：US20060057502A1
公开(公告)日：2006-03-16
申请号：US11103448
申请日：2005-04-12
申请人： Issei Okada , Kohei Shimoda , Keiji Ebata , Takayuki Hirai
发明人： Issei Okada , Kohei Shimoda , Keiji Ebata , Takayuki Hirai
IPC分类号： G03F7/00
CPC分类号： G03F7/2053 , C23C18/14 , H05K1/097 , H05K3/02 , H05K2203/107 , H05K2203/1131
摘要： Fine wirings are made by a method having the steps of painting a board with metal dispersion colloid including metal nanoparticles of 0.5 nm-200 nm diameters, drying the metal dispersion colloid into a metal-suspension film, irradiating the metal-suspension film with a laser beam of 300 nm-550 nm wavelengths, depicting arbitrary patterns on the film with the laser beam, aggregating metal nanoparticles into larger conductive grains, washing the laser-irradiated film, eliminating unirradiated metal nanoparticles, and forming metallic wiring patterns built by the conductive grains on the board. The present invention enables an inexpensive apparatus to form fine arbitrary wiring patterns on boards without expensive photomasks, resists, exposure apparatus and etching apparatus. The method can make wirings also on plastic boards or low-melting-point glass boards which have poor resistance against heat and chemicals.
摘要翻译：通过具有以下步骤的方法制造细线，该方法包括用包含0.5nm-200nm直径的金属纳米颗粒的金属分散体胶体涂布板，将金属分散体胶体干燥成金属悬浮膜，用激光照射金属 - 悬浮膜 300nm-550nm波长的光束，用激光束描绘膜上的任意图案，将金属纳米颗粒聚集成更大的导电颗粒，洗涤激光照射的膜，消除未照射的金属纳米颗粒，以及形成由导电颗粒构成的金属布线图案在板上。本发明使得廉价的装置能够在没有昂贵的光掩模，抗蚀剂，曝光装置和蚀刻装置的板上形成精细的任意布线图案。该方法也可以在耐热和耐化学性差的塑料板或低熔点玻璃板上进行布线。

7. 发明授权

US07691175B2 Granular metal powder 失效
标题翻译：颗粒状金属粉末
公开(公告)号：US07691175B2
公开(公告)日：2010-04-06
申请号：US10575898
申请日：2004-06-24
申请人： Kohei Shimoda , Issei Okada , Masatoshi Majima
发明人： Kohei Shimoda , Issei Okada , Masatoshi Majima
IPC分类号： B22F1/00 , B22F9/24
CPC分类号： H01B1/22 , B01J13/0043 , B22F1/0096 , B22F2999/00 , B22F1/0018
摘要： When fine metal particles of a nanometer size are handled in a state of colloidal particles, it is difficult to handle them and the range of the selection of the solvent to be used is limited. The invention offers a granular metal powder that is produced by the steps of (a) preparing a suspension liquid comprising (a1) water, an organic solvent, or a mixture thereof, (a2) metal particles having an average particle diameter of at least 1 nm and at most 100 nm, and (a3) an organic compound capable of being adsorbed on the surface of the metal particles and (b) removing the water, organic solvent, or mixture thereof by drying the suspension liquid and that has an apparent density of at least 1.0 g/ml and at most 5.0 g/ml. The granular metal powder can be handled as a dry metal powder and is readily redispersed in a solvent.
摘要翻译：当以胶体颗粒的状态处理纳米尺寸的细金属颗粒时，难以处理它们，并且所使用的溶剂的选择范围受到限制。本发明提供一种颗粒状金属粉末，其通过以下步骤制备：（a）制备悬浮液体，所述悬浮液体包含（a1）水，有机溶剂或其混合物，（a2）平均粒径至少为1的金属颗粒 nm和至多100nm，和（a3）能够吸附在金属颗粒表面上的有机化合物和（b）通过干燥悬浮液除去水，有机溶剂或其混合物，并且具有表观密度至少1.0μg/ ml至多5.0μg/ ml。粒状金属粉末可以作为干金属粉末处理，并且容易地再分散在溶剂中。

8. 发明授权

US08507104B2 Metal coating, forming method thereof, and metal wiring 失效
公开(公告)号：US08507104B2
公开(公告)日：2013-08-13
申请号：US11662975
申请日：2006-05-17
申请人： Issei Okada , Kohei Shimoda
发明人： Issei Okada , Kohei Shimoda
IPC分类号： C22C5/06
CPC分类号： C23C24/08 , C22C5/06 , C23C24/00 , C23C26/00 , H01B1/02 , H01B1/22 , H05K1/097 , Y10T428/12 , Y10T428/12014 , Y10T428/24355 , Y10T428/24917
摘要： The present invention provides a metal coating formed by baking after applying a metal-nanoparticles-dispersed liquid onto a surface of a base material, the metal-nanoparticles-dispersed liquid being composed of metal nanoparticles, water, and a dispersant having a molecular weight of 2000-30000 and having a solid form at room temperature, wherein the metal coating comprises an alloy including (1) Ag and (2) at least one kind of metal selected from the group consisting of Au, Pt, Pd, Ru, Ir, Sn, Cu, Ni, Fe, Co, Ti and In, the content ratio of Ag being 80-99.9% by atomic percent in the total quantity of the alloy, and wherein the metal coating has an average grain size of 0.2-5 μm. The metal coating has small surface roughness, and superior smoothness and denseness, and has excellent properties for etching and adhesion to a base material. Also, the invention provides a method of forming such metal coating as well as a metal wiring formed by pattern formation of the metal coating.

