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1. 发明授权

US07691175B2 Granular metal powder 失效
标题翻译：颗粒状金属粉末
公开(公告)号：US07691175B2
公开(公告)日：2010-04-06
申请号：US10575898
申请日：2004-06-24
申请人： Kohei Shimoda , Issei Okada , Masatoshi Majima
发明人： Kohei Shimoda , Issei Okada , Masatoshi Majima
IPC分类号： B22F1/00 , B22F9/24
CPC分类号： H01B1/22 , B01J13/0043 , B22F1/0096 , B22F2999/00 , B22F1/0018
摘要： When fine metal particles of a nanometer size are handled in a state of colloidal particles, it is difficult to handle them and the range of the selection of the solvent to be used is limited. The invention offers a granular metal powder that is produced by the steps of (a) preparing a suspension liquid comprising (a1) water, an organic solvent, or a mixture thereof, (a2) metal particles having an average particle diameter of at least 1 nm and at most 100 nm, and (a3) an organic compound capable of being adsorbed on the surface of the metal particles and (b) removing the water, organic solvent, or mixture thereof by drying the suspension liquid and that has an apparent density of at least 1.0 g/ml and at most 5.0 g/ml. The granular metal powder can be handled as a dry metal powder and is readily redispersed in a solvent.
摘要翻译：当以胶体颗粒的状态处理纳米尺寸的细金属颗粒时，难以处理它们，并且所使用的溶剂的选择范围受到限制。本发明提供一种颗粒状金属粉末，其通过以下步骤制备：（a）制备悬浮液体，所述悬浮液体包含（a1）水，有机溶剂或其混合物，（a2）平均粒径至少为1的金属颗粒 nm和至多100nm，和（a3）能够吸附在金属颗粒表面上的有机化合物和（b）通过干燥悬浮液除去水，有机溶剂或其混合物，并且具有表观密度至少1.0μg/ ml至多5.0μg/ ml。粒状金属粉末可以作为干金属粉末处理，并且容易地再分散在溶剂中。

2. 发明申请

US20070089565A1 Method of producing metal powder 有权
标题翻译：金属粉末生产方法
公开(公告)号：US20070089565A1
公开(公告)日：2007-04-26
申请号：US10559021
申请日：2004-12-08
申请人： Masatoshi Majima , Kohei Shimoda , Issei Okada , Masahiro Yamakawa , Takashi Kasuga
发明人： Masatoshi Majima , Kohei Shimoda , Issei Okada , Masahiro Yamakawa , Takashi Kasuga
IPC分类号： B22F9/24
CPC分类号： B22F9/24 , B22F1/0022 , B22F1/0096 , B82Y30/00 , H05K1/097 , H05K3/125
摘要： A method of producing metal powder by reducing ions of a metal for precipitation by performance of a reducing agent in a liquid-phase reaction system, wherein the metal is precipitated as metal powder particles by being reduced under conditions in which the exchange-current density of an oxidation-reduction reaction between the metal ions and the reducing agent is 100 μA/cm2 or less, the exchange-current density being determined by the mixed potential theory.
摘要翻译：一种通过在液相反应体系中还原剂的还原剂将金属离子还原析出而制造金属粉末的方法，其中金属通过在金属粉末颗粒的交换电流密度金属离子和还原剂之间的氧化还原反应为100μA/ cm 2以下，交换电流密度由混合势理论决定。

3. 发明授权

US08507104B2 Metal coating, forming method thereof, and metal wiring 失效
公开(公告)号：US08507104B2
公开(公告)日：2013-08-13
申请号：US11662975
申请日：2006-05-17
申请人： Issei Okada , Kohei Shimoda
发明人： Issei Okada , Kohei Shimoda
IPC分类号： C22C5/06
CPC分类号： C23C24/08 , C22C5/06 , C23C24/00 , C23C26/00 , H01B1/02 , H01B1/22 , H05K1/097 , Y10T428/12 , Y10T428/12014 , Y10T428/24355 , Y10T428/24917
摘要： The present invention provides a metal coating formed by baking after applying a metal-nanoparticles-dispersed liquid onto a surface of a base material, the metal-nanoparticles-dispersed liquid being composed of metal nanoparticles, water, and a dispersant having a molecular weight of 2000-30000 and having a solid form at room temperature, wherein the metal coating comprises an alloy including (1) Ag and (2) at least one kind of metal selected from the group consisting of Au, Pt, Pd, Ru, Ir, Sn, Cu, Ni, Fe, Co, Ti and In, the content ratio of Ag being 80-99.9% by atomic percent in the total quantity of the alloy, and wherein the metal coating has an average grain size of 0.2-5 μm. The metal coating has small surface roughness, and superior smoothness and denseness, and has excellent properties for etching and adhesion to a base material. Also, the invention provides a method of forming such metal coating as well as a metal wiring formed by pattern formation of the metal coating.

