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    • 1. 发明授权
    • Method of pattern formation
    • 图案形成方法
    • US4434224A
    • 1984-02-28
    • US343908
    • 1982-01-29
    • Akira YoshikawaAkitsu TakedaOsamu OchiTomoko HisakiYoshihiko Mizushima
    • Akira YoshikawaAkitsu TakedaOsamu OchiTomoko HisakiYoshihiko Mizushima
    • H01L21/306G03F7/00H01L21/027H01L21/266H01L21/302H01L21/3065H01L21/314G03C5/00
    • H01L21/314G03F7/0035H01L21/0271H01L21/266H01L21/302
    • In a method of pattern formation according to this invention, an organic polymer resist material is simultaneously used with an inorganic resist material, i.e., a first desired pattern consisting of the organic polymer resist material layer is formed on a substrate material, then the whole surface thereof is covered with the inorganic resist material layer, a second desired pattern is then formed with the inorganic resist material layer, and then the resulting second desired pattern is transferred to the organic polymer resist material. According to the invention, mask alignment can automatically be effected by detecting reflected light from an alignment mark on the substrate, formation of a relief including large and small patterns is also easily carried out, throughput can also be increased. The method of the invention may be combined with various process steps, so that such combined method is applicable for deep and shallow etching, formation of an interlayer insulation film, and lift-off method.
    • 在根据本发明的图案形成方法中,有机聚合物抗蚀剂材料与无机抗蚀剂材料同时使用,即,由有机聚合物抗蚀剂材料层组成的第一所需图案形成在基底材料上,然后整个表面 用无机抗蚀剂材料层覆盖,然后用无机抗蚀剂材料层形成第二所需图案,然后将得到的第二所需图案转印到有机聚合物抗蚀剂材料上。 根据本发明,通过检测来自基板上的对准标记的反射光可以自动实现掩模对准,也容易进行包括大小图案的浮雕的形成,也可以提高生产量。 本发明的方法可以与各种工艺步骤组合,使得这种组合方法适用于深浅蚀刻,层间绝缘膜的形成和剥离方法。
    • 2. 发明授权
    • Doping from a photoresist layer
    • 从光致抗蚀剂层掺杂
    • US4350541A
    • 1982-09-21
    • US174275
    • 1980-07-31
    • Yoshihiko MizushimaAkitsu TakedaAkira YoshikawaOsamu OchiTomoko Hisaki
    • Yoshihiko MizushimaAkitsu TakedaAkira YoshikawaOsamu OchiTomoko Hisaki
    • G03F7/004H01L21/314H01L21/225
    • H01L21/314G03F7/0044Y10S438/93
    • A method for fabricating semiconductor devices comprising the steps of: forming on the main surface of a semiconductor substrate an inorganic photoresist layer having a first amorphous layer, which contains Se as a matrix component and includes an impurity for providing one conductivity type and a second silver, or a silver containing layer, formed on the first layer; exposing the inorganic photoresist layer with an exposure pattern; developing the exposed inorganic photoresist layer to form a patterned impurity containing inorganic photoresist layer as an impurity source layer; forming a heat resistive overcoating layer on the main surface of the semiconductor substrate, while covering the impurity source layer; and forming a doped region by diffusing impurity from the impurity source layer into a region of the substrate underlying the impurity source layer. The heat resistive overcoating layer may be an insulation layer having a window through which a conductive layer is connected to the doped region and is extended over the overcoating layer. The doped region is formed readily and accurately with relatively few process steps and with a pattern corresponding to an exposure pattern for the inorganic photoresist layer. The diffusion of the impurity from the impurity source layer into the substrate is accurately controlled so as to provide the doped region with a desired impurity concentration. Moreover, the evaporation of the impurity into the atmosphere during processing is minimized.
    • 一种制造半导体器件的方法,包括以下步骤:在半导体衬底的主表面上形成具有第一非晶层的无机光致抗蚀剂层,所述第一非晶层包含Se作为基质成分并且包括用于提供一种导电类型的杂质和第二银 或含银层,形成在第一层上; 以曝光图案曝光无机光致抗蚀剂层; 显影曝光的无机光致抗蚀剂层以形成含有无机光致抗蚀剂层作为杂质源层的图案化杂质; 在半导体衬底的主表面上形成耐热性外涂层,同时覆盖杂质源层; 以及通过将杂质从杂质源层扩散到位于杂质源层下面的衬底的区域中而形成掺杂区域。 耐热外涂层可以是具有窗口的绝缘层,导电层通过该窗口连接到掺杂区域并且在外涂层上延伸。 通过相对较少的工艺步骤并且具有对应于无机光致抗蚀剂层的曝光图案的图案容易且准确地形成掺杂区域。 将杂质从杂质源层扩散到衬底中被精确地控制,以便为掺杂区域提供所需的杂质浓度。 此外,在处理期间将杂质蒸发到大气中被最小化。
    • 5. 发明授权
    • Air cycling type air-conditioner
    • 空气循环式空调
    • US06301922B1
    • 2001-10-16
    • US09509581
    • 2000-03-29
    • Osamu Ochi
    • Osamu Ochi
    • F25D900
    • F24F5/0085F24F2003/144F25B9/004F25B13/00F25B2313/02743F25B2400/14
    • An air cycling type air-conditioner includes: a heat exchanger (3); a compressor (1) compressing suction air and transferring the compressed air to the heat exchanger (3), and compressing air transferred from the heat exchanger (3) and transferring the compressed air as supply air; an expander (4) expanding the suction air and transferring the expanded air to the heat exchanger (3), and expanding air transferred from the heat exchanger (3) and transferring the expanded air as the supply air; and a motor (2) driving the compressor (1) and the expander (4). The air-conditioner further includes: a dehumidifier (10) dehumidifying the suction air; a first temperature and humidity measuring unit (12) measuring the temperature and humidity of the suction air; and a control unit (14) calculating the amount of dehumidification on the basis of the temperature and humidity measured by the first temperature and humidity measuring unit (12) and requested temperature and humidity, and controlling the dehumidifier (10) based on the calculated amount of dehumidification. The suction air is dehumidified by the dehumidifier (10) during the room cooling operation, so that the water is prevented from being condensed even when the temperature of the air is lowered by the heat exchanger (3) and the expander (4). Thus, the efficiency of the air-conditioner as a whole is improved.
    • 空调循环型空调包括:热交换器(3); 压缩机(1),压缩吸入空气并将压缩空气传送到热交换器(3),并压缩从热交换器(3)传送的空气并将压缩空气作为供给空气传送; 膨胀器(4)使吸入空气膨胀并将膨胀空气传递到热交换器(3),并且膨胀从热交换器(3)传送的空气并将膨胀空气作为供给空气传送; 以及驱动压缩机(1)和膨胀机(4)的马达(2)。 该空调还包括:除湿机(10)对吸入空气进行除湿; 第一温度和湿度测量单元(12),测量吸入空气的温度和湿度; 以及控制单元(14),其基于由所述第一温湿度测量单元(12)测量的温度和湿度以及要求的温度和湿度来计算除湿量,并且基于所计算的量来控制除湿器(10) 的除湿。 吸入空气在室内制冷运转时由除湿器(10)除湿,即使当热交换器(3)和膨胀机(4)降低空气的温度时,防止水被冷凝。 因此,空气调节器整体的效率提高。