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1. 发明申请

US20050045309A1 Electronic apparatus 审中-公开
标题翻译：电子仪器
公开(公告)号：US20050045309A1
公开(公告)日：2005-03-03
申请号：US10791771
申请日：2004-03-04
申请人： Yoshihiro Kondo , Tsuyoshi Nakagawa
发明人： Yoshihiro Kondo , Tsuyoshi Nakagawa
IPC分类号： F28D15/00 , F28D15/02 , F28F7/00 , H01L23/427 , H01L23/46 , H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , H01L23/427 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： In an electronic apparatus, having a heat diffusion structure having high efficiency, for corresponding to small-sizing and high-performances of an electronic part therein, a liquid sealing portion is provide on a cover on a side of the electronic part, which builds up a water-cooling jacket attached on an upper portion of the electronic part. Further, within an inside of this liquid sealing portion, a heat diffusion plate is provided, extending from the vicinity of the center of the water-cooling jacket in zigzag manner. With this, heat generated from the electronic part can be spread all over the cover, as a whole, on the side of the electronic part, with an aid of the evaporation heat of the liquid. The heat spread can be transmitted into the cooling liquid circulating within a housing thereof, through liquid flow passages of the water-cooling jacket, thereby being radiated into the atmosphere from the portion having a large or wide heat radiation area of the housing. Further, the heat generated from the electronic parts can be further spread, up to the water-cooling jacket having a wide area.
摘要翻译：在具有高效率的热扩散结构的电子设备中，为了对应于其中的电子部件的小尺寸和高性能，在电子部件的一侧的盖上提供液体密封部分，该盖子积聚附着在电子部件的上部的水冷套管。此外，在该液体密封部的内部设置有散热板，其以锯齿形的方式从水冷套的中心附近延伸。由此，借助于液体的蒸发热量，电子部件产生的热可以整体覆盖整个电子部件的一侧。散热可以通过水冷套管的液流通道传递到在其外壳内循环的冷却液，从而从具有大的或宽的散热区域的部分辐射到大气中。此外，从电子部件产生的热量可以进一步扩展，直到具有广泛面积的水冷套管。

2. 发明授权

US06449149B1 Electronic equipment 失效
标题翻译：电子设备
公开(公告)号：US06449149B1
公开(公告)日：2002-09-10
申请号：US09057339
申请日：1998-04-09
申请人： Shigeo Ohashi , Takashi Naganawa , Tadakatsu Nakajima , Tsuyoshi Nakagawa , Masaaki Eishima , Yoshihiro Kondo
发明人： Shigeo Ohashi , Takashi Naganawa , Tadakatsu Nakajima , Tsuyoshi Nakagawa , Masaaki Eishima , Yoshihiro Kondo
IPC分类号： G06F116
CPC分类号： G06F1/203 , G06F2200/203
摘要： An electronic equipment includes a first casing on which are mounted a keyboard and a wiring board and a second casing which is rotatably mounted on the first casing by means of a hinge. The cooling structure of the electronic equipment includes one or more elements that is the subject of cooling arranged within the first casing, a first heat-discharging member thermally connected with this element and the first casing, a second heat-discharging member that is arranged in the interior of the second casing, and connection means for thermally connecting the first heat-discharging element and the second heat-discharging element.
摘要翻译：电子设备包括：第一壳体，其上安装有键盘和布线板;第二壳体，其通过铰链可旋转地安装在第一壳体上。电子设备的冷却结构包括作为第一壳体内的冷却对象的一个或多个元件，与该元件和第一壳体热连接的第一加热排放构件，第二加热排出构件，其布置在第二壳体的内部和用于热连接第一散热元件和第二散热元件的连接装置。

3. 发明授权

US07050299B2 Electronic equipment 有权
标题翻译：电子设备
公开(公告)号：US07050299B2
公开(公告)日：2006-05-23
申请号：US10962472
申请日：2004-10-13
申请人： Yoshihiro Kondo , Shigeo Ohashi , Rintaro Minamitani , Takashi Naganawa , Yuji Yoshitomi , Masato Nakanishi , Yasuhiko Sasaki , Tsuyoshi Nakagawa , Osamu Suzuki , Shinji Matsushita , Yasunori Yamada
发明人： Yoshihiro Kondo , Shigeo Ohashi , Rintaro Minamitani , Takashi Naganawa , Yuji Yoshitomi , Masato Nakanishi , Yasuhiko Sasaki , Tsuyoshi Nakagawa , Osamu Suzuki , Shinji Matsushita , Yasunori Yamada
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , G06F1/20 , G06F2200/201
摘要： An electronic module which is detachably mounted on electronic equipment. The electronic module includes a board having a heat generator mounted on a surface thereof, and a cooling jacket which is integrally attached to the electronic module. The cooling jacket is thermally coupled to the heat generator and has a passage of a cooling fluid therewithin.
摘要翻译：一种可拆卸地安装在电子设备上的电子模块。电子模块包括安装在其表面上的具有发热体的板和与电子模块一体地连接的冷却套。冷却套与热发生器热耦合，并且在其中具有冷却流体的通道。

