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1. 发明授权

US4906593A Method of producing a contact plug 失效
标题翻译：接触插头的制造方法
公开(公告)号：US4906593A
公开(公告)日：1990-03-06
申请号：US166832
申请日：1988-03-04
申请人： Yoshimi Shioya , Yuji Furumura , Yasushi Ohyama , Shin-ichi Inoue , Tsutomu Ogawa , Kiyoshi Watanabe , Hiroshi Goto
发明人： Yoshimi Shioya , Yuji Furumura , Yasushi Ohyama , Shin-ichi Inoue , Tsutomu Ogawa , Kiyoshi Watanabe , Hiroshi Goto
IPC分类号： H01L21/28 , H01L21/3205 , H01L21/768 , H01L29/45
CPC分类号： H01L21/76886 , H01L21/76877 , H01L21/76879 , H01L29/456 , H01L2924/0002 , Y10S148/02 , Y10S148/026
摘要： A method of producing a semiconductor device comprising the steps of: forming a window or contact hole in an insulating layer to expose a portion of a semiconductor substrate or a lower conductor line; forming semiconductor material (silicon) in the window; substituting the material with a metal (tungsten) by reaction of the semiconductor material with a metal compound (WF.sub.6 gas); and forming a conductor line over the metal within the window.
摘要翻译：一种制造半导体器件的方法，包括以下步骤：在绝缘层中形成窗口或接触孔以暴露半导体衬底或下导体线的一部分; 在窗户中形成半导体材料（硅）; 通过半导体材料与金属化合物（WF 6气体）的反应用金属（钨）代替材料; 并在窗内的金属上形成导线。

2. 发明授权

US08125069B2 Semiconductor device and etching apparatus 失效
标题翻译：半导体器件和蚀刻装置
公开(公告)号：US08125069B2
公开(公告)日：2012-02-28
申请号：US12830995
申请日：2010-07-06
申请人： Toshio Hayashi , Yasuhiro Morikawa , Michio Ishikawa , Yuji Furumura , Naomi Mura
发明人： Toshio Hayashi , Yasuhiro Morikawa , Michio Ishikawa , Yuji Furumura , Naomi Mura
IPC分类号： H01L23/48
CPC分类号： H01L21/31116 , H01L21/3081 , H01L21/31144 , H01L21/32139
摘要： A method for manufacturing a semiconductor device comprises dry-etching a thin film using a resist mask carrying patterns in which at least one of the width of each pattern and the space between neighboring two patterns ranges from 32 to 130 nm using a halogenated carbon-containing compound gas with the halogen being at least two members selected from the group consisting of F, I and Br. The ratio of at least one of I and Br is not more than 26% of the total amount of the halogen atoms as expressed in terms of the atomic compositional ratio to transfer the patterns onto the thin film. Such etching of a thin film avoids causing damage to the resist mask used. The resulting thin film carrying the transferred patterns is used as a mask for subjecting the underlying material to dry-etching.
摘要翻译：一种用于制造半导体器件的方法包括使用具有图案的抗蚀剂掩模对薄膜进行干法蚀刻，其中每个图案的宽度和相邻两个图案之间的空间中的至少一个范围为32至130nm，使用含卤素的具有卤素的复合气体是选自F，I和Br中的至少两种。 I和Br中的至少一个的比例不超过卤素原子总量的26％，如以将原料组成比转移到薄膜上的原子组成比来表示的。这种薄膜的蚀刻避免了对所使用的抗蚀剂掩模的损害。所得到的带有转印图案的薄膜用作对下面的材料进行干蚀刻的掩模。

3. 发明授权

US5103285A Silicon carbide barrier between silicon substrate and metal layer 失效
标题翻译：硅衬底和金属层之间的硅碳化物屏障
公开(公告)号：US5103285A
公开(公告)日：1992-04-07
申请号：US286611
申请日：1988-12-19
申请人： Yuji Furumura , Fumitake Mieno , Takashi Eshita , Kikuo Itoh , Masahiko Doki
发明人： Yuji Furumura , Fumitake Mieno , Takashi Eshita , Kikuo Itoh , Masahiko Doki
IPC分类号： H01L21/205 , H01L29/45 , H01L29/78
CPC分类号： H01L29/456
摘要： A silicon carbide layer between a silicon substrate or layer and a metal layer because silicon carbide has many properties similar to those of silicon, has a very slow diffusion rate of a metal through the silicon carbide, or prevents a diffusion of a metal into the silicon, and can be deposited by CVD, which has an advantage of a good coverage over a step portion such as a contact window.

