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1. 发明授权

US09255579B2 Vacuum pump having rotary compressing elements 有权
标题翻译：具有旋转压缩元件的真空泵
公开(公告)号：US09255579B2
公开(公告)日：2016-02-09
申请号：US13638472
申请日：2011-03-30
申请人： Yoshihiro Mitsuhashi , Katsunori Tanaka , Hiroyuki Murakami , Kouji Takahashi , Taku Kawakami , Ichiro Minato
发明人： Yoshihiro Mitsuhashi , Katsunori Tanaka , Hiroyuki Murakami , Kouji Takahashi , Taku Kawakami , Ichiro Minato
IPC分类号： F01C13/00 , F03C2/00 , F03C4/00 , F04C2/00 , F04D19/00 , F04C18/344 , F04C29/06 , F01C21/10 , F04C25/02
CPC分类号： F04C29/0078 , B60T13/52 , F01C21/10 , F01C21/104 , F04C18/3441 , F04C18/3448 , F04C25/02 , F04C29/0085 , F04C29/061 , F04C29/063 , F04C29/068 , F04C29/12 , F04C2220/10 , F04C2240/30 , F04C2240/50 , F04C2240/60 , F04C2240/802 , F04C2250/102 , F04D19/00 , F05C2251/044 , F05C2251/048
摘要： It is intended to provide a vacuum pump so that without upsizing the vacuum pump, noise and vibration are reduced, heat dissipation property is secured, and the casing is downsized. Therefore, at least one turning part is provided in an exhausting path formed in a casing body. The casing body is formed of a material whose thermal conductivity is higher than that of a rotor and vanes, and a cylinder part where the vanes slide is press fitted in the casing body.
摘要翻译：旨在提供真空泵，使得在不增大真空泵的同时，噪声和振动减小，确保散热性能，并且壳体尺寸减小。因此，至少一个转动部设置在形成在壳体内的排气路径中。壳体由导热率高于转子和叶片的材料形成，并且叶片滑动的圆筒部分压配合在壳体中。

2. 发明申请

US20130101412A1 VACUUM PUMP 有权
标题翻译：真空泵
公开(公告)号：US20130101412A1
公开(公告)日：2013-04-25
申请号：US13638472
申请日：2011-03-30
申请人： Yoshihiro Mitsuhashi , Katsunori Tanaka , Hiroyuki Murakami , Kouji Takahashi , Taku Kawakami , Ichiro Minato
发明人： Yoshihiro Mitsuhashi , Katsunori Tanaka , Hiroyuki Murakami , Kouji Takahashi , Taku Kawakami , Ichiro Minato
IPC分类号： F04D19/00
CPC分类号： F04C29/0078 , B60T13/52 , F01C21/10 , F01C21/104 , F04C18/3441 , F04C18/3448 , F04C25/02 , F04C29/0085 , F04C29/061 , F04C29/063 , F04C29/068 , F04C29/12 , F04C2220/10 , F04C2240/30 , F04C2240/50 , F04C2240/60 , F04C2240/802 , F04C2250/102 , F04D19/00 , F05C2251/044 , F05C2251/048
摘要： It is intended to provide a vacuum pump so that without upsizing the vacuum pump, noise and vibration are reduced, heat dissipation property is secured, and the casing is downsized. Therefore, at least one turning part is provided in an exhausting path formed in a casing body. The casing body is formed of a material whose thermal conductivity is higher than that of a rotor and vanes, and a cylinder part where the vanes slide is press fitted in the casing body.
摘要翻译：旨在提供真空泵，使得在不增大真空泵的同时，噪声和振动减小，确保散热性能，并且壳体尺寸减小。因此，至少一个转动部设置在形成在壳体内的排气路径中。壳体由导热率高于转子和叶片的材料形成，并且叶片滑动的圆筒部分压配合在壳体中。