4. 发明授权

US06972954B2 Liquid cooling system and personal computer using the same 失效
标题翻译：液体冷却系统和个人电脑使用相同
公开(公告)号：US06972954B2
公开(公告)日：2005-12-06
申请号：US11079264
申请日：2005-03-15
申请人： Rintaro Minamitani , Makoto Kitano , Noriyuki Ashiwake , Shigeo Ohashi , Yoshihiro Kondo , Takashi Naganawa , Yuji Yoshitomi , Tsuyoshi Nakagawa
发明人： Rintaro Minamitani , Makoto Kitano , Noriyuki Ashiwake , Shigeo Ohashi , Yoshihiro Kondo , Takashi Naganawa , Yuji Yoshitomi , Tsuyoshi Nakagawa
IPC分类号： F28D15/02 , F01P11/06 , G06F1/20 , H01L23/473 , H05K7/20
CPC分类号： G06F1/203 , F01P2011/066 , F28D15/0266 , G06F2200/201 , Y10S165/905
摘要： A liquid cooling system which is utilizable in a personal computer includes a pump for supplying a cooling liquid; a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a passage for circulating the cooling liquid passing through the heat radiation pipe into the pump. The heat radiation pipe is made of material having a corrosion resistance that is higher than that of the heat receiving jacket.
摘要翻译：可用于个人计算机的液体冷却系统包括用于供应冷却液的泵; 提供有冷却液并被定位成接收从发热体产生的热量的热接收套管，用于散发由通过热接收套的冷却液供给的热量的散热管，以及用于使冷却液循环的通道通过热辐射管进入泵。散热管由具有高于受热护套的耐腐蚀性的材料制成。

5. 发明申请

US20050007730A1 Electronic apparatus 审中-公开
标题翻译：电子仪器
公开(公告)号：US20050007730A1
公开(公告)日：2005-01-13
申请号：US10239156
申请日：2002-07-10
申请人： Shigeo Ohashi , Yoshihiro Kondo , Rintaro Minamitani , Takashi Naganawa , Yuuji Yoshitomi , Masato Nakanishi , Yasuhiko Sasaki , Tsuyoshi Nakagawa
发明人： Shigeo Ohashi , Yoshihiro Kondo , Rintaro Minamitani , Takashi Naganawa , Yuuji Yoshitomi , Masato Nakanishi , Yasuhiko Sasaki , Tsuyoshi Nakagawa
IPC分类号： G06F1/20 , H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , G06F1/203 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： In the structure of an electronic apparatus, in which cooling of an heat-generating element is achieved through circulation of a liquid, in particular, for providing the structure of being high in cooling performance and reliability, wherein a heat-radiation pipe 9 is connected to a heat-radiation plate 10 disposed in a rear surface of a display 2, while thermally connecting a water-cooling jacket 8 with the heat-generating element 7, thereby circulating a coolant liquid between the water-cooling jacket 8 and the heat-radiation pipe 9 by means of a liquid driving device 11. The water-cooling jacket 8 can be formed in one body of a jacket base and a flow passage therein through the die-cast forming thereof, or can be constructed in one body with the water-cooling jacket and the flow passage of piping, through connection between the jacket base and the metal pipe.
摘要翻译：在通过液体循环实现发热元件的冷却的电子设备的结构中，特别是为了提供冷却性能和可靠性高的结构，其中连接有散热管9 到设置在显示器2的后表面中的散热板10，同时将水冷套8与发热元件7热连接，从而使冷却液在水冷套8和热水套8之间循环。辐射管9通过液体驱动装置11形成。水冷套8可以通过其压铸成型形成在套管基体的一个主体和流动通道中，或者可以在一个主体中与水冷套管和管道的通道，通过护套底座和金属管之间的连接。

