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1. 发明授权

US07151385B2 Contact probe, method of manufacturing the contact probe, and device and method for inspection 有权
标题翻译：接触式探头，接触式探针的制造方法，检测装置及方法
公开(公告)号：US07151385B2
公开(公告)日：2006-12-19
申请号：US10470399
申请日：2002-01-22
申请人： Yoshihiro Hirata , Tsuyoshi Haga , Toshiyuki Numazawa , Kazuo Nakamae , Kazunori Okada , Jun Yorita
发明人： Yoshihiro Hirata , Tsuyoshi Haga , Toshiyuki Numazawa , Kazuo Nakamae , Kazunori Okada , Jun Yorita
IPC分类号： G01R31/02 , H01K3/10
CPC分类号： G01R1/06733 , G01R1/06738 , G01R1/06755 , G01R3/00 , Y10T29/49117 , Y10T29/49204
摘要： A method of manufacturing a contact probe includes an electroforming step of, using a resist film (522) arranged on a substrate (521) as a pattern frame having a shape corresponding to a contact probe, performing electroforming to fill a gap in the resist film (522) to form a metal layer (526), a tip end shaping step of obliquely removing and sharpening that part of the metal layer (526) which serves as a tip end portion of the contact probe, and a take-out step of taking out only the metal layer (526) from the pattern frame.
摘要翻译：制造接触探针的方法包括：电铸步骤，使用布置在基板（521）上的抗蚀剂膜（522）作为具有与接触探针对应的形状的图案框架，进行电铸以填充抗蚀剂膜的间隙（522），以形成金属层（526）;顶端成形步骤，用于倾斜和磨削用作接触探针的顶端部分的金属层（526）的该部分，以及取出步骤仅从图案框架中取出金属层（526）。

2. 发明申请

US20060255815A1 Contact probe and method of manufacturing the same and test apparatus and test method 审中-公开
标题翻译：接触式探头及其制造方法及试验装置及试验方法
公开(公告)号：US20060255815A1
公开(公告)日：2006-11-16
申请号：US11472621
申请日：2006-06-21
申请人： Yoshihiro Hirata , Tsuyoshi Haga , Toshiyuki Numazawa , Kazuo Nakamae , Kazunori Okada , Jun Yorita
发明人： Yoshihiro Hirata , Tsuyoshi Haga , Toshiyuki Numazawa , Kazuo Nakamae , Kazunori Okada , Jun Yorita
IPC分类号： G01R31/02
CPC分类号： G01R1/06733 , G01R1/06738 , G01R1/06755 , G01R3/00 , Y10T29/49117 , Y10T29/49204
摘要： A method of manufacturing a contact probe includes an electroforming step of, using a resist film (522) arranged on a substrate (521) as a pattern frame having a shape corresponding to a contact probe, performing electroforming to fill a gap in the resist film (522) to form a metal layer (526), a tip end shaping step of obliquely removing and sharpening that part of the metal layer (526) which serves as a tip end portion of the contact probe, and a take-out step of taking out only the metal layer (526) from the pattern frame.
摘要翻译：制造接触探针的方法包括：电铸步骤，使用布置在基板（521）上的抗蚀剂膜（522）作为具有与接触探针对应的形状的图案框架，进行电铸以填充抗蚀剂膜的间隙（522），以形成金属层（526）;顶端成形步骤，用于倾斜和磨削用作接触探针的顶端部分的金属层（526）的该部分，以及取出步骤仅从图案框架中取出金属层（526）。

3. 发明授权

US07105281B2 Method for manufacturing metal microstructure 失效
标题翻译：制造金属微观结构的方法
公开(公告)号：US07105281B2
公开(公告)日：2006-09-12
申请号：US10492918
申请日：2002-10-25
申请人： Jun Yorita , Yoshihiro Hirata , Tsuyoshi Haga
发明人： Jun Yorita , Yoshihiro Hirata , Tsuyoshi Haga
IPC分类号： G03F7/039
CPC分类号： B81C99/0085 , B81C2201/032 , C25D1/003 , H01L21/4821 , H05K3/202 , H05K3/205
摘要： A method of manufacturing a metal microstructure by using a resin mold. In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold can be set and the high-precision metal microstructure can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure according to the present invention includes the steps of: fixing on a conductive substrate the resin mold having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure having the resin mold; exposing the layered structure having the resin mold to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer existing at the vacant portion of the resin mold; and filling with a metal the vacant portion of the layered structure having the resin mold by electroforming.
摘要翻译：通过使用树脂模具制造金属微结构的方法。为了提供一种可以设定对树脂模具造成较小损害的温和制造条件并且通过均匀电铸可以大量生产高精度金属微结构的方法，根据本发明的金属组织的制造方法本发明包括以下步骤：通过插入具有由电子束，紫外线或可见光辐照的化学组成改变的光敏聚合物，将具有穿透厚度方向的空白部分的树脂模具固定在导电基板上，以形成具有树脂模具的层状结构; 将具有树脂模具的层状结构暴露于电子束，紫外线辐射或可见光辐射; 去除存在于树脂模具的空缺部分的曝光的光敏聚合物; 并通过电铸将金属填充到具有树脂模具的层状结构的空
间部分。