3. 发明授权

US08928664B2 Graph creation method and graph creation device 有权
标题翻译：图形创建方法和图形创建设备
公开(公告)号：US08928664B2
公开(公告)日：2015-01-06
申请号：US12878165
申请日：2010-09-09
申请人： Yoshiya Hasegawa , Kouji Takahashi , Masamine Abe , Tomoyoshi Suzuki
发明人： Yoshiya Hasegawa , Kouji Takahashi , Masamine Abe , Tomoyoshi Suzuki
IPC分类号： G06T11/20 , G09G5/22 , G06Q10/08 , G06Q40/00 , G06Q40/08 , G06Q40/06 , G06Q30/00
CPC分类号： G06T11/206 , G06Q10/087 , G06Q30/00 , G06Q40/00 , G06Q40/06 , G06Q40/08
摘要： A graph creation method includes setting on a plane a coordinate system in which three axis extend from an origin in a radial fashion, setting three evaluation results of three evaluation item for an evaluation object on each the three axis; determining a balance being one of center, circumcenter, incenter, orthocenter, and excenter of a polygon the vertices of which correspond to the three evaluation results set on the three axis; and creating on the coordinate system a graph in which the balance is set.
摘要翻译：图形创建方法包括在平面上设置三轴从径向延伸的坐标系，在三轴上设定评价对象的三个评价项目的三个评价结果; 确定平衡是其顶点对应于在三轴上设置的三个评估结果的多边形的中心，外围中心，入口，正中心和偏心之一; 并在坐标系上创建平衡设置的图表。

4. 发明申请

US20100062173A1 THERMAL BARRIER COATING MATERIAL AND METHOD FOR PRODUCTION THEREOF, GAS TURBINE MEMBER USING THE THERMAL BARRIER COATING MATERIAL, AND GAS TURBINE 审中-公开
标题翻译：热障涂层材料及其制造方法，使用热障涂层材料的气体涡轮机构件和气体涡轮机
公开(公告)号：US20100062173A1
公开(公告)日：2010-03-11
申请号：US12617740
申请日：2009-11-13
申请人： Taiji Torigoe , Kazutaka Mori , Ikuo Okada , Sunao Aoki , Kouji Takahashi , Minoru Ohara , Takehiko Hirata , Hideaki Kaneko
发明人： Taiji Torigoe , Kazutaka Mori , Ikuo Okada , Sunao Aoki , Kouji Takahashi , Minoru Ohara , Takehiko Hirata , Hideaki Kaneko
IPC分类号： B05D1/08 , B05D3/06
CPC分类号： C23C4/18 , C23C4/073 , C23C4/11 , C23C28/3215 , C23C28/3455 , F01D5/288 , F05D2230/31 , F05D2230/311 , F05D2230/312 , F05D2230/40 , F05D2230/90 , F05D2300/2118
摘要： A thermal barrier coating material, containing a metal binding layer laminated on a base material and ceramic layer laminated on the metal binding layer, the ceramic layer comprising partially stabilized ZrO2 which is partially stabilized by additives of Dy2O3 and Yb2O3.
摘要翻译：一种热障涂层材料，其包含层叠在基底材料上的金属粘合层和层压在金属粘合层上的陶瓷层，陶瓷层包含部分稳定的ZrO 2，其部分被Dy2O3和Yb2O3的添加剂稳定。

5. 发明授权

US07417309B2 Circuit device and portable device with symmetrical arrangement 失效
标题翻译：具有对称布置的电路装置和便携式装置
公开(公告)号：US07417309B2
公开(公告)日：2008-08-26
申请号：US11320248
申请日：2005-12-27
申请人： Kouji Takahashi , Hideo Matsuki , Masami Ito , Naoyuki Aoki
发明人： Kouji Takahashi , Hideo Matsuki , Masami Ito , Naoyuki Aoki
IPC分类号： H01L23/02
CPC分类号： H01L21/4832 , H01L21/561 , H01L23/3107 , H01L23/49575 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2221/68377 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/83805 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01059 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H01L2224/85 , H01L2924/00 , H01L2924/01026 , H01L2924/00012 , H01L2224/05599
摘要： To provide a circuit device freed from constrains of a mounting direction. The circuit device according to the present invention includes: a conductive pattern for forming a die pad, a first bonding pad, and a second bonding pad; and a semiconductor element (TR) attached to the conductive pattern. The circuit device further includes: a sealing resin for covering the semiconductor element (TR) and the conductive pattern with a rear surface of the conductive pattern being exposed; and a coating resin for covering the rear surface of the conductive pattern exposed from the sealing resin. The rear surface of the conductive pattern is exposed from openings of the coating resin, and the openings are arranged with rotational symmetry about a central point of the circuit device.
摘要翻译：为了提供一个电路装置，不受安装方向的约束。根据本发明的电路装置包括：用于形成管芯焊盘的导电图案，第一焊盘和第二焊盘; 以及附接到导电图案的半导体元件（TR）。电路装置还包括：用于覆盖半导体元件（TR）的密封树脂和导电图案的背面露出的导电图案; 以及用于覆盖从密封树脂露出的导电图案的后表面的涂覆树脂。导电图案的后表面从涂覆树脂的开口露出，并且开口围绕电路装置的中心点以旋转对称的方式布置。