6. 发明授权

US06809927B2 Liquid circulation cooling system for electronic apparatus 失效
标题翻译：电子仪器液体循环冷却系统
公开(公告)号：US06809927B2
公开(公告)日：2004-10-26
申请号：US10239141
申请日：2003-05-09
申请人： Shigeo Ohashi , Yoshihiro Kondo , Rintaro Minamitani , Takashi Naganawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou , Tsuyoshi Nakagawa
发明人： Shigeo Ohashi , Yoshihiro Kondo , Rintaro Minamitani , Takashi Naganawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou , Tsuyoshi Nakagawa
IPC分类号： H05K720
CPC分类号： G06F1/203 , F28F1/22 , G06F2200/201 , G06F2200/203
摘要： In the structure of an electronic apparatus, in which cooling of an heat-generating element is conducted through circulation of a liquid, in particular, for providing a liquid-cooling structure of being high in reliability, while also considering safety and assembling property into the consideration, wherein a water-cooling jacket 8 is thermally connected with a heat-generating element 7, while thermally connecting a heat-radiation pipe 9 with a heat-radiation plate 10 provided on a rear surface of a display 2, wherein a coolant liquid is circulated between the water-cooling jacket 8 and the heat-radiation pipe 9, by means of a liquid driving device 11. The heat-radiation pipe 9 is connected onto a whole area of the heat-radiation plate, like crawling thereupon. A tank 14 is provided in an upper portion of the heat-radiation plate 10, and is connected with the heat-radiation pipe 9.
摘要翻译：在通过液体循环进行发热元件的冷却的电子设备的结构中，特别是用于提供可靠性高的液冷结构，同时考虑到安全性和组装性能考虑到其中水冷套8与发热元件7热连接，同时将热辐射管9与设置在显示器2的后表面上的散热板10热连接，其中冷却剂液体通过液体驱动装置11在水冷套管8和散热管9之间循环。散热管9连接到散热板的整个区域上，就像在其上爬行一样。在散热板10的上部设有槽14，与散热管9连接。

7. 发明授权

US06808014B2 Cooling device of electronic apparatus 有权
公开(公告)号：US06808014B2
公开(公告)日：2004-10-26
申请号：US10426719
申请日：2003-05-01
申请人： Rintaro Minamitani , Shigeo Ohashi , Yoshihiro Kondo , Yuji Yoshitomi , Takashi Naganawa , Masato Nakanishi , Tsuyoshi Nakagawa
发明人： Rintaro Minamitani , Shigeo Ohashi , Yoshihiro Kondo , Yuji Yoshitomi , Takashi Naganawa , Masato Nakanishi , Tsuyoshi Nakagawa
IPC分类号： F28F700
CPC分类号： G06F1/203 , F28D15/0266 , G06F2200/201
摘要： A cooling device for an electronic apparatus, comprising: a heat generating element attached within a first housing; a heat receiving jacket, being connected with said heat generating element, and being attached within said first housing; a second housing being rotatably supported on said first housing; a first heat exchanger attached within said second housing, for exchanging heat between an outside; and a liquid driving means for supplying a cooling liquid to said heat receiving jacket, wherein a portion of a pipe for connecting between said heat receiving means, said first heat exchanger, and said liquid driving means is made of a flexible tube made of a resin, and further wherein, a second heat exchanger and an ion exchanger are provided in a part of said pipe, said second housing is received within said second housing, and said ion exchanger is received within said second housing.

8. 发明授权

US06741464B2 Liquid cooling system and personal computer using thereof 失效
标题翻译：液体冷却系统及其使用的个人计算机
公开(公告)号：US06741464B2
公开(公告)日：2004-05-25
申请号：US09921925
申请日：2001-08-06
申请人： Makoto Kitano , Takashi Naganawa , Yuji Yoshitomi , Rintaro Minamitani , Shigeo Ohashi , Noriyuki Ashiwake , Yoshihiro Kondo , Tsuyoshi Nakagawa
发明人： Makoto Kitano , Takashi Naganawa , Yuji Yoshitomi , Rintaro Minamitani , Shigeo Ohashi , Noriyuki Ashiwake , Yoshihiro Kondo , Tsuyoshi Nakagawa
IPC分类号： G06F120
CPC分类号： G06F1/203 , G06F2200/201 , G06F2200/203
摘要： A liquid cooling system for cooling a high heat generating body, such as a semiconductor element or the like, of the type used in an electronic apparatus that is small and thin in size, or in a personal computer equipped with such a structure therein. The system has a pump of the reciprocal movement type, a heat receiving jacket, a heat radiation pipe, and a connector pipe for connecting those parts with one another so as to form a closed loop filled with a cooling liquid. In the system, &Dgr;Vs is equal to or greater than &Dgr;Vp, wherein the inner volume change when the pump emits pulsation therefrom is &Dgr;Vp, the pressure caused by the volume change is P, and the volume change due to the pressure P that occurs in flow passage of the cooling liquid &Dgr;Vp other than within the pump, is &Dgr;Vs.
摘要翻译：一种液体冷却系统，用于冷却尺寸小的电子设备中使用的类型的诸如半导体元件等的高发热体或在其中配备有这种结构的个人计算机中的类型。该系统具有往复运动型泵，热接收套管，散热管和用于将这些部件彼此连接的连接管，以便形成填充有冷却液体的闭合回路。在该系统中，DeltaV等于或大于DeltaVp，其中当泵从其发出脉动时的内部体积变化为DeltaVp，由体积变化引起的压力为P，并且由于在流动中发生的压力P导致的体积变化冷却液通道DeltaVp除泵内外，均为DeltaVs。

