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1. 发明授权

US07642646B2 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07642646B2
公开(公告)日：2010-01-05
申请号：US11050698
申请日：2005-02-07
申请人： Yoshifumi Nakamura , Takayuki Tanaka
发明人： Yoshifumi Nakamura , Takayuki Tanaka
IPC分类号： H01L23/489
CPC分类号： H01L24/12 , H01L24/03 , H01L24/05 , H01L24/11 , H01L2224/03 , H01L2224/0401 , H01L2224/05093 , H01L2224/05557 , H01L2224/05624 , H01L2224/05644 , H01L2224/13019 , H01L2224/13099 , H01L2224/85424 , H01L2224/85444 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2224/45099
摘要： A semiconductor device is configured such that an electrode pad connected to an internal circuit is formed on a surface of a semiconductor substrate, wires are formed near and around the electrode pad, a protective film is formed which covers the edge of the electrode pad, the wires, and the surface of the semiconductor substrate, and a metal bump is formed on the electrode pad such that the edge of the electrode is disposed on the protective film on the wires. According to this configuration, since the wires are formed near the electrode pad, the protective film covering the edge of the electrode pad and an area around the edge is formed relatively flat, and the metal bump has a flat surface on a convex portion formed on the relatively flat protective film. Therefore, even when the electrode pad is small, a flat area can be sufficiently obtained on the surface of the metal bump, thereby obtaining stable connection via an anisotropic conductive sheet or the like by COG.
摘要翻译：半导体器件被配置为使得在半导体衬底的表面上形成连接到内部电路的电极焊盘，在电极焊盘的附近和周围形成电线，形成覆盖电极焊盘的边缘的保护膜，电线和半导体衬底的表面，并且在电极焊盘上形成金属凸块，使得电极的边缘设置在电线上的保护膜上。根据该结构，由于在电极焊盘附近形成电线，覆盖电极焊盘的边缘的保护膜和边缘周围的区域形成得相对平坦，并且金属凸块在形成在凸部上的平坦表面相对平坦的保护膜。因此，即使当电极焊盘小时，也可以在金属凸块的表面上充分获得平坦的面积，从而通过COG经由各向异性导电片等获得稳定的连接。

2. 发明授权

US07442074B2 Wiring board and method for producing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US07442074B2
公开(公告)日：2008-10-28
申请号：US11558706
申请日：2006-11-10
申请人： Nozomi Shimoishizaka , Nobuyuki Koutani , Kouichi Nagao , Michiharu Torii , Yoshifumi Nakamura , Takayuki Tanaka
发明人： Nozomi Shimoishizaka , Nobuyuki Koutani , Kouichi Nagao , Michiharu Torii , Yoshifumi Nakamura , Takayuki Tanaka
IPC分类号： H01R12/24
CPC分类号： H05K3/242 , H01L2924/0002 , H05K3/0097 , H05K2201/094 , H05K2203/1545 , H01L2924/00
摘要： A wiring board includes first and second feeding electrodes (2, 3) provided along both sides of an insulating substrate (1), feeding bus lines (4) extending in a traverse direction and connected to both the feeding electrodes, and conductor wirings (6, 8, 12) having one side terminals forming inner leads having protruding electrodes (9, 11, 13) and the other side terminals connected to the feeding bus lines. The inner leads in each unit region are arranged in two lines extending in the traverse direction. The inner leads of a first group are arranged with a dense wiring pitch, and the inner leads of a second group include a dense pitch region in which a wiring pitch is the same as that of the inner leads of the first group, and a sparse pitch region in which a wiring pitch is longer than that of the inner leads of the first group. The inner leads (6) of the first group and the inner leads (12) in the dense pitch region of the second group are connected to the feeding bus line on one side of each region, and the inner leads (8) in the sparse pitch region of the second group are connected to the feeding bus line on the other side of each unit region. Non-uniformity of heights of the protruding electrodes due to a difference in the wiring pitches of the inner leads can be suppressed easily.
摘要翻译：布线板包括沿着绝缘基板（1）的两侧设置的第一和第二馈送电极（2,3），馈送沿横向方向延伸并连接到馈电电极的总线（4）和导体布线（6），8,12），其一个端子形成具有突出电极（9,11,13）的内部引线，另一个侧端子连接到馈电总线。每个单元区域中的内引线布置成沿横向方向延伸的两条线。第一组的内部引线布置成具有致密的布线间距，并且第二组的内部引线包括密集的间距区域，其中布线间距与第一组的内部引线相同，并且稀疏其中布线间距比第一组的内引线长的间距区域。第一组的内部引线（6）和第二组的密集间隔区域中的内部引线（12）在每个区域的一侧连接到馈电总线，并且内部引线（8）在稀疏第二组的音调区域连接到每个单元区域的另一侧的馈送总线。可以容易地抑制由于内部引线的布线间距的差异导致的突出电极的高度的不均匀性。