6. 发明申请

US20080076373A1 Wireless receiver apparatus provided with gain control amplifier 有权
标题翻译：具有增益控制放大器的无线接收装置
公开(公告)号：US20080076373A1
公开(公告)日：2008-03-27
申请号：US11905063
申请日：2007-09-27
申请人： Kouji Takahashi , Kosuke Ota
发明人： Kouji Takahashi , Kosuke Ota
IPC分类号： H04B1/06
CPC分类号： H03G3/3078
摘要： In a wireless receiver apparatus including a gain control amplifier for controlling a gain of a reception signal, a maintaining device compulsorily maintains the gain of the gain control amplifier at a predetermined fixed value only in a predetermined specified interval. The maintaining device includes a latch circuit for maintaining a gain set value immediately prior to the specified interval. A start timing of the specified interval is determined by an edge of a predetermined timer start signal, and a duration of the specified interval is determined on the basis of a count of a predetermined timer clock signal and a count of a predetermined timer count set bus signal.
摘要翻译：在包括用于控制接收信号的增益的增益控制放大器的无线接收机装置中，保持装置仅在预定的指定间隔内强制地将增益控制放大器的增益保持在预定的固定值。保持装置包括用于在紧接指定间隔之前维持增益设定值的锁存电路。指定间隔的开始定时由预定定时器启动信号的边缘确定，并且基于预定定时器时钟信号的计数和预定定时器计数总线的计数来确定指定间隔的持续时间信号。

7. 发明授权

US07276793B2 Semiconductor device and semiconductor module 失效
标题翻译：半导体器件和半导体模块
公开(公告)号：US07276793B2
公开(公告)日：2007-10-02
申请号：US11054025
申请日：2005-02-08
申请人： Noriaki Sakamoto , Yoshiyuki Kobayashi , Junji Sakamoto , Shigeaki Mashimo , Katsumi Okawa , Eiju Maehara , Kouji Takahashi
发明人： Noriaki Sakamoto , Yoshiyuki Kobayashi , Junji Sakamoto , Shigeaki Mashimo , Katsumi Okawa , Eiju Maehara , Kouji Takahashi
IPC分类号： H01L23/48
CPC分类号： H05K1/188 , H01L21/4821 , H01L21/4832 , H01L21/56 , H01L21/561 , H01L21/565 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L23/49575 , H01L23/49582 , H01L24/05 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/165 , H01L25/50 , H01L2221/68377 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05557 , H01L2224/05647 , H01L2224/16 , H01L2224/16245 , H01L2224/32057 , H01L2224/32245 , H01L2224/4807 , H01L2224/48091 , H01L2224/48247 , H01L2224/4845 , H01L2224/48464 , H01L2224/48465 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/83385 , H01L2224/85447 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01059 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/187 , H05K3/06 , H05K3/202 , H01L2224/85 , H01L2924/00012 , H01L2224/45099 , H01L2924/00 , H01L2924/01046 , H01L2924/3512
摘要： A semiconductor device is provided wherein conductive paths 40, formed of crystal that grows better along the X-Y axis than along the Z axis, are embedded in an insulating resin 44, and the back surface of the conductive path 40 is exposed through the insulating resin 44 and sealed. With this arrangement, fractures of the conductive paths 40 embedded in the insulating resin 44 are suppressed.
摘要翻译：提供一种半导体器件，其中由晶体形成的导电路径40沿着XY轴比沿着Z轴更好地嵌入绝缘树脂44中，并且导电路径40的背表面通过绝缘树脂44暴露并密封。通过这种布置，抑制了嵌入绝缘树脂44中的导电通路40的断裂。