4. 发明授权

US4876219A Method of forming a heteroepitaxial semiconductor thin film using amorphous buffer layers 失效
标题翻译：使用非晶缓冲层形成异质外延半导体薄膜的方法
公开(公告)号：US4876219A
公开(公告)日：1989-10-24
申请号：US318638
申请日：1989-03-03
申请人： Takashi Eshita , Fumitake Mieno , Yuji Furumura , Takuya Watanabe
发明人： Takashi Eshita , Fumitake Mieno , Yuji Furumura , Takuya Watanabe
IPC分类号： H01L21/20 , H01L21/205
CPC分类号： H01L21/0262 , H01L21/02381 , H01L21/02433 , H01L21/02463 , H01L21/02502 , H01L21/02507 , H01L21/02546 , H01L21/02658 , Y10S148/025 , Y10S148/072 , Y10S148/097 , Y10S148/154 , Y10S148/169 , Y10S438/933
摘要： A method of forming a semiconductor thin layer on a silicon substrate comprising the steps of depositing a first amorphous layer of a compound semiconductor (e.g., GaAs) on the silicon substrate, and growing a first epitaxial layer of the compound semiconductor on the amorphous layer, characterized in that the method comprises the steps of: after the epitaxial growth step, depositing a second amorphous layer of the compound semiconductor on the first epitaxial layer, and growing a second epitaxial layer of the compound semiconductor on the second amorphous layer. The obtained GaAs/Si substrate has a reduced dislocation density.

5. 发明授权

US08477072B2 Radio frequency (RF) particles 有权
标题翻译：射频（RF）粒子
公开(公告)号：US08477072B2
公开(公告)日：2013-07-02
申请号：US13414794
申请日：2012-03-08
申请人： Yuji Furumura
发明人： Yuji Furumura
IPC分类号： H01Q1/38
CPC分类号： H01Q9/27 , G06K19/072 , G06K19/07749 , G07D7/01 , H01Q1/2208 , H01Q9/16
摘要： The present disclosure generally describes radio frequency (RF) particles and an RF powder-containing base including a plurality of such RF particles. The RF particles may include an antenna element and an integrated circuit element coupled together by at least one interconnection. The base may be formed from sheet-like subjects, such as various kinds of cards, bills, and documents. Methods of forming the RF powder-containing base are also generally disclosed.
摘要翻译：本公开通常描述射频（RF）颗粒和包含多个这样的RF颗粒的含RF粉末的基底。 RF颗粒可以包括通过至少一个互连而耦合在一起的天线元件和集成电路元件。基部可以由片状物体形成，例如各种卡，票据和文件。通常还公开了形成含有RF粉末的基底的方法。

6. 发明授权

US08237622B2 Base sheet 有权
标题翻译：基板
公开(公告)号：US08237622B2
公开(公告)日：2012-08-07
申请号：US12521244
申请日：2007-12-14
申请人： Yuji Furumura , Naomi Mura , Shinji Nishihara , Katsuhiro Fujino , Katsuhiko Mishima , Susumu Kamihashi
发明人： Yuji Furumura , Naomi Mura , Shinji Nishihara , Katsuhiro Fujino , Katsuhiko Mishima , Susumu Kamihashi
IPC分类号： H01Q1/36
CPC分类号： H01Q21/29 , G06K19/07749 , G06K19/07756 , G06K19/07779 , G06K19/07783 , H01Q1/2208 , H01Q1/38 , H01Q7/00 , H01Q9/16 , H04B5/00 , H04B5/0081
摘要： A base sheet 12 has a structure that stably couples a particular chip measuring 1 mm or less on paper with an antenna line by only disposing the chip and antenna line in such a manner that the chip and antenna line are close to each other, without electrically bringing the chip and antenna line into contact with each other. The base sheet 12 includes a chip 11 having a spiral coil 13 with at least one turn disposed on a surface of the chip, or inside the chip and near the surface thereof and an antenna line 14 having a conductor part 14A orbiting around the coil 13A of the chip 11 or directly over or directly below the coil 13A so that the conductor part is magnetically coupled with the coil 13A. This base sheet has a structure that stably couples even a chip measuring 1 mm or less on paper or the like with an antenna line by only disposing the chip and antenna line in such a manner that the chip and antenna line are close to each other, without physically bringing the chip and antenna line into contact with each other.
摘要翻译：基片12具有这样的结构，即通过仅将芯片和天线线设置成使得芯片和天线线彼此靠近的方式，将纸上的1mm或更小的特定芯片与天线线连接，而无需电气使芯片和天线线路相互接触。基片12包括具有螺旋线圈13的芯片11，其具有设置在芯片的表面上或芯片内部并且在其表面附近的至少一个匝，以及具有围绕线圈13A绕行的导体部件14A的天线线路14 或者直接位于线圈13A的正上方，使得导体部分与线圈13A磁耦合。这种基片具有如下结构：通过仅使芯片和天线线路彼此靠近的方式设置芯片和天线线，即使将片状或1mm以下的芯片与天线相连，而不会使芯片和天线相互物理接触。