3. 发明申请

US20080136025A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20080136025A1
公开(公告)日：2008-06-12
申请号：US12068066
申请日：2008-02-01
申请人： Yoshifumi Nakamura , Junichi Ueno , Hiroyuki Imamura , Takayuki Tanaka
发明人： Yoshifumi Nakamura , Junichi Ueno , Hiroyuki Imamura , Takayuki Tanaka
IPC分类号： H01L23/48
CPC分类号： H01L24/10 , H01L23/49838 , H01L23/4985 , H01L24/13 , H01L2224/05001 , H01L2224/05026 , H01L2224/05144 , H01L2224/05147 , H01L2224/05571 , H01L2224/05572 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15173 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor device in accordance with the present invention is a mounted body of a semiconductor chip with a plurality of electrode pads arranged in a plurality of stages and a tape wiring board, the average pitch of the electrode pads on the entire semiconductor chip can be reduced, while ensuring stable connectivity, by leading together to the outside of the semiconductor chip two or more wirings of the tape wiring board connected to the electrode pads on the inner side between the electrode pads arranged in a row on the outer periphery of the semiconductor chip.
摘要翻译：根据本发明的半导体器件是具有多个布置在多个级中的多个电极焊盘的半导体芯片的安装体和带状布线板，可以减少整个半导体芯片上的电极焊盘的平均间距同时确保稳定的连接性，通过将半导体芯片的外部引导到与半导体芯片的外周排列成一排的电极焊盘之间的内侧的电极焊盘连接的带状配线基板的两条或更多条布线。

4. 发明申请

US20050173798A1 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050173798A1
公开(公告)日：2005-08-11
申请号：US11050698
申请日：2005-02-07
申请人： Yoshifumi Nakamura , Takayuki Tanaka
发明人： Yoshifumi Nakamura , Takayuki Tanaka
IPC分类号： H01L21/60 , H01L21/44 , H01L23/48 , H01L23/485
CPC分类号： H01L24/12 , H01L24/03 , H01L24/05 , H01L24/11 , H01L2224/03 , H01L2224/0401 , H01L2224/05093 , H01L2224/05557 , H01L2224/05624 , H01L2224/05644 , H01L2224/13019 , H01L2224/13099 , H01L2224/85424 , H01L2224/85444 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2224/45099
摘要： A semiconductor device is configured such that an electrode pad connected to an internal circuit is formed on a surface of a semiconductor substrate, wires are formed near and around the electrode pad, a protective film is formed which covers the edge of the electrode pad, the wires, and the surface of the semiconductor substrate, and a metal bump is formed on the electrode pad such that the edge of the electrode is disposed on the protective film on the wires. According to this configuration, since the wires are formed near the electrode pad, the protective film covering the edge of the electrode pad and an area around the edge is formed relatively flat, and the metal bump has a flat surface on a convex portion formed on the relatively flat protective film. Therefore, even when the electrode pad is small, a flat area can be sufficiently obtained on the surface of the metal bump, thereby obtaining stable connection via an anisotropic conductive sheet or the like by COG.
摘要翻译：半导体器件被配置为使得在半导体衬底的表面上形成连接到内部电路的电极焊盘，在电极焊盘的附近和周围形成电线，形成覆盖电极焊盘的边缘的保护膜，电线和半导体衬底的表面，并且在电极焊盘上形成金属凸块，使得电极的边缘设置在电线上的保护膜上。根据该结构，由于在电极焊盘附近形成电线，覆盖电极焊盘的边缘的保护膜和边缘周围的区域形成得相对平坦，并且金属凸块在形成在凸部上的平坦表面相对平坦的保护膜。因此，即使当电极焊盘小时，也可以在金属凸块的表面上充分获得平坦的面积，从而通过COG经由各向异性导电片等获得稳定的连接。