8. 发明授权

US07271282B1 Dicarboxylic diester, process for producing the same, and refrigerating machine lubricating oil comprising the ester 有权
标题翻译：二羧酸二酯及其制造方法以及包含酯的制冷机润滑油
公开(公告)号：US07271282B1
公开(公告)日：2007-09-18
申请号：US10019287
申请日：2000-07-19
申请人： Yasuyuki Kawahara , Kouji Takahashi , Makiko Takii
发明人： Yasuyuki Kawahara , Kouji Takahashi , Makiko Takii
IPC分类号： C07C69/74 , C07C69/34 , C07C69/75
CPC分类号： C07C69/75 , C07C2601/14 , C07C2601/16 , C10M105/36 , C10M129/72 , C10M171/008 , C10M2207/282 , C10M2207/2825 , C10M2207/34 , C10M2211/022 , C10M2211/06 , C10N2240/00 , C10N2240/22 , C10N2240/30 , C10N2240/50 , C10N2240/52 , C10N2240/54 , C10N2240/56 , C10N2240/58 , C10N2240/60 , C10N2240/66
摘要： A diester represented by the formula wherein A represents a cyclohexane ring, cyclohexene ring or benzene ring, X is H or methyl group, RX and RY are the same or different and each is C3-C18 branched-chain alkyl group, C1-C18 straight-chain alkyl group, C2-C18 straight-chain alkenyl or C3-C10 cycloalkyl, provided that when A is a benzene ring, RX and RY are different from each other and —COORX and —COORY are attached to two adjacent carbon atoms of the benzene ring, and having the following properties: 1) a total acid number of 0.05 mgKOH/g or less, 2) a sulfated ash content of 10 ppm or less, 3) a sulfur content of 20 ppm or less, 4) a phosphorus content of 20 ppm or less, 5) a peroxide value of 1.0 meq/kg or less, 6) a carbonyl value of 10 or less; 7) a volume resistivity of 1×1011Ω·cm or more, 8) a hydroxyl value of 3 mgKOH/g or less, and 9) a water content of 100 ppm or less, a process for preparing the same and a refrigerator lubricating oil comprising the diester.
摘要翻译：由下式表示的二酯其中A表示环己烷环，环己烯环或苯环，X为H或甲基，R X和R Y相同或不同并且各自为C 3 -C 18支链烷基，C 1 -C 18直链烷基，C 2 -C 18直链烯基或C 3 -C 10环烷基，条件是当A为苯环时，R X' SUP>和R Y'彼此不同，-COOR X和-COOR Y连接到苯环的两个相邻碳原子上，具有以下特性：1）总酸值为0.05mgKOH / g以下，2）硫酸灰分含量为10ppm以下，3）硫含量为20ppm以下，4）磷含量 20ppm以下，5）过氧化值为1.0meq / kg以下，6）羰基值为10以下; 7）体积电阻率为1×10 11Ω或更大，8）羟值为3mgKOH / g以下，9）水含量为100ppm以下，制备方法和含有二酯的冰箱润滑油。