4. 发明授权

US07338753B2 Method for manufacturing metal microstructure 失效
标题翻译：制造金属微观结构的方法
公开(公告)号：US07338753B2
公开(公告)日：2008-03-04
申请号：US11503303
申请日：2006-08-14
申请人： Jun Yorita , Yoshihiro Hirata , Tsuyoshi Haga
发明人： Jun Yorita , Yoshihiro Hirata , Tsuyoshi Haga
IPC分类号： G03F7/039
CPC分类号： B81C99/0085 , B81C2201/032 , C25D1/003 , H01L21/4821 , H05K3/202 , H05K3/205
摘要： A method of manufacturing a metal microstructure (1) by using a resin mold (13). In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold (13) can be set and the high-precision metal microstructure (1) can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure (1) according to the present invention includes the steps of: fixing on a conductive substrate (11) the resin mold (13) having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer (12) having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure (2) having the resin mold (13); exposing the layered structure (2) having the resin mold (13) to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer (12c) existing at the vacant portion of the resin mold (13); and filling with a metal (14) the vacant portion of the layered structure (2) having the resin mold (13) by electroforming.
摘要翻译：一种通过使用树脂模具（13）制造金属微结构（1）的方法。为了提供可以设定对树脂模具（13）造成较小损害的温和制造条件并且可以通过均匀电铸来大量生产高精度金属微结构（1）的方法，制造根据本发明的金属微结构（1）包括以下步骤：通过插入具有一个或多个金属微结构（1）的光敏聚合物（12）将具有穿过厚度方向的空白部分的树脂模具（13）固定在导电基板（11）上，化学成分由电子束，紫外线辐射或可见光辐射而变化，形成具有树脂模具（13）的层状结构（2）。将具有树脂模具（13）的层状结构（2）暴露于电子束，紫外线或可见光; 去除存在于树脂模具（13）的空缺部分的暴露的光敏聚合物（12c）; 并通过电铸将金属（14）填充到具有树脂模具（13）的层状结构（2）的空位部分上。

5. 发明申请

US20060276044A1 Method for manufacturing metal microstructure 失效
标题翻译：制造金属微观结构的方法
公开(公告)号：US20060276044A1
公开(公告)日：2006-12-07
申请号：US11503303
申请日：2006-08-14
申请人： Jun Yorita , Yoshihiro Hirata , Tsuyoshi Haga
发明人： Jun Yorita , Yoshihiro Hirata , Tsuyoshi Haga
IPC分类号： G03C5/00 , H01L21/302
CPC分类号： B81C99/0085 , B81C2201/032 , C25D1/003 , H01L21/4821 , H05K3/202 , H05K3/205
摘要： A method of manufacturing a metal microstructure (1) by using a resin mold (13). In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold (13) can be set and the high-precision metal microstructure (1) can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure (1) according to the present invention includes the steps of: fixing on a conductive substrate (11) the resin mold (13) having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer (12) having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure (2) having the resin mold (13); exposing the layered structure (2) having the resin mold (13) to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer (12c) existing at the vacant portion of the resin mold (13); and filling with a metal (14) the vacant portion of the layered structure (2) having the resin mold (13) by electroforming.
摘要翻译：一种通过使用树脂模具（13）制造金属微结构（1）的方法。为了提供可以设定对树脂模具（13）造成较小损害的温和制造条件并且可以通过均匀电铸来大量生产高精度金属微结构（1）的方法，制造根据本发明的金属微结构（1）包括以下步骤：通过插入具有一个或多个金属微结构（1）的光敏聚合物（12）将具有穿过厚度方向的空白部分的树脂模具（13）固定在导电基板（11）上，化学成分由电子束，紫外线辐射或可见光辐射而变化，形成具有树脂模具（13）的层状结构（2）。将具有树脂模具（13）的层状结构（2）暴露于电子束，紫外线或可见光; 去除存在于树脂模具（13）的空缺部分的曝光的光敏聚合物（12c）; 并通过电铸将金属（14）填充到具有树脂模具（13）的层状结构（2）的空位部分上。