7. 发明授权

US08178415B2 Method for manufacturing RF powder 有权
标题翻译： RF粉末制造方法
公开(公告)号：US08178415B2
公开(公告)日：2012-05-15
申请号：US12516493
申请日：2007-11-26
申请人： Yuji Furumura , Naomi Mura , Shinji Nishihara , Katsuhiro Fujino , Katsuhiko Mishima , Susumu Kamihashi
发明人： Yuji Furumura , Naomi Mura , Shinji Nishihara , Katsuhiro Fujino , Katsuhiko Mishima , Susumu Kamihashi
IPC分类号： H01L21/00
CPC分类号： G06K19/07749 , G06K19/07775 , G06K19/07779 , H01Q1/2283 , H01Q7/005
摘要： A method for manufacturing RF powder wherein the RF powder is composed of a large amount of particles and used as collective RF powder (a powdery entity); and a large amount of RF powder particles can be obtained from a wafer in a stable manner and at a high yield is provided.The method for manufacturing RF powder is a method for manufacturing RF powder composed of a large amount of particles 11a each having a substrate 12 and a magnetic coupling circuit device 15. This method includes a step S11 of forming many antenna circuit devices 39 on a wafer 40; a gas dicing step S13 for drawing dicing grooves on a wafer to locate positions of separation of magnetic coupling circuit devices; a protection film formation step S14 for coating surrounding areas of the magnetic coupling circuit devices with a protection film; a reinforcement step S15 for attaching the wafer to a supporting plate using an adhesive sheet; a grinding step S16 for grinding the backside of the wafer until the dicing grooves are reached; and a separation step S17 for separating the circuit devices by removing the supporting plate.
摘要翻译：一种制造射频粉末的方法，其中RF粉末由大量的颗粒组成并用作集体RF粉末（粉末实体）; 并且可以以稳定的方式从晶片获得大量的RF粉末颗粒，并以高产率提供。 RF粉末的制造方法是由具有基板12和磁耦合电路装置15的大量的粒子11a构成的RF粉末的制造方法。该方法包括在晶片上形成许多天线电路装置39的工序S11 40; 用于在晶片上吸引切割槽的气体切割步骤S13，以定位磁耦合电路器件的分离位置; 保护膜形成步骤S14，用于用保护膜涂覆磁耦合电路装置的周围区域; 加强步骤S15，用于使用粘合片将晶片附着在支撑板上; 用于研磨晶片的背面直到达到切割槽的研磨步骤S16; 以及用于通过移除支撑板来分离电路装置的分离步骤S17。

8. 发明授权

US08154456B2 RF powder-containing base 有权
标题翻译：含RF粉末的基体
公开(公告)号：US08154456B2
公开(公告)日：2012-04-10
申请号：US12153662
申请日：2008-05-22
申请人： Yuji Furumura
发明人： Yuji Furumura
IPC分类号： H01Q1/38
CPC分类号： H01Q9/27 , G06K19/072 , G06K19/07749 , G07D7/01 , H01Q1/2208 , H01Q9/16
摘要： The present invention provides an RF powder-containing base including functional components, wherein forged cards, documents, bills, or the like are hard to be produced with respect to sheet-like subjects with high proprietary nature, such as various kinds of cards, bills, and securities, and each of a large number of particles can memorize information such as an identification number or the like. An RF powder-containing base 10 contains an RF powder (particles 11, 12, and 13), in which each particle of the RF powder provides an integrated circuit 15 formed on a substrate 14, an insulating layer 16 formed on the integrated circuit, and an antenna element 17 formed on the insulating layer, wherein each of the particles of the RF powder contained in the base has sensitivity to an electromagnetic waves having any of a plurality of different frequencies.
摘要翻译：本发明提供了一种包含功能部件的含RF粉末的基体，其中相对于具有高专利性的片状物体，如各种卡片，纸币，纸币，纸币等都难以制造伪造的卡片，文件，纸币等和证券，并且大量的粒子中的每一个可以记忆诸如识别号码等的信息。含RF粉末的基体10包含RF粉末（颗粒11,12和13），其中RF粉末的每个颗粒提供形成在基板14上的集成电路15，形成在集成电路上的绝缘层16，以及形成在所述绝缘层上的天线元件17，其中包含在所述基座中的所述RF粉末的每个颗粒对具有多个不同频率中的任何一个的电磁波具有敏感性。