9. 发明授权

US07138296B2 Board for manufacturing a BGA and method of manufacturing semiconductor device using thereof 有权
标题翻译：制造BGA的板以及使用该半导体器件的制造方法
公开(公告)号：US07138296B2
公开(公告)日：2006-11-21
申请号：US10854946
申请日：2004-05-26
申请人： Noriaki Sakamoto , Yoshiyuki Kobayashi , Junji Sakamoto , Shigeaki Mashimo , Katsumi Okawa , Eiju Maehara , Kouji Takahashi
发明人： Noriaki Sakamoto , Yoshiyuki Kobayashi , Junji Sakamoto , Shigeaki Mashimo , Katsumi Okawa , Eiju Maehara , Kouji Takahashi
IPC分类号： H01L21/44
CPC分类号： H01L24/32 , H01L21/4832 , H01L21/561 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2221/68377 , H01L2224/05554 , H01L2224/16225 , H01L2224/16245 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/484 , H01L2224/48463 , H01L2224/48472 , H01L2224/48599 , H01L2224/48639 , H01L2224/48644 , H01L2224/48655 , H01L2224/48669 , H01L2224/48699 , H01L2224/48739 , H01L2224/48744 , H01L2224/48755 , H01L2224/48769 , H01L2224/49171 , H01L2224/73265 , H01L2224/83385 , H01L2224/85201 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/85469 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/10161 , H01L2924/14 , H01L2924/15183 , H01L2924/15184 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19043 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2224/81 , H01L2224/92247 , H01L2924/00 , H01L2924/01026 , H01L2924/00012
摘要： A method of manufacturing a semiconductor device is described. A board that includes a flat back face, corresponding to a resin sealing area, and a front face that has projections is provided. The projections are formed of a metal that is integral with the board and include (a) a bonding pad provided in an area surrounded by an area that contacts an upper die, (b) a wiring that is integrated with the bonding pad and which extends to a semiconductor element mounting area, and (c) an electrode provided in one body with the wiring. A semiconductor element is mounted on the semiconductor element area and electrically connected to the bonding pad. The board is placed on a lower die and resin is filled into a space formed by the board and upper die. The board is divided into multiple devices such that the projections are separated by removing the board exposed at the back face of the resin.
摘要翻译：对半导体装置的制造方法进行说明。提供了包括对应于树脂密封区域的平坦背面和具有突起的前表面的板。突起由与板成一体的金属形成，并且包括（a）设置在由与上模接触的区域包围的区域中的接合焊盘，（b）与焊盘一体化的布线，并且延伸涉及半导体元件安装区域，以及（c）在一个主体中设置有布线的电极。半导体元件安装在半导体元件区域上并电连接到接合焊盘。将板放在下模上，将树脂填充到由板和上模形成的空间中。板被分成多个装置，使得通过移除在树脂的背面露出的板来分离突起。

10. 发明申请

US20050146052A1 Semiconductor device and semiconductor module 失效
标题翻译：半导体器件和半导体模块
公开(公告)号：US20050146052A1
公开(公告)日：2005-07-07
申请号：US11054025
申请日：2005-02-08
申请人： Noriaki Sakamoto , Yoshiyuki Kobayashi , Junji Sakamoto , Shigeaki Mashimo , Katsumi Okawa , Eiju Maehara , Kouji Takahashi
发明人： Noriaki Sakamoto , Yoshiyuki Kobayashi , Junji Sakamoto , Shigeaki Mashimo , Katsumi Okawa , Eiju Maehara , Kouji Takahashi
IPC分类号： H01L21/48 , H01L21/56 , H01L21/98 , H01L23/31 , H01L23/495 , H01L25/10 , H01L25/16 , H05K1/18 , H05K3/06 , H05K3/20
CPC分类号： H05K1/188 , H01L21/4821 , H01L21/4832 , H01L21/56 , H01L21/561 , H01L21/565 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L23/49575 , H01L23/49582 , H01L24/05 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/165 , H01L25/50 , H01L2221/68377 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05557 , H01L2224/05647 , H01L2224/16 , H01L2224/16245 , H01L2224/32057 , H01L2224/32245 , H01L2224/4807 , H01L2224/48091 , H01L2224/48247 , H01L2224/4845 , H01L2224/48464 , H01L2224/48465 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/83385 , H01L2224/85447 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01059 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/187 , H05K3/06 , H05K3/202 , H01L2224/85 , H01L2924/00012 , H01L2224/45099 , H01L2924/00 , H01L2924/01046 , H01L2924/3512
摘要： A semiconductor device is provided wherein conductive paths 40, formed of crystal that grows better along the X-Y axis than along the Z axis, are embedded in an insulating resin 44, and the back surface of the conductive path 40 is exposed through the insulating resin 44 and sealed. With this arrangement, fractures of the conductive paths 40 embedded in the insulating resin 44 are suppressed.
摘要翻译：提供一种半导体器件，其中由晶体形成的导电路径40沿着XY轴比沿着Z轴更好地嵌入绝缘树脂44中，并且导电路径40的背表面通过绝缘树脂44暴露并密封。通过这种布置，抑制了嵌入绝缘树脂44中的导电通路40的断裂。

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