4. 发明申请

US20100184586A1 METAL CATALYST AND METHOD FOR PRODUCTION THEREOF 有权
标题翻译：金属催化剂及其生产方法
公开(公告)号：US20100184586A1
公开(公告)日：2010-07-22
申请号：US12686265
申请日：2010-01-12
申请人： Masatoshi MAJIMA , Kohei Shimoda , Kouji Yamaguchi
发明人： Masatoshi MAJIMA , Kohei Shimoda , Kouji Yamaguchi
IPC分类号： B01J23/00 , B01J23/42 , B01J37/34
CPC分类号： H01M4/90 , B01J23/42 , B01J35/0013 , B01J35/006 , B01J37/16 , H01M4/9083 , H01M4/92 , H01M4/926
摘要： The present invention relates to a metal catalyst containing fine metal particles, characterized in that the fine metal particles have a particle diameter of 3 nm or less and also have a proportion of metallic bond state of 40% or more, which is ascribed by subjecting to waveform separation of a binding energy peak peculiar to the metal as measured by using an X-ray photoelectron spectrometer. The fine metal particles are preferably fine platinum particles. The fine metal particles are preferably supported on the surface of carrier particles by reducing ions of metal to be deposited through the action of a reducing agent in a reaction system of a liquid phase containing the carrier particles dispersed therein, thereby to deposit the metal on the surface of carrier particles in the form of fine particles. The proportion of metallic bond state of the fine metal particles is adjusted within the above range by reducing after deposition thereby to decrease the oxidation state.
摘要翻译：本发明涉及含有金属微粒的金属催化剂，其特征在于，金属微粒的粒径为3nm以下，金属结合状态的比例为40％以上，这是通过使通过使用X射线光电子能谱仪测量的金属特有的结合能峰的波形分离。细金属颗粒优选为铂颗粒。金属颗粒优选通过在含有分散在其中的载体颗粒的液相的反应体系中通过还原剂的作用还原待沉积的金属离子而负载在载体颗粒的表面上，从而将金属沉积在载体颗粒表面呈细颗粒状。通过在沉积后减少，将金属微粒的金属结合状态的比例调节在上述范围内，从而降低氧化态。

5. 发明申请

US20100003791A1 METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT COMPONENT 失效
标题翻译：制造电子电路元件的方法
公开(公告)号：US20100003791A1
公开(公告)日：2010-01-07
申请号：US12376334
申请日：2007-08-03
申请人： Shinichi Maeda , Go Ono , Issei Okada , Kohei Shimoda
发明人： Shinichi Maeda , Go Ono , Issei Okada , Kohei Shimoda
IPC分类号： H01L21/336
CPC分类号： H01L51/052 , H01L51/0022 , H01L51/0545
摘要： An object of the present invention is to provide a method for manufacturing an electronic circuit component such as an organic TFT 1, which can manufacture an electronic circuit component excellent in reliability and having quality on a practical level, because an insulating layer and a conductive layer which have more excellent characteristics can be formed, particularly, on a general-purpose plastic substrate or the like by treatment at a process temperature of 200° C. or lower which has no influence on the above-mentioned plastic substrate.The method for manufacturing an electronic circuit component according to the invention includes heating a layer containing at least one of a polyimide and a precursor thereof at a temperature of 200° C. or lower to form an insulating layer 4 having a contact angle with water of 80° or more, forming a coating film including a dispersion containing metal nanoparticles on the above-mentioned insulating layer 4 and heating the above-mentioned coating film at a temperature of 200° C. or lower to form a conductive layer such as a source layer 5 or a drain layer 6.
摘要翻译：本发明的目的是提供一种用于制造诸如有机TFT 1的电子电路部件的方法，其可以制造可靠性优异并且具有实用水平的质量的电子电路部件，因为绝缘层和导电层特别是通过在200℃以下的处理温度下对上述塑料基板没有影响的通用塑料基板等形成更优异的特性。根据本发明的电子电路部件的制造方法包括在200℃以下的温度下加热含有聚酰亚胺及其前体中的至少一种的层，形成与水的接触角的绝缘层4 80°以上，在上述绝缘层4上形成包含含有金属纳米颗粒的分散体的涂膜，并在200℃以下的温度下加热上述涂膜，形成导电层层5或漏层6。