6. 发明申请

US20050025412A1 Optical switch 审中-公开
标题翻译：光开关
公开(公告)号：US20050025412A1
公开(公告)日：2005-02-03
申请号：US10480300
申请日：2002-05-29
申请人： Yoshihiro Hirata , Kousuke Miura , Hiroshi Okuyama , Tomohiko Kanie , Tomomi Sano , Toshiyuki Numazawa
发明人： Yoshihiro Hirata , Kousuke Miura , Hiroshi Okuyama , Tomohiko Kanie , Tomomi Sano , Toshiyuki Numazawa
IPC分类号： G02B6/35 , G02B6/26
CPC分类号： G02B6/3514 , G02B6/3546 , G02B6/355 , G02B6/3566 , G02B6/3584
摘要： The optical switch comprises a platform, and an optical fiber is held in a V groove for securing optical fiber of this platform. A switch element is placed on the platform. The switch element has a frame, and a plurality of alignment pins which are supplied together with the platform are disposed on the bottom face of the frame. A cantilever is secured to the frame, and a mirror is installed at the tip section of the cantilever. A pair of electrodes are secured on the platform. And by supplying voltage between the electrode and cantilever and generating an electrostatic force between them, the mirror is vertically moved.
摘要翻译：光开关包括平台，光纤保持在V槽中，用于固定该平台的光纤。开关元件放置在平台上。开关元件具有框架，并且与框架一起供应的多个对准销设置在框架的底面上。悬臂固定在框架上，反光镜安装在悬臂的末端部分。一对电极固定在平台上。并且通过在电极和悬臂之间提供电压并在它们之间产生静电力，反射镜被垂直移动。

7. 发明授权

US06228318B1 Manufacturing method of ceramics component having microstructure 有权
标题翻译：具有微结构的陶瓷部件的制造方法
公开(公告)号：US06228318B1
公开(公告)日：2001-05-08
申请号：US09533374
申请日：2000-03-22
申请人： Kazuo Nakamae , Yoshihiro Hirata
发明人： Kazuo Nakamae , Yoshihiro Hirata
IPC分类号： B28B300
CPC分类号： B28B1/008 , B28B3/00
摘要： In a method for manufacturing ceramic components, a resin mold is initially filled with a paste containing a ceramic material. Next, a ceramic powder is applied on the paste. The ceramic powder and paste are then press-formed and removed from the resin mold. Finally, the ceramic powder and paste are baked. The method allows manufacturing of ceramic components having a microstructure without collapse. Additionally, ceramic components having a large area can be manufactured without warping.
摘要翻译：在陶瓷部件的制造方法中，首先用含有陶瓷材料的糊料填充树脂模具。接下来，将陶瓷粉末涂在糊状物上。然后将陶瓷粉末和糊料压制成型并从树脂模具中取出。最后，陶瓷粉末和糊状物被烘烤。该方法允许制造具有微结构而不塌陷的陶瓷部件。此外，可以制造具有大面积的陶瓷部件而不翘曲。

8. 发明申请

US20080088050A1 Processing Method,Processing Apparatus And Microstructure Manufactured In Accordance With This Method 审中-公开
标题翻译：加工方法，加工装置和微结构按照这种方法制造
公开(公告)号：US20080088050A1
公开(公告)日：2008-04-17
申请号：US11665473
申请日：2005-11-18
申请人： Jun Yorita , Yoshihiro Hirata
发明人： Jun Yorita , Yoshihiro Hirata
IPC分类号： C04B35/00
CPC分类号： B41J2/1631 , B01D39/1692 , B26F1/24 , B29C43/003 , B29C43/021 , B29C2043/025 , B41J2/162 , B41J2/1625 , B41J2/1629 , B41J2/1632 , B41J2/1637 , B41J2/1642 , B41J2/1646 , H05K3/005 , H05K2201/0129 , H05K2203/0108 , H05K2203/1105 , H05K2203/1189
摘要： In order to provide a processing method according to which a highly precise microstructure can be easily formed with low manufacturing cost, the present invention is characterized by comprising the steps of: placing a thin film made of a resin between a pressing die and a facing base; heating the thin film made of a resin between a pressing die and a facing base to a temperature that is no lower than the temperature at which the resin starts being liquefied; and applying pressure to the thin film made of a resin between a pressing die and a facing base at a temperature that is no lower than the temperature at which the resin starts being liquefied, so that a through hole is formed.
摘要翻译：为了提供一种能够以低制造成本容易地形成高精度微结构的加工方法，本发明的特征在于包括以下步骤：将由树脂制成的薄膜放置在压模和面对基座之间 ; 在压模和面对基座之间加热由树脂制成的薄膜至不低于树脂开始液化的温度的温度; 并且在不低于树脂开始液化温度的温度下对由压模和面对基部之间的树脂制成的薄膜施加压力，从而形成通孔。

