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    • 8. 发明授权
    • Processing unit for substrate manufacture
    • 用于基板制造的处理单元
    • US06247245B1
    • 2001-06-19
    • US09321542
    • 1999-05-28
    • Katsumi Ishii
    • Katsumi Ishii
    • F26B2106
    • H01L21/67757H01L21/67769H01L21/67778Y10S414/138Y10S414/14
    • A processing unit for a substrate has a vertical thermal processing furnace 4 having a bottom and an opening provided at the bottom. A boat holding substrates in vertical multistairs can be placed on a first lid, and the first lid can open and close the opening of the vertical thermal processing furnace with the boat placed thereon. The processing unit also has a boat-placing portion on which the boat and another boat can be placed and a boat conveying mechanism for conveying the two boats alternatively between the boat-placing portion and the first lid. A second lid hermetically closes the opening of the vertical thermal processing furnace when the first lid opens the opening but no boat passes through the opening. The processing unit can effectively reduce the undesirable influence from the opening when the first lid is taken off from the opening and the boat is conveyed out, and can also reduce the wasted energy by preventing the fall of the temperature in the interior of the thermal processing furnace.
    • 用于基板的处理单元具有垂直热处理炉4,其具有设置在底部的底部和开口。 在垂直多层板上保持基板的船可以放置在第一盖上,并且第一盖可以放置在其上的船打开和关闭垂直热处理炉的开口。 处理单元还具有可以放置船和另一船的船放置部分,以及用于在船放置部分和第一盖之间交替地输送两船的船运输机构。 当第一盖打开开口但没有船通过开口时,第二盖气密地封闭垂直热处理炉的开口。 处理单元可以有效地减少当第一盖从开口取出并且船被输出时从开口的不期望的影响,并且还可以通过防止热处理的内部温度的下降来减少浪费的能量 炉。
    • 10. 发明授权
    • Wafer container and wafer aligning apparatus
    • 晶圆容器和晶圆对准装置
    • US5468112A
    • 1995-11-21
    • US131391
    • 1993-10-05
    • Katsumi IshiiMasao Takikawa
    • Katsumi IshiiMasao Takikawa
    • H01L21/673H01L21/677G01P13/00
    • H01L21/68H01L21/6732H01L21/67769Y10S414/136Y10S414/137Y10S414/139Y10S414/14
    • A container for storing a plurality of semiconductor wafers comprises two end walls and two side walls. The container has a main opening through which the wafers are inserted into or withdrawn from the container and a sub-opening through which a wafer counter approaches the wafers. A plurality of slots are formed in the container to hold the wafers one by one at intervals. Each slot includes a pair of grooves which are formed in inner surfaces of both the side walls, have a V-shaped cross-section, and which divergently open toward a central portion of the container. One surface of each groove serves as a supporting surface on which a wafer is disposed substantially horizontal when the container is positioned such that the reference plane is horizontal. The supporting surfaces of the pair of grooves have a pair of converging portions which converge toward the second opening. A filling body, having an inner surface which is brought into contact with an edge portion of a wafer, is provided in each converging portion near the sub-opening. The inner surface of the filling body is determined so as to restrict a position of the wafer, such that the wafer can be positioned at the same height of the supporting surfaces of the pair of grooves.
    • 用于存储多个半导体晶片的容器包括两个端壁和两个侧壁。 容器具有主开口,晶片通过该主开口插入或从容器中取出,以及子开口,晶片计数器通过该子开口接近晶片。 在容器中形成多个槽,以间隔地一个一个地保持晶片。 每个狭槽包括形成在两个侧壁的内表面中的一对凹槽,其具有V形横截面,并且朝向容器的中心部分向外敞开。 每个槽的一个表面用作支撑表面,当容器定位成使得参考平面是水平的时,晶片在该支撑表面上基本上水平布置。 一对槽的支撑面具有朝向第二开口会聚的一对会聚部。 在子开口附近的每个会聚部分设置有具有与晶片的边缘部分接触的内表面的填充体。 确定填充体的内表面以限制晶片的位置,使得晶片可以位于一对槽的支撑表面的相同高度处。