5. 发明申请

US20050263885A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20050263885A1
公开(公告)日：2005-12-01
申请号：US11137356
申请日：2005-05-26
申请人： Yoshifumi Nakamura , Junichi Ueno , Hiroyuki Imamura , Takayuki Tanaka
发明人： Yoshifumi Nakamura , Junichi Ueno , Hiroyuki Imamura , Takayuki Tanaka
IPC分类号： H01L23/485 , H01L23/495 , H01L23/498
CPC分类号： H01L24/10 , H01L23/49838 , H01L23/4985 , H01L24/13 , H01L2224/05001 , H01L2224/05026 , H01L2224/05144 , H01L2224/05147 , H01L2224/05571 , H01L2224/05572 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15173 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor device in accordance with the present invention is a mounted body of a semiconductor chip with a plurality of electrode pads arranged in a plurality of stages and a tape wiring board, the average pitch of the electrode pads on the entire semiconductor chip can be reduced, while ensuring stable connectivity, by leading together to the outside of the semiconductor chip two or more wirings of the tape wiring board connected to the electrode pads on the inner side between the electrode pads arranged in a row on the outer periphery of the semiconductor chip.
摘要翻译：根据本发明的半导体器件是具有多个布置在多个级中的多个电极焊盘的半导体芯片的安装体和带状布线板，可以减少整个半导体芯片上的电极焊盘的平均间距同时确保稳定的连接性，通过将半导体芯片的外部引导到与半导体芯片的外周排列成一排的电极焊盘之间的内侧的电极焊盘连接的带状配线基板的两条或更多条布线。

6. 发明授权

US07851904B2 Semiconductor device, method for manufacturing the same, and semiconductor device mounting structure 有权
标题翻译：半导体装置及其制造方法以及半导体装置安装结构
公开(公告)号：US07851904B2
公开(公告)日：2010-12-14
申请号：US11950625
申请日：2007-12-05
申请人： Yukihiro Kozaka , Yoshifumi Nakamura , Michinari Tetani
发明人： Yukihiro Kozaka , Yoshifumi Nakamura , Michinari Tetani
IPC分类号： H01L23/10 , H01L23/58
CPC分类号： H01L23/49572 , G02F1/13452 , H01L23/367 , H01L23/4006 , H01L24/12 , H01L24/50 , H01L24/75 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05655 , H01L2224/13144 , H01L2224/13155 , H01L2224/16 , H01L2224/291 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/75 , H01L2224/75301 , H01L2224/81205 , H01L2224/81801 , H01L2224/81805 , H01L2224/81894 , H01L2224/81895 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor device of the present invention includes: a wiring board 4 in which a conductive wiring 6 is formed on an insulating substrate 5 having an opening 5a; a semiconductor element 2 that has a circuit forming region 2a and an electrode pad 3, and is mounted on the wiring board with the circuit forming region facing the opening, the electrode pad being connected electrically to the conductive wiring via a protruding electrode 3a; a sealing resin 7 that covers the connected portion between the electrode pad and the conductive wiring; a heat dissipating member 9 that is disposed so as to have a portion facing the opening; and a filling material 8 that has a heat conductivity higher than that of the sealing resin, and is filled into the opening, so as to be in contact with the circuit forming region of the semiconductor element and the heat dissipating member. Even when the wiring board has a small area, heat dissipation efficiency can be ensured, and low cost manufacture can be achieved.
摘要翻译：本发明的半导体器件包括：布线基板4，在具有开口部5a的绝缘基板5上形成导电布线6; 具有电路形成区域2a和电极焊盘3的半导体元件2，并且安装在布线板上，电路形成区域面向开口，电极焊盘通过突出电极3a与导电布线电连接; 覆盖电极焊盘和导电布线之间的连接部分的密封树脂7; 散热构件9，其布置成具有面向开口的部分; 以及填充材料8，其具有比密封树脂的热导率高的热导率，并且填充到开口中，以便与半导体元件的电路形成区域和散热构件接触。即使布线板面积小，也能够确保散热效率，能够实现低成本的制造。