9. 发明申请

US20110141654A1 NICKEL POWDER OR ALLOY POWDER COMPRISING NICKEL AS MAIN COMPONENT, METHOD FOR PRODUCING THE SAME, CONDUCTIVE PASTE AND LAMINATED CERAMIC CAPACITOR 审中-公开
标题翻译：镍粉或合金粉，包含镍作为主要成分，其生产方法，导电性浆料和层压陶瓷电容器
公开(公告)号：US20110141654A1
公开(公告)日：2011-06-16
申请号：US13059323
申请日：2009-06-26
申请人： Issei Okada
发明人： Issei Okada
IPC分类号： H01G4/30 , B22F1/00 , H01B1/22 , C22C19/03
CPC分类号： C22C19/03 , B22F1/0018 , B22F9/24 , B82Y30/00 , H01B1/02 , H01B1/22 , H01G4/0085 , H01G4/30
摘要： There are provided a nickel powder or an alloy powder comprising nickel as a main component, in which the nickel powder or the alloy powder has an average particle size D50 of 30 to 300 nm, a diffraction peak from the (111) plane of the nickel powder or the alloy powder measured by an X-ray diffraction method has a half width of 0.5° or less, and the ratio of a specific surface area A measured by a Brunauer-Emmett-Teller (BET) method to the theoretical value B of a specific surface area corresponding to the average particle size D50 of the nickel powder or the alloy powder is 3 or less, and a method for producing the nickel powder or the alloy powder. Furthermore, there are provided a conductive paste that contains an organic vehicle and the nickel powder or the alloy powder comprising nickel as a main component, the organic vehicle and the nickel powder or the alloy powder serving as main components, and a laminated ceramic capacitor that includes an internal electrode layer made from the conductive paste.
摘要翻译：提供镍粉或以镍为主要成分的合金粉末，其中镍粉或合金粉末的平均粒度D50为30〜300nm，来自镍的（111）面的衍射峰通过X射线衍射法测量的粉末或合金粉末的半宽度为0.5°以下，通过Brunauer-Emmett-Teller（BET）法测定的比表面积A与理论值B的比值与镍粉末或合金粉末的平均粒径D50对应的比表面积为3以下，以及镍粉末或合金粉末的制造方法。此外，提供了一种含有有机载体的导电性糊剂和以镍为主要成分的镍粉或合金粉末，有机载体和作为主要成分的镍粉或合金粉末，以及层叠陶瓷电容器包括由导电膏制成的内部电极层。

10. 发明申请

US20100003791A1 METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT COMPONENT 失效
标题翻译：制造电子电路元件的方法
公开(公告)号：US20100003791A1
公开(公告)日：2010-01-07
申请号：US12376334
申请日：2007-08-03
申请人： Shinichi Maeda , Go Ono , Issei Okada , Kohei Shimoda
发明人： Shinichi Maeda , Go Ono , Issei Okada , Kohei Shimoda
IPC分类号： H01L21/336
CPC分类号： H01L51/052 , H01L51/0022 , H01L51/0545
摘要： An object of the present invention is to provide a method for manufacturing an electronic circuit component such as an organic TFT 1, which can manufacture an electronic circuit component excellent in reliability and having quality on a practical level, because an insulating layer and a conductive layer which have more excellent characteristics can be formed, particularly, on a general-purpose plastic substrate or the like by treatment at a process temperature of 200° C. or lower which has no influence on the above-mentioned plastic substrate.The method for manufacturing an electronic circuit component according to the invention includes heating a layer containing at least one of a polyimide and a precursor thereof at a temperature of 200° C. or lower to form an insulating layer 4 having a contact angle with water of 80° or more, forming a coating film including a dispersion containing metal nanoparticles on the above-mentioned insulating layer 4 and heating the above-mentioned coating film at a temperature of 200° C. or lower to form a conductive layer such as a source layer 5 or a drain layer 6.
摘要翻译：本发明的目的是提供一种用于制造诸如有机TFT 1的电子电路部件的方法，其可以制造可靠性优异并且具有实用水平的质量的电子电路部件，因为绝缘层和导电层特别是通过在200℃以下的处理温度下对上述塑料基板没有影响的通用塑料基板等形成更优异的特性。根据本发明的电子电路部件的制造方法包括在200℃以下的温度下加热含有聚酰亚胺及其前体中的至少一种的层，形成与水的接触角的绝缘层4 80°以上，在上述绝缘层4上形成包含含有金属纳米颗粒的分散体的涂膜，并在200℃以下的温度下加热上述涂膜，形成导电层层5或漏层6。

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