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    • 7. 发明申请
    • Electronic material composition, electronic product and method of using electronic material composition
    • 电子材料成分,电子产品及使用电子材料成分的方法
    • US20050167639A1
    • 2005-08-04
    • US10514499
    • 2004-01-29
    • Takuro HoshioTakahiro SamataKoichiro WadaHideki OgawaShigeru IshidaAtsushi Yamada
    • Takuro HoshioTakahiro SamataKoichiro WadaHideki OgawaShigeru IshidaAtsushi Yamada
    • C08K3/20C08G59/40C08G59/42C08K3/36C08L63/00H01F27/02H05K1/02H05K3/32H01C1/00
    • C08G59/4269H05K1/0233H05K3/321
    • Disclosed are an electronic material composition, an electronic device to be obtained through the employment of this electronic material composition, and a method of using this electronic material composition, wherein the electronic material composition is featured in that, even if the electronic material composition is employed as one-pack type, the changes with time of viscosity would be such that would not bring about any substantial problem in practical use, and even if the electronic material composition is exposed to fluctuations in ambient temperature, there is little possibility of generating cohesive failure or peeling fracture, thereby making it possible to enhance the handling properties of the electronic material composition in a packaging step without any possibility of giving damage to the external appearance and to prevent the deterioration of magnetic/electric properties that can be improved through the provision of a packaging body to an electronic device even if the content of an inorganic filler in a cured coated layer is increased. This electronic material composition comprises epoxy resin, and a terminal carboxylic group modified polyether compound acting as a curable component.
    • 公开了电子材料组合物,通过使用该电子材料组合物获得的电子装置以及使用该电子材料组合物的方法,其中电子材料组合物的特征在于,即使使用电子材料组合物 作为一包装型,粘度随时间的变化将不会在实际使用中产生任何实质性问题,并且即使电子材料组合物暴露于环境温度的波动,也几乎没有产生内聚力的可能性 或剥离断裂,从而可以在包装步骤中提高电子材料组合物的处理性能,而不会对外观造成损害,并且防止可通过提供以下方式改善的磁/电特性的劣化 电子设备的包装体即使c 固化涂层中的无机填料的增加。 该电子材料组合物包含环氧树脂和作为可固化组分的末端羧基改性聚醚化合物。