7. 发明申请

US20090091021A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090091021A1
公开(公告)日：2009-04-09
申请号：US12211364
申请日：2008-09-16
申请人： Yoshifumi Nakamura
发明人： Yoshifumi Nakamura
IPC分类号： H01L21/56 , H01L23/36
CPC分类号： H01L23/4985 , H01L21/563 , H01L21/565 , H01L23/3735 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/05567 , H01L2224/05573 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81191 , H01L2224/81801 , H01L2224/838 , H01L2224/92125 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/3025 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/05599
摘要： An insulating resin 4 is packed between a semiconductor chip 5 and a tape carrier 1, with taper portions 4a formed on the side faces, and a resin layer 7 is formed in close contact with the rear face of the semiconductor chip 5, the tape carrier 1, and the taper portions 4a; further, by forming a metal layer 9 having a depression 8 and formed with a shape enabling close contact with the resin layer 7, the metal layer 9, which functions as a heat spreader, can be fastened stably to the semiconductor chip 5, and moreover heat generated from the semiconductor chip 5 is transmitted efficiently not only from the rear face of the semiconductor chip 5 but from the side faces thereof to the metal layer 9 for heat dissipation, whereby heat dissipation can be improved.
摘要翻译：在半导体芯片5和带状载体1之间填充绝缘树脂4，在侧面形成有锥形部分4a，并且树脂层7形成为与半导体芯片5的背面紧密接触，带状载体 1和锥形部分4a; 此外，通过形成具有凹陷8并形成为能够与树脂层7紧密接触的形状的金属层9，可以将用作散热器的金属层9稳定地紧固到半导体芯片5，此外，从半导体芯片5产生的热量不仅从半导体芯片5的背面，而且从侧面到金属层9有效地传输散热，从而可以提高散热。

8. 发明授权

US07279357B2 Method for fabricating a chip-scale-packaging (CSP) having an inductor 有权
标题翻译：具有电感器的芯片级封装（CSP）的制造方法
公开(公告)号：US07279357B2
公开(公告)日：2007-10-09
申请号：US11122094
申请日：2005-05-05
申请人： Nozomi Shimoishizaka , Kazuyuki Kaino , Yoshifumi Nakamura , Keiji Miki , Kazumi Watase , Ryuichi Sahara
发明人： Nozomi Shimoishizaka , Kazuyuki Kaino , Yoshifumi Nakamura , Keiji Miki , Kazumi Watase , Ryuichi Sahara
IPC分类号： H01L21/311 , H01L21/3205 , H01L23/48
CPC分类号： H01L23/3114 , H01L23/5227 , H01L2224/0401 , H01L2224/05555 , H01L2924/3011 , H01L2924/00014
摘要： A semiconductor device has a semiconductor chip, a first insulating film and an inductor. The semiconductor chip includes an integrated circuit formed on the main surface of the chip and a plurality of pad electrodes formed on the main surface of the chip and electrically connected to the integrated circuit. The first insulating film of an insulating resin material is formed on the main surface of the semiconductor chip, covers the integrated circuit, and includes a plurality of contact holes provided on the respective pad electrodes. The inductor is formed on the inductor formation region of the first insulating film, and both terminals of the inductor are connected to the pad electrodes through the contact holes, respectively. The inductor formation region of the first insulating film is formed thicker than a portion of the first insulating film around the contact hole.
摘要翻译：半导体器件具有半导体芯片，第一绝缘膜和电感器。半导体芯片包括形成在芯片的主表面上的集成电路和形成在芯片的主表面上并电连接到集成电路的多个焊盘电极。绝缘树脂材料的第一绝缘膜形成在半导体芯片的主表面上，覆盖集成电路，并且包括设置在各个焊盘电极上的多个接触孔。电感器形成在第一绝缘膜的电感器形成区域上，并且电感器的两个端子分别通过接触孔连接到焊盘电极。第一绝缘膜的电感器形成区域形成为比接触孔周围的第一绝缘膜的一部分厚。