9. 发明申请

US20110063184A1 BASE SHEET 有权
标题翻译：基片
公开(公告)号：US20110063184A1
公开(公告)日：2011-03-17
申请号：US12521244
申请日：2007-12-14
申请人： Yuji Furumura , Naomi Mura , Shinji Nishihara , Katsuhiro Fujino , Katsuhiko Mishima , Susumu Kamihashi
发明人： Yuji Furumura , Naomi Mura , Shinji Nishihara , Katsuhiro Fujino , Katsuhiko Mishima , Susumu Kamihashi
IPC分类号： H01Q1/50
CPC分类号： H01Q21/29 , G06K19/07749 , G06K19/07756 , G06K19/07779 , G06K19/07783 , H01Q1/2208 , H01Q1/38 , H01Q7/00 , H01Q9/16 , H04B5/00 , H04B5/0081
摘要： A base sheet 12 has a structure that stably couples a particular chip measuring 1 mm or less on paper with an antenna line by only disposing the chip and antenna line in such a manner that the chip and antenna line are close to each other, without electrically bringing the chip and antenna line into contact with each other. The base sheet 12 includes a chip 11 having a spiral coil 13 with at least one turn disposed on a surface of the chip, or inside the chip and near the surface thereof and an antenna line 14 having a conductor part 14A orbiting around the coil 13A of the chip 11 or directly over or directly below the coil 13A so that the conductor part is magnetically coupled with the coil 13A. This base sheet has a structure that stably couples even a chip measuring 1 mm or less on paper or the like with an antenna line by only disposing the chip and antenna line in such a manner that the chip and antenna line are close to each other, without physically bringing the chip and antenna line into contact with each other.
摘要翻译：基片12具有这样的结构，即通过仅将芯片和天线线设置成使得芯片和天线线彼此靠近的方式，将纸上的1mm或更小的特定芯片与天线线连接，而无需电气使芯片和天线线路相互接触。基片12包括具有螺旋线圈13的芯片11，其具有设置在芯片的表面上或芯片内部并且在其表面附近的至少一个匝，以及具有围绕线圈13A绕行的导体部件14A的天线线路14 或者直接位于线圈13A的正上方，使得导体部分与线圈13A磁耦合。这种基片具有如下结构：通过仅使芯片和天线线以芯片和天线线彼此接近的方式设置芯片和天线线，即使将片状或1mm以下的芯片与天线相连，而不会使芯片和天线相互物理接触。

10. 发明申请

US20100134122A1 Substrate, substrate holding apparatus, analysis apparatus, program, detection system, semiconductor device, display apparatus, and semiconductor manufacturing apparatus 有权
标题翻译：基板，基板保持装置，分析装置，程序，检测系统，半导体装置，显示装置和半导体制造装置
公开(公告)号：US20100134122A1
公开(公告)日：2010-06-03
申请号：US12592219
申请日：2009-11-19
申请人： Yuji Furumura , Naomi Mura , Koki Tamagawa , Tadayoshi Yoshikawa , Hiroshi Yonekura
发明人： Yuji Furumura , Naomi Mura , Koki Tamagawa , Tadayoshi Yoshikawa , Hiroshi Yonekura
IPC分类号： G01R27/28 , G01K7/00 , H02N2/00 , B05C13/00 , C23F1/08 , H01L29/66 , H01L29/82
CPC分类号： H01L21/67248 , G01K7/32 , G01K11/265 , H01J37/32935
摘要： A substrate including a sensor unit, wherein the sensor unit includes a coil wound at least once arranged on the surface of the sensor or embedded within and near the surface thereof. With such an arrangement, an electric current that corresponds to information with respect to the substrate flows through the coil.
摘要翻译：一种包括传感器单元的基板，其中传感器单元包括至少一次布置在传感器表面上或嵌入在其表面内和附近的线圈。通过这种布置，对应于相对于衬底的信息的电流流过线圈。

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