6. 发明授权

US07608203B2 Metallic colloidal solution and inkjet-use metallic ink 有权
标题翻译：金属胶体溶液和喷墨用金属油墨
公开(公告)号：US07608203B2
公开(公告)日：2009-10-27
申请号：US12195777
申请日：2008-08-21
申请人： Issei Okada , Kohei Shimoda
发明人： Issei Okada , Kohei Shimoda
IPC分类号： H01B1/00 , H01B1/22 , B22F7/00 , C09D5/00
CPC分类号： C09D11/322 , C09D11/52 , H01B1/22 , H05K1/097 , H05K3/1241
摘要： A metallic colloidal solution (a) includes a water-based dispersion medium that is easy in handling with regard to safety and environment and metallic particles having a uniform particle diameter and being excellent in properties such as conductivity and (b) has properties suitable for various printing methods and ink-applying methods. In addition, an inkjet-use metallic ink incorporating the metallic colloidal solution has properties suitable for the inkjet printing method. The metallic particles are deposited by reducing metallic ions in water and have a primary-particle diameter of at most 200 nm. The dispersion medium is made of a mixed solvent of water and a water-soluble organic solvent. The metallic particles are dispersed in the dispersion medium under the presence of a dispersant having a molecular weight of 200 to 30,000.
摘要翻译：金属胶体溶液（a）包括在安全性和环境方面易于处理的水性分散介质和具有均匀粒径并且导电性等优异的金属颗粒，（b）具有适合于各种印刷方法和涂墨方法。另外，结合有金属胶体溶液的喷墨用金属油墨具有适用于喷墨印刷法的特性。通过还原金属离子在水中沉积金属颗粒，其一次粒径至多为200nm。分散介质由水和水溶性有机溶剂的混合溶剂制成。金属颗粒在分子量为200至30,000的分散剂存在下分散在分散介质中。

7. 发明申请

US20090107707A1 Conductive Paste and Wiring Board Using It 有权
标题翻译：导电膏和接线板使用它
公开(公告)号：US20090107707A1
公开(公告)日：2009-04-30
申请号：US11887835
申请日：2006-05-22
申请人： Masahiro Yamakawa , Kohei Shimoda
发明人： Masahiro Yamakawa , Kohei Shimoda
IPC分类号： H05K1/09 , H01B1/02
CPC分类号： H01B1/16 , H05K1/092
摘要： A conductive paste is mainly composed of a metal powder, a glass frit, and an organic vehicle. The total content amount of the metal powder and glass frit with respect to the entire conductive paste is 85 wt % or more. The viscosity at a rotational speed of 1 rpm measured at 25° C. with an E type rotating viscometer is 100 Pa·s or more and 400 Pa·s or less.
摘要翻译：导电浆料主要由金属粉末，玻璃料和有机载体组成。金属粉末和玻璃料相对于整个导电浆料的总含量为85重量％以上。用E型旋转粘度计在25℃下测得的转速1rpm下的粘度为100Pa·s以上且400Pa·s以下。