9. 发明授权

US06784557B2 Semiconductor device including a diffusion layer formed between electrode portions 有权
标题翻译：半导体器件包括在电极部分之间形成的扩散层
公开(公告)号：US06784557B2
公开(公告)日：2004-08-31
申请号：US10307450
申请日：2002-12-02
申请人： Yoshifumi Nakamura , Ryuichi Sahara , Nozomi Shimoishizaka , Kazuyuki Kainou , Keiji Miki , Kazumi Watase , Yasutake Yaguchi
发明人： Yoshifumi Nakamura , Ryuichi Sahara , Nozomi Shimoishizaka , Kazuyuki Kainou , Keiji Miki , Kazumi Watase , Yasutake Yaguchi
IPC分类号： H01L2348
CPC分类号： H01L24/13 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/05026 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/05548 , H01L2224/05557 , H01L2224/05571 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/114 , H01L2224/116 , H01L2224/13022 , H01L2224/13024 , H01L2224/13099 , H01L2224/131 , H01L2224/13147 , H01L2224/16 , H01L2224/81801 , H01L2924/0001 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/00012 , H01L2924/00014 , H01L2224/05552 , H01L2924/013
摘要： The semiconductor device includes a semiconductor element having an electrode formed on a surface thereof, and a metal wiring formed on the surface of the semiconductor element and electrically connected to the electrode. The metal wiring has an external electrode portion functioning as an external electrode. A thickness of the external electrode portion is greater than that of a non-electrode portion of the metal wiring, i.e., a portion of the metal wiring other than the external electrode portion.
摘要翻译：半导体器件包括在其表面上形成有电极的半导体元件和形成在半导体元件的表面上并与电极电连接的金属布线。金属布线具有用作外部电极的外部电极部分。外部电极部分的厚度大于金属布线的非电极部分的厚度，即除了外部电极部分之外的金属布线的一部分。

10. 发明授权

US06694613B2 Method for producing a printed-circuit board having projection electrodes 失效
标题翻译：一种具有突起电极的印刷电路板的制造方法
公开(公告)号：US06694613B2
公开(公告)日：2004-02-24
申请号：US09873461
申请日：2001-06-05
申请人： Yoshifumi Nakamura , Minehiro Itagaki , Hiroaki Takezawa , Yoshihiro Bessho , Tsukasa Shiraishi
发明人： Yoshifumi Nakamura , Minehiro Itagaki , Hiroaki Takezawa , Yoshihiro Bessho , Tsukasa Shiraishi
IPC分类号： H05K302
CPC分类号： H01L23/49811 , H01L21/4853 , H01L2924/0002 , H05K1/095 , H05K3/4007 , H05K3/4069 , H05K3/4614 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49126 , Y10T29/49149 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T428/24926 , H01L2924/00
摘要： A method for producing a printed-circuit board includes forming via holes that penetrate through a prepreg to whose surface a parting film is applied; filling the via holes with a conducting paste; compressing the prepreg under heat to cure the prepreg and the paste; and then peeling off the parting film. Thus, projection electrodes with a height corresponding to the thickness of the film are formed in a manner such that the projection electrodes are integrated with the via hole conductors.
摘要翻译：一种印刷电路板的制造方法，其特征在于，具有形成贯通预浸料坯的通孔，该预浸料坯具有分隔膜的表面，用导电膏填充通孔; 在加热下压制预浸料以固化预浸料和糊料; 然后剥离分离膜。因此，以使得突起电极与通孔导体一体化的方式形成具有与膜的厚度对应的高度的突起电极。

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