9. 发明授权

US5805417A Heat dissipation structure in a portable computer including a heat dissipation block extending from a heat dissipation plate through a first circuit board to a CPU on a second circuit board 失效
标题翻译：一种便携式计算机中的散热结构，包括从散热板通过第一电路板延伸到第二电路板上的CPU的散热块
公开(公告)号：US5805417A
公开(公告)日：1998-09-08
申请号：US728171
申请日：1996-10-09
申请人： Tsuyoshi Nakagawa , Yasushi Neho , Naoyuki Sakamoto , Shigeo Ohashi , Yoshito Ohmura , Yukiko Iwama , Tadakatsu Nakajima , Yoshihiro Kondo , Susumu Iwai , Hitoshi Matsushima
发明人： Tsuyoshi Nakagawa , Yasushi Neho , Naoyuki Sakamoto , Shigeo Ohashi , Yoshito Ohmura , Yukiko Iwama , Tadakatsu Nakajima , Yoshihiro Kondo , Susumu Iwai , Hitoshi Matsushima
IPC分类号： G06F1/20 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/36 , H05K7/20
CPC分类号： G06F1/203 , H05K1/141 , H05K1/0203 , H05K1/0204 , H05K1/182 , H05K2201/066 , H05K2201/09054 , H05K2201/09072 , H05K3/368
摘要： A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case. In addition, another heat dissipation block is interposed between a keyboard and the daughter board so that another heat dissipation path can be formed through the central processing unit, another heat dissipation block, another heat dissipation plate, and the keyboard. A heat pipe may be connected to a heat dissipation plate.
摘要翻译：个人计算机包括安装在其壳体的地板上的散热板，与散热板隔开预定距离的母板和设置成使得主板位于散热板和女儿板。子板安装有产生热量的中央处理单元。主板上有一个孔。散热块从散热板延伸穿过主板的孔，并通过导热耦合器连接到中央处理单元。这形成了通过中央处理单元，散热块，散热板和壳体的散热路径。此外，在键盘和子板之间插入另一个散热块，从而可以通过中央处理单元，另一个散热块，另一个散热板和键盘形成另一个散热路径。热管可以连接到散热板。

10. 发明申请

US20050180108A1 Electronic apparatus 审中-公开
标题翻译：电子仪器
公开(公告)号：US20050180108A1
公开(公告)日：2005-08-18
申请号：US11108707
申请日：2005-04-19
申请人： Yoshihiro Kondo , Shinji Matsushita , Shigeo Ohashi , Takashi Naganawa , Rintaro Minamitani , Tsuyoshi Nakagawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou
发明人： Yoshihiro Kondo , Shinji Matsushita , Shigeo Ohashi , Takashi Naganawa , Rintaro Minamitani , Tsuyoshi Nakagawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou
IPC分类号： G06F1/20 , H01L23/473 , H05K7/20
CPC分类号： G06F1/203 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An electronic apparatus includes a case mounting a semiconductor element therein, a heat-receiving member thermally connected with the semiconductor element, a heat-radiation member disposed on an inner side surface of the case, and a liquid driver which drives a liquid coolant between the heat-radiation member and the heat-receiving member. The apparatus further includes a tank accumulating the liquid coolant therein and having at least a predetermined volume of the coolant to delimit a coolant surface within the tank. The tank, the heat-radiation member and the heat-receiving member are connected with tubes, and a suction end portion of a suction pipe connected into the tank is located at a position which is always below the coolant surface irrespective of change of position of the tank.
摘要翻译：一种电子设备，包括：将半导体元件安装在其中的壳体，与半导体元件热连接的受热部件，设置在壳体的内侧表面上的散热部件，以及驱动液体冷却剂热辐射部件和受热部件。该装置还包括在其中积聚液体冷却剂的罐，并且具有至少预定体积的冷却剂以限定罐内的冷却剂表面。容器，散热构件和受热构件与管连接，并且连接到容器中的吸入管的吸入端部位于始终低于冷却剂表面的位置，而与位置的变化无关坦克。

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