9. 发明授权

US6129559A Microconnector and method of manufacturing the same 失效
标题翻译：微型连接器及其制造方法
公开(公告)号：US6129559A
公开(公告)日：2000-10-10
申请号：US788889
申请日：1997-01-21
申请人： Yoshihiro Hirata , Tsuyoshi Haga
发明人： Yoshihiro Hirata , Tsuyoshi Haga
IPC分类号： B81C1/00 , H01L23/48 , H01R13/62 , H05K3/40 , H01R1/00
CPC分类号： H01R13/6205 , H01L24/72 , H01R12/57 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H05K3/4007 , H05K3/4092 , Y10T29/42
摘要： A microconnector provides a practically sufficient strength, and has an arrangement in which structures of electrode members and guiding members can be designed at least somewhat independently of each other for allowing a simple connecting operation. In a male connector, wiring layers are formed on a substrate, and male pin connector electrodes project from the wiring layers, whereby the electrodes are two-dimensionally arranged and enclosed with spacers. In a female connector, on the other hand, wiring layers are formed on a substrate, and female connector electrodes are formed on single ends of the wiring layers respectively. The female connector electrodes comprise holes for receiving the pin electrodes, and are arranged in correspondence to the pin electrodes. The female connector electrodes each having a spring characteristic and are enclosed with spacers. The male and female connectors are electrically connected with each other by superposing the substrates with each other while orienting electrode surfaces thereof to be opposed to each other. The pin electrodes and the female connector electrodes are naturally aligned and brought into engagement with each other due to attraction of magnetic layers formed on the male and female connectors respectively.
摘要翻译：微连接器提供实际上足够的强度，并且具有这样的布置，其中电极构件和引导构件的结构可以至少部分地彼此设计以允许简单的连接操作。在阳连接器中，布线层形成在基板上，并且阳引脚连接电极从布线层突出，由此电极被二维布置并用隔离物包围。另一方面，在阴连接器中，布线层形成在基板上，并且阴连接器电极分别形成在布线层的单个端部上。阴连接器电极包括用于接收针电极的孔，并且与针电极相对应地布置。阴连接器电极各自具有弹簧特性并且被间隔件包围。阳连接器和母连接器通过将基板彼此叠置同时将其电极表面定向成彼此相对而彼此电连接。引脚电极和阴连接器电极由于分别形成在阳连接器和阴连接器上的磁性层的吸引而自然对准并彼此接合。

10. 发明授权

US07432726B2 Probe 失效
标题翻译：探测
公开(公告)号：US07432726B2
公开(公告)日：2008-10-07
申请号：US10553064
申请日：2004-04-13
申请人： Tetsuji Ueno , Yoshihiro Hirata , Kazunori Okada , Kazunori Kawase
发明人： Tetsuji Ueno , Yoshihiro Hirata , Kazunori Okada , Kazunori Kawase
IPC分类号： G01R31/02
CPC分类号： G01R1/06733
摘要： According to an embodiment, a probe coming into contact with an electrode pad of a measurement object comprises a connection terminal part integrally formed and connected to a substrate, a contact part having a tapered configuration, and a supporting part which supports the contact part. The contact part extending from an end of the supporting part has a sectional configuration which shares at least one side face with the supporting part.
摘要翻译：根据实施例，与测量对象的电极焊盘接触的探针包括一体形成并连接到基板的连接端子部分，具有锥形构造的接触部分和支撑接触部分的支撑部件。从支撑部的端部延伸的接触部具有与支撑部分共享至少一个侧面的截面构造。

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