8. 发明申请

US20080308001A1 METALLIC COLLOIDAL SOLUTION AND INKJET-USE METALLIC INK 有权
标题翻译：金属胶体溶液和喷墨用途金属墨水
公开(公告)号：US20080308001A1
公开(公告)日：2008-12-18
申请号：US12195777
申请日：2008-08-21
申请人： Issei OKADA , Kohei SHIMODA
发明人： Issei OKADA , Kohei SHIMODA
IPC分类号： C09D11/02
CPC分类号： C09D11/322 , C09D11/52 , H01B1/22 , H05K1/097 , H05K3/1241
摘要： A metallic colloidal solution (a) includes a water-based dispersion medium that is easy in handling with regard to safety and environment and metallic particles having a uniform particle diameter and being excellent in properties such as conductivity and (b) has properties suitable for various printing methods and ink-applying methods. In addition, an inkjet-use metallic ink incorporating the metallic colloidal solution has properties suitable for the inkjet printing method. The metallic particles are deposited by reducing metallic ions in water and have a primary-particle diameter of at most 200 nm. The dispersion medium is made of a mixed solvent of water and a water-soluble organic solvent. The metallic particles are dispersed in the dispersion medium under the presence of a dispersant having a molecular weight of 200 to 30,000.
摘要翻译：金属胶体溶液（a）包括在安全性和环境方面易于处理的水性分散介质和具有均匀粒径并且导电性等优异的金属颗粒，（b）具有适合于各种印刷方法和涂墨方法。另外，结合有金属胶体溶液的喷墨用金属油墨具有适用于喷墨印刷法的特性。通过还原金属离子在水中沉积金属颗粒，其一次粒径至多为200nm。分散介质由水和水溶性有机溶剂的混合溶剂制成。金属颗粒在分子量为200至30,000的分散剂存在下分散在分散介质中。

9. 发明授权

US07445731B2 Metallic colloidal solution and inkjet-use metallic ink 有权
标题翻译：金属胶体溶液和喷墨用金属油墨
公开(公告)号：US07445731B2
公开(公告)日：2008-11-04
申请号：US11067939
申请日：2005-03-01
申请人： Issei Okada , Kohei Shimoda
发明人： Issei Okada , Kohei Shimoda
IPC分类号： H01B1/02 , H01B1/08 , H01B1/12
CPC分类号： C09D11/322 , C09D11/52 , H01B1/22 , H05K1/097 , H05K3/1241
摘要： A metallic colloidal solution (a) includes a water-based dispersion medium that is easy in handling with regard to safety and environment and metallic particles having a uniform particle diameter and being excellent in properties such as conductivity and (b) has properties suitable for various printing methods and ink-applying methods. In addition, an inkjet-use metallic ink incorporating the metallic colloidal solution has properties suitable for the inkjet printing method. The metallic particles are deposited by reducing metallic ions in water and have a primary-particle diameter of at most 200 nm. The dispersion medium is made of a mixed solvent of water and a water-soluble organic solvent. The metallic particles are dispersed in the dispersion medium under the presence of a dispersant having a molecular weight of 200 to 30,000.
摘要翻译：金属胶体溶液（a）包括在安全性和环境方面易于处理的水性分散介质和具有均匀粒径并且导电性等优异的金属颗粒，（b）具有适合于各种印刷方法和涂墨方法。另外，结合有金属胶体溶液的喷墨用金属油墨具有适用于喷墨印刷法的特性。通过还原金属离子在水中沉积金属颗粒，其一次粒径至多为200nm。分散介质由水和水溶性有机溶剂的混合溶剂制成。金属颗粒在分子量为200至30,000的分散剂存在下分散在分散介质中。

10. 发明授权

US06585794B2 Nonwoven metal fabric and method of making same 有权
公开(公告)号：US06585794B2
公开(公告)日：2003-07-01
申请号：US09983872
申请日：2001-10-26
申请人： Kohei Shimoda , Toshiyasu Tsubouchi
发明人： Kohei Shimoda , Toshiyasu Tsubouchi
IPC分类号： B32B518
CPC分类号： C25D1/08 , B01D39/2086 , B22F3/002 , B22F9/16 , B22F2999/00 , C25D5/50 , D04H1/4234 , D04H1/4382 , D04H1/4391 , D04H1/70 , F01N3/022 , F01N2330/12 , Y02T10/20 , Y10S55/05 , Y10S264/48 , Y10T428/12444 , Y10T428/12479 , Y10T442/2475 , Y10T442/654 , Y10T442/655 , Y10T442/656 , Y10T442/657 , B22F1/004 , C25D7/00
摘要： The present invention provides a nonwoven metal fabric for various uses, such as a filter used for purification of exhaust gas from automobiles or semiconductor manufacturing gas, a catalyst carrier of fuel cell, and so forth, in which the corrosion resistance is improved without compromising the property in terms of pressure loss. The nonwoven metal fabric of the present invention is formed with the metal fibers wherein the relation of the fiber diameter Da at the surface part of the gas inlet side and the fiber diameter Db at the central part of the thickness direction is expressed as the equation Da≧1.5×Db and the fiber diameter Da at the surface part of the gas inlet side is not less than 15 &mgr;m and not more than 60 &mgr;m.

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